JP6122699B2 - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- JP6122699B2 JP6122699B2 JP2013119437A JP2013119437A JP6122699B2 JP 6122699 B2 JP6122699 B2 JP 6122699B2 JP 2013119437 A JP2013119437 A JP 2013119437A JP 2013119437 A JP2013119437 A JP 2013119437A JP 6122699 B2 JP6122699 B2 JP 6122699B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- posture
- panel
- cooling panel
- refrigerator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims description 211
- 238000012545 processing Methods 0.000 claims description 94
- 238000012546 transfer Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 description 74
- 239000011521 glass Substances 0.000 description 66
- 238000000034 method Methods 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (5)
- 冷凍機とこの冷凍機により冷却される冷却パネルとを備え、冷却パネルの主面を処理対象物に近接または接触させて処理対象物を冷却する冷却装置において、
処理対象物に対して所定処理を施すときの冷却パネルの姿勢を第1姿勢、処理対象物に対して所定処理を施すとき以外の冷却パネルの姿勢を第2姿勢とし、
冷却パネルは第1姿勢と第2姿勢との間で揺動自在に設けられると共に、冷却パネルが第1姿勢と第2姿勢との少なくとも一方のときに冷凍機の冷却部が冷却パネルに接触して伝熱により冷却パネルが冷却され、
前記冷却パネルに設けられた回転軸と、この回転軸を回転駆動する第1駆動手段と、前記冷却部を前記冷却パネルに対して進退自在に駆動する第2駆動手段とを備え、第1駆動手段により回転軸を回転駆動して冷却パネルが第1姿勢と第2姿勢とを夫々とるときに第2駆動手段により冷却部を冷却パネルに接触させるように構成したことを特徴とする冷却装置。 - 前記回転軸の軸方向に間隔を存して冷凍機が複数配置されることを特徴とする請求項1に記載の冷却装置。
- 冷凍機とこの冷凍機により冷却される冷却パネルとを備え、冷却パネルの主面を処理対象物に近接または接触させて処理対象物を冷却する冷却装置において、
処理対象物に対して所定処理を施すときの冷却パネルの姿勢を第1姿勢、処理対象物に対して所定処理を施すとき以外の冷却パネルの姿勢を第2姿勢とし、
冷却パネルは第1姿勢と第2姿勢との間で揺動自在に設けられると共に、冷却パネルが第1姿勢と第2姿勢との少なくとも一方のときに冷凍機の冷却部が冷却パネルに接触して伝熱により冷却パネルが冷却され、
前記冷却パネルは、前記処理対象物の当該冷却パネルとの対向面の面積より小さい面積のパネル体の複数枚を前記対向面の面積と同等以上になるように同一平面内に並設して構成され、
前記冷却パネルのパネル体に夫々対応させて冷凍機が設けられていることを特徴とする冷却装置。 - 冷凍機とこの冷凍機により冷却される冷却パネルとを備え、冷却パネルの主面を処理対象物に近接または接触させて処理対象物を冷却する冷却装置において、
処理対象物に対して所定処理を施すときの冷却パネルの姿勢を第1姿勢、処理対象物に対して所定処理を施すとき以外の冷却パネルの姿勢を第2姿勢とし、
冷却パネルは第1姿勢と第2姿勢との間で揺動自在に設けられると共に、冷却パネルが第1姿勢と第2姿勢との少なくとも一方のときに冷凍機の冷却部が冷却パネルに接触して伝熱により冷却パネルが冷却され、
前記冷却パネルは、冷凍機が常時接触する固定パネルと、可動パネルと、この固定パネルを回転中心として可動パネルを揺動する連結部材とを備えることを特徴とする冷却装置。 - 前記冷却パネルは、処理対象物の外周面を囲繞する囲繞部を更に備えることを特徴とする請求項1〜4のいずれか1項に記載の冷却装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013119437A JP6122699B2 (ja) | 2012-12-26 | 2013-06-06 | 冷却装置 |
TW102125214A TWI614460B (zh) | 2012-12-26 | 2013-07-15 | 冷卻裝置 |
KR1020130085917A KR20140083858A (ko) | 2012-12-26 | 2013-07-22 | 냉각 장치 |
CN201310326007.8A CN103898453B (zh) | 2012-12-26 | 2013-07-30 | 冷却装置 |
KR1020170095882A KR101849755B1 (ko) | 2012-12-26 | 2017-07-28 | 냉각 장치 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012282659 | 2012-12-26 | ||
JP2012282659 | 2012-12-26 | ||
JP2013119437A JP6122699B2 (ja) | 2012-12-26 | 2013-06-06 | 冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014141734A JP2014141734A (ja) | 2014-08-07 |
JP6122699B2 true JP6122699B2 (ja) | 2017-04-26 |
Family
ID=51423262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013119437A Active JP6122699B2 (ja) | 2012-12-26 | 2013-06-06 | 冷却装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6122699B2 (ja) |
KR (2) | KR20140083858A (ja) |
TW (1) | TWI614460B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109207931B (zh) * | 2018-10-17 | 2023-12-12 | 江西省瑞科制冷科技有限公司 | 一种真空镀膜水冷机 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6108937A (en) * | 1998-09-10 | 2000-08-29 | Asm America, Inc. | Method of cooling wafers |
