JP6092233B2 - 部品装着機および部品保持デバイス昇降制御方法 - Google Patents

部品装着機および部品保持デバイス昇降制御方法 Download PDF

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Publication number
JP6092233B2
JP6092233B2 JP2014537870A JP2014537870A JP6092233B2 JP 6092233 B2 JP6092233 B2 JP 6092233B2 JP 2014537870 A JP2014537870 A JP 2014537870A JP 2014537870 A JP2014537870 A JP 2014537870A JP 6092233 B2 JP6092233 B2 JP 6092233B2
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Japan
Prior art keywords
component
component mounting
head
height
holding device
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JP2014537870A
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Japanese (ja)
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JPWO2014049688A1 (ja
Inventor
文隆 前田
文隆 前田
伊藤　秀俊
秀俊 伊藤
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of JPWO2014049688A1 publication Critical patent/JPWO2014049688A1/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2014537870A 2012-09-25 2012-09-25 部品装着機および部品保持デバイス昇降制御方法 Active JP6092233B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/074572 WO2014049688A1 (fr) 2012-09-25 2012-09-25 Appareil de montage de composants et procédé de commande de l'élévation du dispositif de support de composant

Publications (2)

Publication Number Publication Date
JPWO2014049688A1 JPWO2014049688A1 (ja) 2016-08-22
JP6092233B2 true JP6092233B2 (ja) 2017-03-08

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ID=50387157

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JP2014537870A Active JP6092233B2 (ja) 2012-09-25 2012-09-25 部品装着機および部品保持デバイス昇降制御方法

Country Status (2)

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JP (1) JP6092233B2 (fr)
WO (1) WO2014049688A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10624250B2 (en) * 2015-02-13 2020-04-14 Fuji Corporation Mounting processing unit for arranging components on a board
JP7008835B2 (ja) * 2018-09-27 2022-01-25 株式会社Fuji 部品供給装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3253218B2 (ja) * 1994-06-28 2002-02-04 ヤマハ発動機株式会社 実装機の位置補正装置
JPH11186795A (ja) * 1997-12-19 1999-07-09 Matsushita Electric Ind Co Ltd 電子部品実装方法及びその装置
JP2006041260A (ja) * 2004-07-28 2006-02-09 Juki Corp 電子部品搭載装置のノズル位置補正方法
JP4720786B2 (ja) * 2007-05-22 2011-07-13 パナソニック株式会社 部品実装装置
JP2008294030A (ja) * 2007-05-22 2008-12-04 Panasonic Corp 部品実装装置および部品実装方法
JP5223819B2 (ja) * 2009-08-20 2013-06-26 パナソニック株式会社 基板固定装置及び電子部品実装装置

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Publication number Publication date
WO2014049688A1 (fr) 2014-04-03
JPWO2014049688A1 (ja) 2016-08-22

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