JP6124881B2 - 測定システム - Google Patents
測定システム Download PDFInfo
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- JP6124881B2 JP6124881B2 JP2014514048A JP2014514048A JP6124881B2 JP 6124881 B2 JP6124881 B2 JP 6124881B2 JP 2014514048 A JP2014514048 A JP 2014514048A JP 2014514048 A JP2014514048 A JP 2014514048A JP 6124881 B2 JP6124881 B2 JP 6124881B2
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- 238000005259 measurement Methods 0.000 claims description 197
- 230000003287 optical effect Effects 0.000 claims description 86
- 238000005286 illumination Methods 0.000 claims description 27
- 238000006073 displacement reaction Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 238000001459 lithography Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 74
- 235000012431 wafers Nutrition 0.000 description 53
- 210000001747 pupil Anatomy 0.000 description 27
- 238000003384 imaging method Methods 0.000 description 14
- 230000008901 benefit Effects 0.000 description 11
- 238000000691 measurement method Methods 0.000 description 9
- 238000007654 immersion Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
- G01M11/0257—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested
- G01M11/0264—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested by using targets or reference patterns
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/14—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
- G03F7/706—Aberration measurement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Environmental & Geological Engineering (AREA)
- Geometry (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
P(16)=D(SA)/(D(SA)+D(CR))>0.5、特にP(16)>0.7
(34条補正、下線は補正箇所)
Claims (14)
- EUV投影リソグラフィ用の投影露光装置(1)の少なくとも1つのコンポーネントを特性評価する測定システム(37)であって、
a.光学パラメータを測定する少なくとも1つの測定デバイス(16)と、
b.該少なくとも1つの測定デバイス(16)を位置決めする位置決めデバイス(30)と
を備え、
c.該位置決めデバイス(30)は、前記投影露光装置(1)の対物系(27)に変位可能に接続され、
前記位置決めデバイスは、前記対物系の光軸に対して横方向に変位可能である測定システム。 - EUV投影リソグラフィ用の投影露光装置(1)の対物系(27)であって、
a.少なくとも1つの光学コンポーネント(26)と、
b.該少なくとも1つの光学コンポーネント(26)を取り付ける対物系マウント(28)と、
c.少なくとも1つの測定デバイス(16)を保持する位置決めデバイス(30)と
を備え、
d.該位置決めデバイス(30)は前記対物系マウント(28)に接続され、
c.前記位置決めデバイス(30)は、前記測定デバイス(16)を変位させるために少なくとも1変位自由度を有し、
前記位置決めデバイスは、前記対物系の光軸に対して横方向に変位可能である対物系。 - 請求項2に記載の対物系(27)において、前記少なくとも1つの測定デバイス(16)は、前記対物系(27)のビーム経路の方向で最終光学コンポーネント(26)の後に配置されることを特徴とする対物系。
- 請求項2又は3に記載の対物系(17)において、前記位置決めデバイス(30)は、前記少なくとも1つの測定デバイス(16)が前記対物系(27)のビーム経路内の少なくとも1つの測定位置と、完全に前記対物系(27)のビーム経路外に配置される留置位置との間で変位可能であるよう構成されることを特徴とする対物系。
- 請求項2〜4のいずれか1項に記載の対物系(27)において、前記対物系(27)を較正するアクチュエータ(36)を特徴とし、該アクチュエータ(36)は、前記少なくとも1つの測定デバイス(16)にデータ伝送可能に接続することができる対物系。
- 請求項2〜5のいずれか1項に記載の対物系(27)において、前記位置決めデバイス(30)は、磁場と相互作用しないことを特徴とする対物系。
- 請求項2〜6のいずれか1項に記載の対物系(27)において、真空チャンバ(29)内に配置されることを特徴とする対物系。
- 請求項2〜7のいずれか1項に記載の対物系(27)において、前記位置決めデバイス(39)及び/又は前記対物系(27)に作用する可変力を補償する少なくとも1つの変位可能なカウンタウェイト(52)を特徴とする対物系。
- 物体視野(5)を像視野(10)に投影する投影光学ユニット(9)であって、
a.請求項2〜8のいずれか1項に記載の対物系(27)
を備える投影光学ユニット。 - EUV投影リソグラフィ用の投影露光装置(1)であって、
a.照明系(2)と、
b.請求項9に記載の投影光学ユニット(9)と
を備える投影露光装置。 - 変位可能なウェーハホルダ(13)を備える請求項10に記載の投影露光装置(1)において、少なくとも1つの測定デバイス(16)を位置決めする位置決めデバイス(30)が、前記ウェーハホルダ(13)とは無関係に変位可能であることを特徴とする投影露
