JP6092388B2 - 光源の製造方法 - Google Patents
光源の製造方法 Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
- F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/19—Attachment of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
・ケーシングボディと、このケーシングボディ内に配置された少なくとも1つの発光ダイオードチップと、少なくとも2つの電気端子部とを含む光電半導体部品を用意するステップであって、ただし、少なくとも2つの電気端子部は光電半導体部品の下面に配置されている、ステップと、
・少なくとも2つのコンタクト部を含む接続支持体を用意するステップであって、ただし、少なくとも2つのコンタクト部は接続支持体の上面に配置されている、ステップと、
・位置決め装置が接続支持体及び/又は光電半導体部品に直接に接触するように、この位置決め装置を準備するステップと、
・光電半導体部品の電気端子部と接続支持体のコンタクト部との間に接続手段を用意するステップと、
・接続手段を介して光電半導体部品を接続支持体に機械的に固定しかつ電気的に接続するステップと
を含み、
位置決め装置により、機械的に固定しかつ電気的に接続するステップの間、光電半導体部品が、接続支持体の上面のトレランス領域内に保持される。
Claims (13)
- 光源の製造方法であって、
ケーシングボディ(11)と、該ケーシングボディ(11)内に配置された少なくとも1つの発光ダイオードチップ(12)と、少なくとも2つの電気端子部(14)とを含む光電半導体部品(1)を用意するステップであって、ただし、前記少なくとも2つの電気端子部(14)は前記光電半導体部品(1)の下面(1b)に配置されている、ステップと、
少なくとも2つのコンタクト部(24)を含む接続支持体(2)を用意するステップであって、ただし、前記少なくとも2つのコンタクト部(24)は前記接続支持体(2)の上面に配置されている、ステップと、
位置決め装置(3)が前記接続支持体(2)及び/又は前記光電半導体部品(1)に直接に接触するように、該位置決め装置(3)を準備するステップと、
前記光電半導体部品(1)の前記電気端子部(14)と前記接続支持体(2)の前記コンタクト部(24)との間に接続手段(8)を用意するステップと、
前記接続手段(8)を介して前記光電半導体部品(1)を前記接続支持体(2)に機械的に固定しかつ電気的に接続するステップと
を含み、
前記位置決め装置(3)により、前記機械的に固定しかつ電気的に接続するステップの間、前記光電半導体部品(1)を前記接続支持体(2)の上面のトレランス領域(4)内に保持し、
前記接続手段(8)は、はんだ材料又は導電性接着剤によって形成され、
前記位置決め装置(3)は、前記接続支持体(2)に直接に接触しかつ前記接続支持体(2)に機械的に固定に接続された少なくとも3つのピン(31)を含み、
前記ピン(31)は、前記接続支持体(2)の、前記光電半導体部品(1)に近い側の上面から突出しており、
前記ピン(31)は水平方向(l)で前記トレランス領域(4)を画定しており、
前記光電半導体部品(1)は、前記機械的に固定しかつ電気的に接続するステップの後、前記ピンのうち最大2つに直接に接触する、
ことを特徴とする方法。 - 前記電気端子部(14)は、前記光電半導体部品(1)の下面(1b)のみに配置されており、水平方向ではどの位置においても前記ケーシングボディ(11)を超えては延在しない、
請求項1記載の方法。 - 前記トレランス領域(4)は、前記トレランス領域(4)が存在する平面に対して平行な平面において、前記光電半導体部品(1)の、前記接続支持体(2)に近い側の前記下面の最大面積よりも大きな面積を有する、
請求項1又は2記載の方法。 - 前記位置決め装置(3)は、前記接続支持体(2)及び/又は前記光電半導体部品(1)に形成及び/又は固定された少なくとも2つの要素を含む、
請求項1から3までのいずれか1項記載の方法。 - 前記位置決め装置(3)は、少なくとも2つのピン(31)と少なくとも2つの凹部(32)とを含み、
それぞれの前記ピン(31)に1つずつの前記凹部(32)が一義的に対応しており、
・1つのピン(31)が前記光電半導体部品(1)に直接に接触しかつ前記光電半導体部品(1)に機械的に固定に接続されており、該ピンに対応する凹部(32)が前記接続支持体(2)に設けられており、
又は、
・1つのピン(31)が前記接続支持体(2)に直接に接触しておりかつ前記接続支持体(2)に機械的に固定に接続されており、該ピンに対応する凹部(32)が前記光電半導体部品(1)に設けられており、
前記ピン(31)と該ピンに対応する前記凹部(32)との少なくとも1つの組において、前記凹部(32)は、少なくとも部分的に、前記ピン(31)の直径よりも大きな直径(d)を有する、
請求項1から4までのいずれか1項記載の方法。 - 前記位置決め装置(3)は、前記接続支持体(2)の、前記光電半導体部品(1)に近い側の上面(2a)から突出するフレーム(33)を含み、
前記フレーム(33)は、前記光電半導体部品(1)に接触するばねエレメントを含み、
前記フレーム(33)は水平方向(l)で前記トレランス領域(4)を画定している、
請求項1から5までのいずれか1項記載の方法。 - 前記位置決め装置(3)の少なくとも1つの要素は、前記光電半導体部品(1)を前記接続支持体(2)に機械的に固定しかつ電気的に接続した後、除去される、
請求項1から6までのいずれか1項記載の方法。 - 前記位置決め装置(3)の前記少なくとも1つの要素は、前記除去の前には、前記接続支持体(2)又は前記光電半導体部品(1)に機械的に固定に接続されており、
前記接続支持体(2)又は前記光電半導体部品(1)は、前記除去後、前記位置決め装置(3)の前記少なくとも1つの要素の除去によって生じる複数の分離線(34)を有する、
請求項7記載の方法。 - 前記位置決め装置(3)の前記少なくとも1つの要素を除去することにより、前記光電半導体部品(1)又は前記接続支持体(2)の少なくとも1つの凹部が露出され、
露出された前記少なくとも1つの凹部は、光学素子(7)の位置合わせ及び/又は機械的固定のために用いられる、
請求項7又は8記載の方法。 - さらに、
冷却ボディ(5)を用意するステップと、
前記光電半導体部品(1)とは反対側の前記冷却ボディ(5)の下面に、前記接続支持体(2)を機械的に固定するステップと
を含む、
請求項1から9までのいずれか1項記載の方法。 - 前記冷却ボディ(5)への前記接続支持体(2)の機械的固定は、少なくとも部分的に、前記位置決め装置(3)の少なくとも1つの要素によって行われる、
請求項10記載の方法。 - 前記位置決め装置(3)のピンを前記冷却ボディ(5)に直接に接触させる、
請求項11記載の方法。 - 前記光電半導体部品(1)及び/又は前記接続支持体(2)及び/又は前記冷却ボディ(5)は、前記位置決め装置(3)の要素に加えて、前記位置決め装置(3)に対して位置合わせされた少なくとも1つの固定手段を含み、
