JP4945116B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP4945116B2 JP4945116B2 JP2005325957A JP2005325957A JP4945116B2 JP 4945116 B2 JP4945116 B2 JP 4945116B2 JP 2005325957 A JP2005325957 A JP 2005325957A JP 2005325957 A JP2005325957 A JP 2005325957A JP 4945116 B2 JP4945116 B2 JP 4945116B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lead
- resin
- circuit board
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
2a、2b リードフレーム
3 LEDチップ
4 ボンディングワイヤ
5 封止樹脂
6 台座部
7 レンズ部
8 レンズ面
9 平側面
10 底面
11 リードストッパー
12 下面
13 下辺
20 注型キャビティ
21 注型金型
22 開口縁部
23 タイバー
24 多数個取りリードフレーム
25 開口面
30 回路基板
31 リード孔
32 部品面
33 はんだ面
34 はんだ
35 開口部
Claims (3)
- 略平行に配設され複数本のリードフレームのうちの少なくとも一本のリードフレームの端部に半導体素子が載設され、前記半導体素子の電極と該半導体素子が載設されたリードフレーム以外の少なくとも一本のリードフレームの端部とがボンディングワイヤによって架空配線され、前記半導体素子と前記ボンディングワイヤとを含む前記複数本のリードフレームの端部が封止樹脂によって樹脂封止された半導体装置であって、
前記封止樹脂は、平側面と、前記リードフレームが延出した底面と、前記平側面と前記底面との交線部を有し、
前記底面は、前記半導体素子の光軸に垂直な面に対して所定の角度で傾斜し、
前記封止樹脂の底面から延出したリードフレームのうちの少なくとも一本のリードフレームには、該リードフレームの延出方向に垂直な方向に突出したリードストッパーが形成されており、前記封止樹脂は、前記交線部と前記リードストッパーの下面とは前記半導体素子の光軸に垂直な面上の略同一平面上に位置していることを特徴とする半導体装置。 - 前記半導体素子は、LEDチップ、フォトダイオードチップ、PINフォトダイオードチップ及びフォトトランジスタチップの群の中から選ばれた少なくとも1つであることを特徴とする請求項1に記載の半導体装置。
- 前記樹脂封止は、キャスティングによって行なわれることを特徴とする請求項1または2のいずれか1項に記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005325957A JP4945116B2 (ja) | 2005-11-10 | 2005-11-10 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005325957A JP4945116B2 (ja) | 2005-11-10 | 2005-11-10 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007134491A JP2007134491A (ja) | 2007-05-31 |
JP4945116B2 true JP4945116B2 (ja) | 2012-06-06 |
Family
ID=38155904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005325957A Expired - Fee Related JP4945116B2 (ja) | 2005-11-10 | 2005-11-10 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4945116B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009246343A (ja) * | 2008-03-11 | 2009-10-22 | Rohm Co Ltd | 半導体発光装置およびその製造方法 |
JP5556369B2 (ja) * | 2010-05-25 | 2014-07-23 | 日亜化学工業株式会社 | 発光装置及びそれを用いた表示装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0444171A (ja) * | 1990-06-11 | 1992-02-13 | Matsushita Graphic Commun Syst Inc | 情報ファイルシステム |
JP3126210B2 (ja) * | 1992-02-27 | 2001-01-22 | ローム株式会社 | 発光ダイオード装置の製造方法 |
JPH06310764A (ja) * | 1993-04-27 | 1994-11-04 | Sanyo Electric Co Ltd | 発光ダイオードランプ |
JP2003204086A (ja) * | 2001-10-23 | 2003-07-18 | Sharp Corp | 発光ダイオードランプ及びその製造方法 |
JP2004319591A (ja) * | 2003-04-11 | 2004-11-11 | Sharp Corp | 半導体発光装置およびその製造方法 |
-
2005
- 2005-11-10 JP JP2005325957A patent/JP4945116B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2007134491A (ja) | 2007-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4739851B2 (ja) | 表面実装型半導体装置 | |
JP5457391B2 (ja) | Ledパッケージ組立体 | |
JP5933959B2 (ja) | 半導体光学装置 | |
JP2005294736A (ja) | 半導体発光装置の製造方法 | |
KR101899464B1 (ko) | 발광다이오드 패키지 및 이를 포함하는 발광모듈 | |
JP2009081346A (ja) | 光学デバイスおよびその製造方法 | |
JP2002094122A (ja) | 光源装置及びその製造方法 | |
JP6204577B2 (ja) | オプトエレクトロニクス部品およびその製造方法 | |
US20130153952A1 (en) | Light emitting device, and package array for light emitting device | |
JP6453399B2 (ja) | レーザ素子およびその製造方法 | |
JP2010516050A (ja) | オプトエレクトロニクス部品用のハウジング及びハウジングにおけるオプトエレクトロニクス部品の配置 | |
JP3993302B2 (ja) | 半導体装置 | |
US9159893B2 (en) | Light emitting device including lead having terminal part and exposed part, and method for manufacturing the same | |
WO2004102685A1 (en) | Light emitting device, package structure thereof and manufacturing method thereof | |
KR100834136B1 (ko) | 광소자 패키지 및 그 제조방법 | |
US9615493B2 (en) | Light emitting device, and method for manufacturing circuit board | |
US9018653B2 (en) | Light emitting device, circuit board, packaging array for light emitting device, and method for manufacturing packaging array for light emitting device | |
JP2001144334A (ja) | 光半導体装置及び形成方法 | |
JP4945116B2 (ja) | 半導体装置 | |
US20060033117A1 (en) | Light-emitting diode and mehtod for its production | |
JP6442611B2 (ja) | チップ・ハウジングを製造するためのリード・フレームおよび方法 | |
KR101967261B1 (ko) | 이미지 센서 패키지 및 이것의 제조 방법 | |
JP2009295883A (ja) | Ledチップ実装用基板の製造方法、ledチップ実装用基板のモールド金型、ledチップ実装用リードフレーム、ledチップ実装用基板、及び、led | |
KR101946242B1 (ko) | 반도체 발광소자 및 이의 제조 방법 | |
JP2005251824A (ja) | 発光ダイオード |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081020 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110308 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110329 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110422 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120228 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120305 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4945116 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150309 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |