JP6114883B1 - 導電性粘着材及び導電性基材付き導電性粘着材 - Google Patents

導電性粘着材及び導電性基材付き導電性粘着材 Download PDF

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JP6114883B1
JP6114883B1 JP2016533665A JP2016533665A JP6114883B1 JP 6114883 B1 JP6114883 B1 JP 6114883B1 JP 2016533665 A JP2016533665 A JP 2016533665A JP 2016533665 A JP2016533665 A JP 2016533665A JP 6114883 B1 JP6114883 B1 JP 6114883B1
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conductive
particles
adhesive material
less
conductive adhesive
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Japanese (ja)
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JPWO2016186099A1 (ja
Inventor
暁舸 王
暁舸 王
昌男 笹平
昌男 笹平
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28Metal sheet
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
JP2016533665A 2015-05-20 2016-05-17 導電性粘着材及び導電性基材付き導電性粘着材 Active JP6114883B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015103078 2015-05-20
JP2015103078 2015-05-20
PCT/JP2016/064559 WO2016186099A1 (ja) 2015-05-20 2016-05-17 導電性粘着材及び導電性基材付き導電性粘着材

Publications (2)

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JP6114883B1 true JP6114883B1 (ja) 2017-04-12
JPWO2016186099A1 JPWO2016186099A1 (ja) 2017-06-15

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JP2016533665A Active JP6114883B1 (ja) 2015-05-20 2016-05-17 導電性粘着材及び導電性基材付き導電性粘着材

Country Status (5)

Country Link
JP (1) JP6114883B1 (zh)
KR (1) KR102529562B1 (zh)
CN (1) CN107250308B (zh)
TW (1) TWI677558B (zh)
WO (1) WO2016186099A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017104665A1 (ja) * 2015-12-15 2017-06-22 積水化学工業株式会社 導電性粘着テープ
KR20190015652A (ko) * 2017-08-03 2019-02-14 (주)트러스 압축변형이 가능한 도전성 파우더를 이용한 도전성 점착테이프 및 이의 제조방법
JP6546975B2 (ja) * 2017-10-16 2019-07-17 タツタ電線株式会社 導電性接着剤
JP2021019012A (ja) * 2019-07-17 2021-02-15 信越ポリマー株式会社 電磁波シールドフィルム、回路基板、及び回路基板の製造方法
JPWO2021117775A1 (zh) * 2019-12-10 2021-06-17
JP2021091801A (ja) * 2019-12-11 2021-06-17 Dic株式会社 導電性粘着シート

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63301408A (ja) * 1987-06-02 1988-12-08 Hitachi Chem Co Ltd 導電性粒子
JPH11134934A (ja) * 1997-10-30 1999-05-21 Shin Etsu Polymer Co Ltd 異方導電性接着剤
JPH11241054A (ja) * 1997-10-28 1999-09-07 Sony Chem Corp 異方導電性接着剤および接着用膜
JP2005109160A (ja) * 2003-09-30 2005-04-21 Tokai Rubber Ind Ltd 電磁波シールドテープおよびそれを用いたシールドフラットケーブル
JP2010034045A (ja) * 2008-07-01 2010-02-12 Hitachi Chem Co Ltd 回路接続材料及び回路接続構造体
JP2011012180A (ja) * 2009-07-02 2011-01-20 Hitachi Chem Co Ltd 回路接続材料及び回路接続構造体
JP2012113850A (ja) * 2010-11-22 2012-06-14 Nippon Chem Ind Co Ltd 導電性粉体、それを含む導電性材料及びその製造方法
JP2013058764A (ja) * 2007-10-05 2013-03-28 Hitachi Chemical Co Ltd 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
JP2013182823A (ja) * 2012-03-02 2013-09-12 Dexerials Corp 接続体の製造方法、及び異方性導電接着剤
JP2015010111A (ja) * 2013-06-26 2015-01-19 日東電工株式会社 導電性粘着テープ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5940760B2 (ja) * 2010-05-19 2016-06-29 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
WO2012043472A1 (ja) * 2010-09-30 2012-04-05 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP6009933B2 (ja) * 2011-12-22 2016-10-19 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
CN106424711B (zh) 2012-03-06 2019-02-15 东洋油墨Sc控股株式会社 导电性微粒及其制造方法、导电性树脂组成物、导电性薄片、以及电磁波屏蔽薄片
KR102095291B1 (ko) * 2012-11-28 2020-03-31 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
JP6106148B2 (ja) * 2013-11-27 2017-03-29 日東電工株式会社 導電性粘着テープ、電子部材及び粘着剤

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63301408A (ja) * 1987-06-02 1988-12-08 Hitachi Chem Co Ltd 導電性粒子
JPH11241054A (ja) * 1997-10-28 1999-09-07 Sony Chem Corp 異方導電性接着剤および接着用膜
JPH11134934A (ja) * 1997-10-30 1999-05-21 Shin Etsu Polymer Co Ltd 異方導電性接着剤
JP2005109160A (ja) * 2003-09-30 2005-04-21 Tokai Rubber Ind Ltd 電磁波シールドテープおよびそれを用いたシールドフラットケーブル
JP2013058764A (ja) * 2007-10-05 2013-03-28 Hitachi Chemical Co Ltd 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
JP2010034045A (ja) * 2008-07-01 2010-02-12 Hitachi Chem Co Ltd 回路接続材料及び回路接続構造体
JP2011012180A (ja) * 2009-07-02 2011-01-20 Hitachi Chem Co Ltd 回路接続材料及び回路接続構造体
JP2012113850A (ja) * 2010-11-22 2012-06-14 Nippon Chem Ind Co Ltd 導電性粉体、それを含む導電性材料及びその製造方法
JP2013182823A (ja) * 2012-03-02 2013-09-12 Dexerials Corp 接続体の製造方法、及び異方性導電接着剤
JP2015010111A (ja) * 2013-06-26 2015-01-19 日東電工株式会社 導電性粘着テープ

Also Published As

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KR102529562B1 (ko) 2023-05-09
JPWO2016186099A1 (ja) 2017-06-15
TW201708469A (zh) 2017-03-01
TWI677558B (zh) 2019-11-21
CN107250308A (zh) 2017-10-13
KR20180006872A (ko) 2018-01-19
CN107250308B (zh) 2019-10-25
WO2016186099A1 (ja) 2016-11-24

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