光装置。 - EUV投影リソグラフィ用の投影露光装置(1)の少なくとも1つのコンポーネントを特性評価する方法であって、
請求項10又は11に記載の投影露光装置(1)を設けるステップと、
位置決めデバイス(30)により対物系(27)に対して位置決めされる少なくとも1つの測定デバイス(16)を設けるステップと、
該少なくとも1つの測定デバイス(16)により、前記投影露光装置(1)の少なくとも1つのコンポーネントを特性評価する少なくとも1つのパラメータを測定するステップと
を含む方法。 - 請求項12に記載の方法において、前記少なくとも1つのパラメータを測定するステップをウェーハ(12)の露光と同時に行うことを特徴とする方法。
- 微細構造コンポーネントを製造する方法であって、
請求項10又は11に記載の投影露光装置(1)を設けるステップと、
レチクル(7)を設けるステップと、
照明光(14)に対して感光性のコーティングを有するウェーハ(12)を設けるステップと、
前記投影露光装置(1)を用いて前記レチクル(7)の少なくとも一部を前記ウェーハ(12)に投影するステップと、
前記ウェーハ(12)上の露光されたコーティングを現像するステップと
を含む方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161494678P | 2011-06-08 | 2011-06-08 | |
DE102011077223.5 | 2011-06-08 | ||
US61/494,678 | 2011-06-08 | ||
DE102011077223A DE102011077223B4 (de) | 2011-06-08 | 2011-06-08 | Messsystem |
PCT/EP2012/060649 WO2012168272A1 (en) | 2011-06-08 | 2012-06-06 | Measuring system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014517533A JP2014517533A (ja) | 2014-07-17 |
JP6124881B2 true JP6124881B2 (ja) | 2017-05-10 |
Family
ID=47220381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014514048A Active JP6124881B2 (ja) | 2011-06-08 | 2012-06-06 | 測定システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US9482968B2 (ja) |
JP (1) | JP6124881B2 (ja) |
KR (1) | KR102014551B1 (ja) |
CN (1) | CN103608729B (ja) |
DE (1) | DE102011077223B4 (ja) |
WO (1) | WO2012168272A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2513927A (en) * | 2013-05-10 | 2014-11-12 | Zeiss Carl Smt Gmbh | Optical element arrangement with an optical element split into optical sub-elements |
DE102013214008A1 (de) * | 2013-07-17 | 2015-01-22 | Carl Zeiss Smt Gmbh | Optikanordnung |
DE102013218991A1 (de) | 2013-09-20 | 2015-03-26 | Carl Zeiss Smt Gmbh | Vorrichtung zum Bestimmen einer optischen Eigenschaft eines optischen Abbildungssystems |
KR101875813B1 (ko) | 2013-11-05 | 2018-07-06 | 에이에스엠엘 네델란즈 비.브이. | 특성화 방법, 모델 형성 방법, 시뮬레이션 방법, 마스크 제조 방법 및 디바이스 제조 방법 |
DE102014207894B4 (de) | 2014-04-28 | 2018-03-29 | Carl Zeiss Ag | Beleuchtungsoptik, Messsystem zur Charakterisierung mindestens einer Komponente einer Belichtungsanlage sowie Verfahren zur Charakterisierung mindestens einer Komponente einer Belichtungsanlage |
DE102017117413B4 (de) * | 2017-08-01 | 2019-11-28 | Precitec Gmbh & Co. Kg | Verfahren zur optischen Messung der Einschweißtiefe |
DE102017216679A1 (de) * | 2017-09-20 | 2019-03-21 | Carl Zeiss Smt Gmbh | Mikrolithographische Projektionsbelichtungsanlage |
DE102017217251A1 (de) * | 2017-09-27 | 2019-03-28 | Carl Zeiss Smt Gmbh | Verfahren und Anordnung zur Analyse der Wellenfrontwirkung eines optischen Systems |
Family Cites Families (20)
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JPS636511A (ja) * | 1986-06-27 | 1988-01-12 | Hitachi Ltd | 自動焦点調整装置 |
US4790642A (en) * | 1986-12-01 | 1988-12-13 | Gca Corporation/Tropel Division | Integrated metrology for microlithographic objective reducing lens |
JPH06151278A (ja) * | 1992-11-04 | 1994-05-31 | Hitachi Ltd | 焦点位置検出方法及び焦点位置合わせ方法 |
