JP6106176B2 - ロードステーション - Google Patents

ロードステーション Download PDF

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Publication number
JP6106176B2
JP6106176B2 JP2014530824A JP2014530824A JP6106176B2 JP 6106176 B2 JP6106176 B2 JP 6106176B2 JP 2014530824 A JP2014530824 A JP 2014530824A JP 2014530824 A JP2014530824 A JP 2014530824A JP 6106176 B2 JP6106176 B2 JP 6106176B2
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JP
Japan
Prior art keywords
substrate
cassette
substrate cassette
frame
loading station
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014530824A
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English (en)
Japanese (ja)
Other versions
JP2014530496A5 (enExample
JP2014530496A (ja
Inventor
エフ シャーロック、レイ
エフ シャーロック、レイ
バユル、ツェッパ
ジェイ ダンスウィック、クリストファー
ジェイ ダンスウィック、クリストファー
エイ ラサンテ、ウエイン
エイ ラサンテ、ウエイン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Azenta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azenta Inc filed Critical Azenta Inc
Publication of JP2014530496A publication Critical patent/JP2014530496A/ja
Publication of JP2014530496A5 publication Critical patent/JP2014530496A5/ja
Application granted granted Critical
Publication of JP6106176B2 publication Critical patent/JP6106176B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2014530824A 2011-09-14 2012-09-14 ロードステーション Active JP6106176B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161534681P 2011-09-14 2011-09-14
US61/534,681 2011-09-14
PCT/US2012/055374 WO2013040330A1 (en) 2011-09-14 2012-09-14 Load station

Publications (3)

Publication Number Publication Date
JP2014530496A JP2014530496A (ja) 2014-11-17
JP2014530496A5 JP2014530496A5 (enExample) 2015-10-01
JP6106176B2 true JP6106176B2 (ja) 2017-03-29

Family

ID=47883768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014530824A Active JP6106176B2 (ja) 2011-09-14 2012-09-14 ロードステーション

Country Status (5)

Country Link
US (1) US9812343B2 (enExample)
JP (1) JP6106176B2 (enExample)
KR (1) KR102058985B1 (enExample)
CN (1) CN103917466B (enExample)
WO (1) WO2013040330A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101869886B1 (ko) * 2015-02-12 2018-06-21 (주)로봇앤드디자인 검체 자동 염색장치
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US9502275B1 (en) * 2015-10-20 2016-11-22 Lam Research Corporation Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs
CN105414943B (zh) * 2015-12-02 2018-06-01 深圳创维－Rgb电子有限公司 自动装配螺钉的设备和自动化组装系统
US9902415B2 (en) * 2016-02-15 2018-02-27 Lam Research Corporation Universal service cart for semiconductor system maintenance
CN109244186B (zh) * 2018-09-19 2024-02-27 通威太阳能（安徽）有限公司 一种新型背钝化背膜正膜机台镀膜连体上下料装置及方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5186594A (en) 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
JPH0582625A (ja) * 1991-09-19 1993-04-02 Hitachi Ltd ウエハ搬送装置
JPH0710213A (ja) * 1993-06-24 1995-01-13 Kokusai Electric Co Ltd 半導体製造装置に於けるウェーハ搬送装置
JPH0728962U (ja) * 1993-10-29 1995-05-30 日新電機株式会社 基板処理装置用のエンドステーション
US6257827B1 (en) * 1997-12-01 2001-07-10 Brooks Automation Inc. Apparatus and method for transporting substrates
US6283692B1 (en) 1998-12-01 2001-09-04 Applied Materials, Inc. Apparatus for storing and moving a cassette
US6182030B1 (en) 1998-12-18 2001-01-30 Telefonaktiebolaget Lm Ericsson (Publ) Enhanced coding to improve coded communication signals
IT1308606B1 (it) 1999-02-12 2002-01-08 Lpe Spa Dispositivo per maneggiare substrati mediante un istema autolivellante a depressione in reattori epistassiali ad induzione con suscettore
US6610993B2 (en) * 1999-06-21 2003-08-26 Fortrend Engineering Corporation Load port door assembly with integrated wafer mapper
US6364762B1 (en) * 1999-09-30 2002-04-02 Lam Research Corporation Wafer atmospheric transport module having a controlled mini-environment
TWI228750B (en) 2003-02-25 2005-03-01 Samsung Electronics Co Ltd Apparatus and method for processing wafers
US20040258505A1 (en) * 2003-06-04 2004-12-23 Wu Kung Chris Processing equipment modular font-end
JP2005166842A (ja) * 2003-12-01 2005-06-23 Tokyo Ohka Kogyo Co Ltd 半導体ウェーハの処理方法
JP4388505B2 (ja) * 2005-05-26 2009-12-24 株式会社日立ハイテクコントロールシステムズ 自動傾転付きオープンカセットロードポート
US7896602B2 (en) * 2006-06-09 2011-03-01 Lutz Rebstock Workpiece stocker with circular configuration
US20080206021A1 (en) * 2007-02-27 2008-08-28 Smith John M Stacked process chambers for magnetic media processing tool
WO2008144670A1 (en) * 2007-05-18 2008-11-27 Brooks Automation, Inc. Load lock fast pump vent
TWI585892B (zh) * 2010-09-17 2017-06-01 昕芙旎雅股份有限公司 卡匣轉接器
US9142437B2 (en) * 2013-04-10 2015-09-22 Globalfoundries Inc. System for separately handling different size FOUPs
US9698038B2 (en) * 2014-08-28 2017-07-04 Infineon Technologies Ag Adapter tool and wafer handling system

Also Published As

Publication number Publication date
JP2014530496A (ja) 2014-11-17
US9812343B2 (en) 2017-11-07
KR102058985B1 (ko) 2020-02-07
KR20140076576A (ko) 2014-06-20
CN103917466A (zh) 2014-07-09
CN103917466B (zh) 2019-01-04
US20150249029A1 (en) 2015-09-03
WO2013040330A1 (en) 2013-03-21

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