前記固定手段により、光学素子(7)が、前記光電半導体部品(1)に対して相対的に、及び/又は、前記接続支持体(2)に対して相対的に、及び/又は、前記冷却ボディ(5)に対して相対的に、機械的に固定される、
請求項1から12までのいずれか1項記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210106982 DE102012106982A1 (de) | 2012-07-31 | 2012-07-31 | Verfahren zur Herstellung eines Leuchtmittels |
DE102012106982.4 | 2012-07-31 | ||
PCT/EP2013/064060 WO2014019795A1 (de) | 2012-07-31 | 2013-07-03 | Verfahren zur herstellung eines leuchtmittels |
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JP2015528215A JP2015528215A (ja) | 2015-09-24 |
JP6092388B2 true JP6092388B2 (ja) | 2017-03-08 |
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JP2015524693A Active JP6092388B2 (ja) | 2012-07-31 | 2013-07-03 | 光源の製造方法 |
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US (1) | US9551479B2 (ja) |
JP (1) | JP6092388B2 (ja) |
KR (1) | KR20150056082A (ja) |
DE (2) | DE102012106982A1 (ja) |
WO (1) | WO2014019795A1 (ja) |
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DE102012106982A1 (de) | 2012-07-31 | 2014-02-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Leuchtmittels |
DE102015108545A1 (de) * | 2015-05-29 | 2016-12-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
JP2018060962A (ja) * | 2016-10-07 | 2018-04-12 | 岩崎電気株式会社 | 発光モジュール |
JP7288173B2 (ja) * | 2018-09-28 | 2023-06-07 | 日亜化学工業株式会社 | 発光装置の製造方法、発光モジュールの製造方法及び発光装置 |
US11655947B2 (en) | 2020-04-08 | 2023-05-23 | Nichia Corporation | Light emitting device, light emitting module, and method of manufacturing light emitting module |
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JP4554873B2 (ja) * | 2002-04-22 | 2010-09-29 | 日本電気株式会社 | 配線板、電子機器および電子部品の実装方法並びに製造方法 |
JP4123105B2 (ja) | 2003-05-26 | 2008-07-23 | 松下電工株式会社 | 発光装置 |
EP1627437B1 (en) | 2003-05-26 | 2016-03-30 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device |
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DE102012106982A1 (de) | 2012-07-31 | 2014-02-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Leuchtmittels |
-
2012
- 2012-07-31 DE DE201210106982 patent/DE102012106982A1/de not_active Withdrawn
-
2013
- 2013-07-03 JP JP2015524693A patent/JP6092388B2/ja active Active
- 2013-07-03 KR KR1020157004451A patent/KR20150056082A/ko not_active Application Discontinuation
- 2013-07-03 DE DE112013003816.1T patent/DE112013003816B4/de active Active
- 2013-07-03 WO PCT/EP2013/064060 patent/WO2014019795A1/de active Application Filing
- 2013-07-03 US US14/418,924 patent/US9551479B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10865028B2 (en) | 2005-02-14 | 2020-12-15 | Mentcon Singapore Pte Ltd. | Heat sealable, retortable laminated foil |
Also Published As
Publication number | Publication date |
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DE112013003816A5 (de) | 2015-05-21 |
JP2015528215A (ja) | 2015-09-24 |
DE102012106982A1 (de) | 2014-02-06 |
US9551479B2 (en) | 2017-01-24 |
US20150167938A1 (en) | 2015-06-18 |
KR20150056082A (ko) | 2015-05-22 |
DE112013003816B4 (de) | 2022-04-21 |
WO2014019795A1 (de) | 2014-02-06 |
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