CN103917466B - 装载工位 - Google Patents

装载工位 Download PDF

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Publication number
CN103917466B
CN103917466B CN201280055812.5A CN201280055812A CN103917466B CN 103917466 B CN103917466 B CN 103917466B CN 201280055812 A CN201280055812 A CN 201280055812A CN 103917466 B CN103917466 B CN 103917466B
Authority
CN
China
Prior art keywords
substrate
cassette
substrate cassette
common
interchangeable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280055812.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN103917466A (zh
Inventor
L.F.沙罗克
T.贝于尔
C.J.丹斯维茨
W.A.拉桑特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Borucos Automation Usa Co ltd
Borukos Automation Holding Co ltd
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Publication of CN103917466A publication Critical patent/CN103917466A/zh
Application granted granted Critical
Publication of CN103917466B publication Critical patent/CN103917466B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
CN201280055812.5A 2011-09-14 2012-09-14 装载工位 Active CN103917466B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161534681P 2011-09-14 2011-09-14
US61/534681 2011-09-14
PCT/US2012/055374 WO2013040330A1 (en) 2011-09-14 2012-09-14 Load station

Publications (2)

Publication Number Publication Date
CN103917466A CN103917466A (zh) 2014-07-09
CN103917466B true CN103917466B (zh) 2019-01-04

Family

ID=47883768

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280055812.5A Active CN103917466B (zh) 2011-09-14 2012-09-14 装载工位

Country Status (5)

Country Link
US (1) US9812343B2 (enExample)
JP (1) JP6106176B2 (enExample)
KR (1) KR102058985B1 (enExample)
CN (1) CN103917466B (enExample)
WO (1) WO2013040330A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101869886B1 (ko) * 2015-02-12 2018-06-21 (주)로봇앤드디자인 검체 자동 염색장치
US10515834B2 (en) * 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
US9502275B1 (en) * 2015-10-20 2016-11-22 Lam Research Corporation Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs
CN105414943B (zh) * 2015-12-02 2018-06-01 深圳创维－Rgb电子有限公司 自动装配螺钉的设备和自动化组装系统
US9902415B2 (en) * 2016-02-15 2018-02-27 Lam Research Corporation Universal service cart for semiconductor system maintenance
CN109244186B (zh) * 2018-09-19 2024-02-27 通威太阳能（安徽）有限公司 一种新型背钝化背膜正膜机台镀膜连体上下料装置及方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
JPH0582625A (ja) * 1991-09-19 1993-04-02 Hitachi Ltd ウエハ搬送装置
JPH0710213A (ja) * 1993-06-24 1995-01-13 Kokusai Electric Co Ltd 半導体製造装置に於けるウェーハ搬送装置
JPH0728962U (ja) * 1993-10-29 1995-05-30 日新電機株式会社 基板処理装置用のエンドステーション
US6257827B1 (en) * 1997-12-01 2001-07-10 Brooks Automation Inc. Apparatus and method for transporting substrates
US6283692B1 (en) 1998-12-01 2001-09-04 Applied Materials, Inc. Apparatus for storing and moving a cassette
US6182030B1 (en) 1998-12-18 2001-01-30 Telefonaktiebolaget Lm Ericsson (Publ) Enhanced coding to improve coded communication signals
IT1308606B1 (it) 1999-02-12 2002-01-08 Lpe Spa Dispositivo per maneggiare substrati mediante un istema autolivellante a depressione in reattori epistassiali ad induzione con suscettore
US6610993B2 (en) * 1999-06-21 2003-08-26 Fortrend Engineering Corporation Load port door assembly with integrated wafer mapper
US6364762B1 (en) * 1999-09-30 2002-04-02 Lam Research Corporation Wafer atmospheric transport module having a controlled mini-environment
TWI228750B (en) 2003-02-25 2005-03-01 Samsung Electronics Co Ltd Apparatus and method for processing wafers
US20040258505A1 (en) * 2003-06-04 2004-12-23 Wu Kung Chris Processing equipment modular font-end
JP2005166842A (ja) * 2003-12-01 2005-06-23 Tokyo Ohka Kogyo Co Ltd 半導体ウェーハの処理方法
JP4388505B2 (ja) * 2005-05-26 2009-12-24 株式会社日立ハイテクコントロールシステムズ 自動傾転付きオープンカセットロードポート
US7896602B2 (en) * 2006-06-09 2011-03-01 Lutz Rebstock Workpiece stocker with circular configuration
US20080206021A1 (en) * 2007-02-27 2008-08-28 Smith John M Stacked process chambers for magnetic media processing tool
WO2008144670A1 (en) * 2007-05-18 2008-11-27 Brooks Automation, Inc. Load lock fast pump vent
TWI538084B (zh) * 2010-09-17 2016-06-11 昕芙旎雅股份有限公司 卡匣轉接器
US9142437B2 (en) * 2013-04-10 2015-09-22 Globalfoundries Inc. System for separately handling different size FOUPs
US9698038B2 (en) * 2014-08-28 2017-07-04 Infineon Technologies Ag Adapter tool and wafer handling system

Also Published As

Publication number Publication date
KR20140076576A (ko) 2014-06-20
CN103917466A (zh) 2014-07-09
US20150249029A1 (en) 2015-09-03
JP6106176B2 (ja) 2017-03-29
KR102058985B1 (ko) 2020-02-07
JP2014530496A (ja) 2014-11-17
US9812343B2 (en) 2017-11-07
WO2013040330A1 (en) 2013-03-21

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20220310

Address after: Massachusetts

Patentee after: Borucos automation USA Co.,Ltd.

Address before: Massachusetts

Patentee before: Borukos automation Holding Co.,Ltd.

Effective date of registration: 20220310

Address after: Massachusetts

Patentee after: Borukos automation Holding Co.,Ltd.

Address before: Massachusetts

Patentee before: BROOKS AUTOMATION, Inc.

TR01 Transfer of patent right