JP6114883B1 - 導電性粘着材及び導電性基材付き導電性粘着材 - Google Patents
導電性粘着材及び導電性基材付き導電性粘着材 Download PDFInfo
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- JP6114883B1 JP6114883B1 JP2016533665A JP2016533665A JP6114883B1 JP 6114883 B1 JP6114883 B1 JP 6114883B1 JP 2016533665 A JP2016533665 A JP 2016533665A JP 2016533665 A JP2016533665 A JP 2016533665A JP 6114883 B1 JP6114883 B1 JP 6114883B1
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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KR20190015652A (ko) * | 2017-08-03 | 2019-02-14 | (주)트러스 | 압축변형이 가능한 도전성 파우더를 이용한 도전성 점착테이프 및 이의 제조방법 |
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JP2021019012A (ja) * | 2019-07-17 | 2021-02-15 | 信越ポリマー株式会社 | 電磁波シールドフィルム、回路基板、及び回路基板の製造方法 |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63301408A (ja) * | 1987-06-02 | 1988-12-08 | Hitachi Chem Co Ltd | 導電性粒子 |
JPH11134934A (ja) * | 1997-10-30 | 1999-05-21 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤 |
JPH11241054A (ja) * | 1997-10-28 | 1999-09-07 | Sony Chem Corp | 異方導電性接着剤および接着用膜 |
JP2005109160A (ja) * | 2003-09-30 | 2005-04-21 | Tokai Rubber Ind Ltd | 電磁波シールドテープおよびそれを用いたシールドフラットケーブル |
JP2010034045A (ja) * | 2008-07-01 | 2010-02-12 | Hitachi Chem Co Ltd | 回路接続材料及び回路接続構造体 |
JP2011012180A (ja) * | 2009-07-02 | 2011-01-20 | Hitachi Chem Co Ltd | 回路接続材料及び回路接続構造体 |
JP2012113850A (ja) * | 2010-11-22 | 2012-06-14 | Nippon Chem Ind Co Ltd | 導電性粉体、それを含む導電性材料及びその製造方法 |
JP2013058764A (ja) * | 2007-10-05 | 2013-03-28 | Hitachi Chemical Co Ltd | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
JP2013182823A (ja) * | 2012-03-02 | 2013-09-12 | Dexerials Corp | 接続体の製造方法、及び異方性導電接着剤 |
JP2015010111A (ja) * | 2013-06-26 | 2015-01-19 | 日東電工株式会社 | 導電性粘着テープ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5940760B2 (ja) * | 2010-05-19 | 2016-06-29 | 積水化学工業株式会社 | 導電性粒子、異方性導電材料及び接続構造体 |
WO2012043472A1 (ja) * | 2010-09-30 | 2012-04-05 | 積水化学工業株式会社 | 導電性粒子、異方性導電材料及び接続構造体 |
JP6009933B2 (ja) * | 2011-12-22 | 2016-10-19 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
CN106424711B (zh) | 2012-03-06 | 2019-02-15 | 东洋油墨Sc控股株式会社 | 导电性微粒及其制造方法、导电性树脂组成物、导电性薄片、以及电磁波屏蔽薄片 |
KR102095291B1 (ko) * | 2012-11-28 | 2020-03-31 | 세키스이가가쿠 고교가부시키가이샤 | 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체 |
JP6106148B2 (ja) * | 2013-11-27 | 2017-03-29 | 日東電工株式会社 | 導電性粘着テープ、電子部材及び粘着剤 |
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- 2016-05-17 JP JP2016533665A patent/JP6114883B1/ja active Active
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Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63301408A (ja) * | 1987-06-02 | 1988-12-08 | Hitachi Chem Co Ltd | 導電性粒子 |
JPH11241054A (ja) * | 1997-10-28 | 1999-09-07 | Sony Chem Corp | 異方導電性接着剤および接着用膜 |
JPH11134934A (ja) * | 1997-10-30 | 1999-05-21 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤 |
JP2005109160A (ja) * | 2003-09-30 | 2005-04-21 | Tokai Rubber Ind Ltd | 電磁波シールドテープおよびそれを用いたシールドフラットケーブル |
JP2013058764A (ja) * | 2007-10-05 | 2013-03-28 | Hitachi Chemical Co Ltd | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 |
JP2010034045A (ja) * | 2008-07-01 | 2010-02-12 | Hitachi Chem Co Ltd | 回路接続材料及び回路接続構造体 |
JP2011012180A (ja) * | 2009-07-02 | 2011-01-20 | Hitachi Chem Co Ltd | 回路接続材料及び回路接続構造体 |
JP2012113850A (ja) * | 2010-11-22 | 2012-06-14 | Nippon Chem Ind Co Ltd | 導電性粉体、それを含む導電性材料及びその製造方法 |
JP2013182823A (ja) * | 2012-03-02 | 2013-09-12 | Dexerials Corp | 接続体の製造方法、及び異方性導電接着剤 |
JP2015010111A (ja) * | 2013-06-26 | 2015-01-19 | 日東電工株式会社 | 導電性粘着テープ |
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TWI677558B (zh) | 2019-11-21 |
CN107250308A (zh) | 2017-10-13 |
KR20180006872A (ko) | 2018-01-19 |
CN107250308B (zh) | 2019-10-25 |
WO2016186099A1 (ja) | 2016-11-24 |
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