JPH09223657A (ja) * | 1996-02-16 | 1997-08-26 | Nikon Corp | 結像特性測定装置及び該装置を備えた露光装置 |
JP2000505958A (ja) | 1996-12-24 | 2000-05-16 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 2個の物品ホルダを有する二次元バランス位置決め装置及びこの位置決め装置を有するリソグラフ装置 |
JPH11233416A (ja) * | 1998-02-17 | 1999-08-27 | Nikon Corp | X線投影露光装置 |
JPH11238666A (ja) * | 1998-02-19 | 1999-08-31 | Nikon Corp | X線投影露光装置 |
US6859515B2 (en) | 1998-05-05 | 2005-02-22 | Carl-Zeiss-Stiftung Trading | Illumination system, particularly for EUV lithography |
TW550377B (en) | 2000-02-23 | 2003-09-01 | Zeiss Stiftung | Apparatus for wave-front detection |
JP2002083760A (ja) * | 2000-09-08 | 2002-03-22 | Nikon Corp | X線投影露光装置およびx線投影露光方法および半導体デバイス |
JP4497831B2 (ja) * | 2003-04-15 | 2010-07-07 | キヤノン株式会社 | 露光装置及びデバイスの製造方法 |
DE102005056914A1 (de) * | 2005-11-29 | 2007-05-31 | Carl Zeiss Smt Ag | Projektionsbelichtungsystem |
DE102006038455A1 (de) * | 2006-08-16 | 2008-02-21 | Carl Zeiss Smt Ag | Optisches System für die Halbleiterlithographie |
WO2008056735A1 (fr) * | 2006-11-09 | 2008-05-15 | Nikon Corporation | Unité de support, système de détection de position et système d'exposition, procédé de déplacement, procédé de détection de position, procédé d'exposition, procédé d'ajustement du système de détection, et procédé de prod |
JP5269079B2 (ja) | 2007-08-20 | 2013-08-21 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 反射コーティングを備えたミラー要素を有する投影対物系 |
DE102007041004A1 (de) | 2007-08-29 | 2009-03-05 | Carl Zeiss Smt Ag | Beleuchtungsoptik für die EUV-Mikrolithografie |
DE102008004762A1 (de) | 2008-01-16 | 2009-07-30 | Carl Zeiss Smt Ag | Projektionsbelichtungsanlage für die Mikrolithographie mit einer Messeinrichtung |
DE102008009600A1 (de) | 2008-02-15 | 2009-08-20 | Carl Zeiss Smt Ag | Facettenspiegel zum Einsatz in einer Projektionsbelichtungsanlage für die Mikro-Lithographie |
DE102008030664A1 (de) * | 2008-07-01 | 2010-01-21 | Carl Zeiss Smt Ag | Optische Abbildungseinrichtung mit Bestimmung von Abbildungsfehlern |
DE102010038697B4 (de) | 2010-07-30 | 2012-07-19 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zur Qualifizierung einer Optik einer Projektionsbelichtungsanlage für die Mikrolithographie |
-
2011
- 2011-06-08 DE DE102011077223A patent/DE102011077223B4/de active Active
-
2012
- 2012-06-06 KR KR1020137032138A patent/KR102014551B1/ko active IP Right Grant
- 2012-06-06 JP JP2014514048A patent/JP6124881B2/ja active Active
- 2012-06-06 CN CN201280028001.6A patent/CN103608729B/zh active Active
- 2012-06-06 WO PCT/EP2012/060649 patent/WO2012168272A1/en active Application Filing
-
2013
- 2013-12-09 US US14/100,742 patent/US9482968B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20140118712A1 (en) | 2014-05-01 |
JP2014517533A (ja) | 2014-07-17 |
DE102011077223A1 (de) | 2012-12-13 |
CN103608729A (zh) | 2014-02-26 |
CN103608729B (zh) | 2016-11-02 |
US9482968B2 (en) | 2016-11-01 |
DE102011077223B4 (de) | 2013-08-14 |
KR20140041520A (ko) | 2014-04-04 |
KR102014551B1 (ko) | 2019-08-26 |
WO2012168272A1 (en) | 2012-12-13 |
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