JP3485538B2 (ja) * | 2000-10-30 | 2004-01-13 | 株式会社日立製作所 | プラズマ処理装置 |
US6783630B2 (en) * | 2002-08-27 | 2004-08-31 | Axcelis Technologies, Inc. | Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling |
JP2005228674A (ja) * | 2004-02-16 | 2005-08-25 | Mitsui Eng & Shipbuild Co Ltd | イオン注入装置 |
JP4471848B2 (ja) * | 2005-01-06 | 2010-06-02 | 神港精機株式会社 | 基板保持装置 |
JP4533926B2 (ja) * | 2007-12-26 | 2010-09-01 | 財団法人高知県産業振興センター | 成膜装置及び成膜方法 |
JP2011127136A (ja) * | 2009-12-15 | 2011-06-30 | Canon Anelva Corp | スパッタリング装置および、該スパッタリング装置を用いた半導体デバイスの製造方法 |
JP2011184751A (ja) * | 2010-03-09 | 2011-09-22 | Sumitomo Heavy Ind Ltd | 冷却機構 |
JP5478324B2 (ja) * | 2010-03-30 | 2014-04-23 | 株式会社アルバック | クリーニング装置、成膜装置、成膜方法 |
TW201222709A (en) * | 2010-11-25 | 2012-06-01 | Pinecone En Inc | Thin film deposition device with cooling module |
-
2013
- 2013-06-06 JP JP2013119437A patent/JP6122699B2/ja active Active
- 2013-07-15 TW TW102125214A patent/TWI614460B/zh active
- 2013-07-22 KR KR1020130085917A patent/KR20140083858A/ko active Search and Examination
-
2017
- 2017-07-28 KR KR1020170095882A patent/KR101849755B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101849755B1 (ko) | 2018-04-17 |
KR20140083858A (ko) | 2014-07-04 |
JP2014141734A (ja) | 2014-08-07 |
KR20170092500A (ko) | 2017-08-11 |
TWI614460B (zh) | 2018-02-11 |
TW201425829A (zh) | 2014-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5106331B2 (ja) | 基板載置台の降温方法、コンピュータ読み取り可能な記憶媒体および基板処理システム | |
JP6067877B2 (ja) | 基板処理装置および方法 | |
JP6246961B2 (ja) | 成膜装置 | |
JP6377717B2 (ja) | 小ロット基板ハンドリングシステムのための温度制御システム及び方法 | |
JP7027057B2 (ja) | 基板搬送装置 | |
JP2018529236A (ja) | 大面積デュアル基板処理システム | |
JP6122699B2 (ja) | 冷却装置 | |
WO2010026772A1 (ja) | 基板冷却方法及び半導体の製造方法 | |
KR101841980B1 (ko) | 성막 장치 | |
US10115611B2 (en) | Substrate cooling method, substrate transfer method, and load-lock mechanism | |
US20110168086A1 (en) | Substrate holder mounting device and substrate holder container chamber | |
JP4471487B2 (ja) | 真空処理装置、真空処理方法 | |
KR100942066B1 (ko) | 홀더 스테이지 | |
KR101066979B1 (ko) | 스퍼터 장치 | |
JP2006190968A (ja) | 半導体素子製造装置 | |
CN103898453B (zh) | 冷却装置 | |
KR100749755B1 (ko) | 웨이퍼 처리장치 | |
JP7326119B2 (ja) | 基板ステージ及び真空処理装置 | |
WO2015072139A1 (ja) | 磁気抵抗効果素子の製造方法 | |
TW202405998A (zh) | 基板處理裝置、半導體裝置之製造方法及程式 | |
JP2008282858A (ja) | 基板支持ピン | |
JP2001217170A (ja) | 基板ベーク方法 | |
JP2000340545A (ja) | プラズマ処理装置およびプラズマ処理方法 | |
KR20090124838A (ko) | 기판 이송 장치 및 방법 | |
JP2013197401A (ja) | ロードロックチャンバ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160415 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170125 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170131 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170307 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170321 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170403 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6122699 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |