JP6112843B2 - 電子デバイス検査用コンタクトシートのバンプ付リード形成方法 - Google Patents
電子デバイス検査用コンタクトシートのバンプ付リード形成方法 Download PDFInfo
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- JP6112843B2 JP6112843B2 JP2012263011A JP2012263011A JP6112843B2 JP 6112843 B2 JP6112843 B2 JP 6112843B2 JP 2012263011 A JP2012263011 A JP 2012263011A JP 2012263011 A JP2012263011 A JP 2012263011A JP 6112843 B2 JP6112843 B2 JP 6112843B2
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- 238000000034 method Methods 0.000 title claims description 18
- 238000007689 inspection Methods 0.000 title claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 45
- 239000002184 metal Substances 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 22
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Description
又、従来のフォトリソグラフィ工程でのバンプ形成には、高さのバラツキ(不揃い)や密着強度が不足するなどの課題もあった。
2 導電層
3 金属層
4´ 予備リード部
4a 薄肉リード
4b 厚肉リード
5 分割溝
6 バンプ
7 薄肉化
8 電子デバイス
9 外部接点
Claims (3)
- 絶縁基板の表面に密着したベタの金属層にレーザー照射を施してリードを形成すべき金属層部分以外の金属層部分を除去することにより上記絶縁基板上にリードを形成し、該リードを形成する金属層部分の上層部をレーザー照射で部分的に除去して薄肉化することによりリード端に残存する金属層部分で突起状のバンプを形成することを特徴とする電子デバイス検査用コンタクトシートのバンプ付リード形成方法。
- 上記バンプを形成すべき金属層部分以外の金属層の上層部を略全長に亘りレーザー照射で除去して薄肉化し薄肉リードを形成したことを特徴とする請求項1記載の電子デバイス検査用コンタクトシートのバンプ付リード形成方法。
- 上記バンプを形成すべき金属層部分の内側又は周囲の金属層の上層部をレーザー照射で除去して薄肉化し上記バンプを形成したことを特徴とする請求項1記載の電子デバイス検査用コンタクトシートのバンプ付リード形成方法。
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JP2012263011A JP6112843B2 (ja) | 2012-11-30 | 2012-11-30 | 電子デバイス検査用コンタクトシートのバンプ付リード形成方法 |
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JP2012263011A JP6112843B2 (ja) | 2012-11-30 | 2012-11-30 | 電子デバイス検査用コンタクトシートのバンプ付リード形成方法 |
Publications (2)
Publication Number | Publication Date |
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JP2014110113A JP2014110113A (ja) | 2014-06-12 |
JP6112843B2 true JP6112843B2 (ja) | 2017-04-12 |
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JP2012263011A Active JP6112843B2 (ja) | 2012-11-30 | 2012-11-30 | 電子デバイス検査用コンタクトシートのバンプ付リード形成方法 |
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JP (1) | JP6112843B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102065873B1 (ko) * | 2019-02-20 | 2020-01-13 | 도시오 오쿠노 | 전자 디바이스 검사용 컨택트 시트 및 컨택트 시트의 범프 일체형 리드 형성 방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3593935B2 (ja) * | 1999-11-10 | 2004-11-24 | ソニーケミカル株式会社 | バンプ付き配線回路基板の製造方法及びバンプ形成方法 |
JP2001298119A (ja) * | 2000-04-14 | 2001-10-26 | Matsushita Electric Ind Co Ltd | リード形状の形成方法 |
JP4035981B2 (ja) * | 2001-10-26 | 2008-01-23 | 松下電工株式会社 | 超短パルスレーザを用いた回路形成方法 |
JP4684843B2 (ja) * | 2005-10-17 | 2011-05-18 | ナミックス株式会社 | バンプ形成方法 |
JP2011233872A (ja) * | 2010-04-08 | 2011-11-17 | Asahi Glass Co Ltd | 金属パターン付き基板の製造方法及び金属積層体付き基板 |
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- 2012-11-30 JP JP2012263011A patent/JP6112843B2/ja active Active
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JP2014110113A (ja) | 2014-06-12 |
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