JP6092233B2 - 部品装着機および部品保持デバイス昇降制御方法 - Google Patents
部品装着機および部品保持デバイス昇降制御方法 Download PDFInfo
- Publication number
- JP6092233B2 JP6092233B2 JP2014537870A JP2014537870A JP6092233B2 JP 6092233 B2 JP6092233 B2 JP 6092233B2 JP 2014537870 A JP2014537870 A JP 2014537870A JP 2014537870 A JP2014537870 A JP 2014537870A JP 6092233 B2 JP6092233 B2 JP 6092233B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- component mounting
- head
- height
- holding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims description 26
- 238000005259 measurement Methods 0.000 claims description 74
- 239000000758 substrate Substances 0.000 claims description 70
- 238000012937 correction Methods 0.000 claims description 13
- 238000006073 displacement reaction Methods 0.000 claims description 13
- 230000032258 transport Effects 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/074572 WO2014049688A1 (fr) | 2012-09-25 | 2012-09-25 | Appareil de montage de composants et procédé de commande de l'élévation du dispositif de support de composant |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014049688A1 JPWO2014049688A1 (ja) | 2016-08-22 |
JP6092233B2 true JP6092233B2 (ja) | 2017-03-08 |
Family
ID=50387157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014537870A Active JP6092233B2 (ja) | 2012-09-25 | 2012-09-25 | 部品装着機および部品保持デバイス昇降制御方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6092233B2 (fr) |
WO (1) | WO2014049688A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10624250B2 (en) * | 2015-02-13 | 2020-04-14 | Fuji Corporation | Mounting processing unit for arranging components on a board |
JP7008835B2 (ja) * | 2018-09-27 | 2022-01-25 | 株式会社Fuji | 部品供給装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3253218B2 (ja) * | 1994-06-28 | 2002-02-04 | ヤマハ発動機株式会社 | 実装機の位置補正装置 |
JPH11186795A (ja) * | 1997-12-19 | 1999-07-09 | Matsushita Electric Ind Co Ltd | 電子部品実装方法及びその装置 |
JP2006041260A (ja) * | 2004-07-28 | 2006-02-09 | Juki Corp | 電子部品搭載装置のノズル位置補正方法 |
JP4720786B2 (ja) * | 2007-05-22 | 2011-07-13 | パナソニック株式会社 | 部品実装装置 |
JP2008294030A (ja) * | 2007-05-22 | 2008-12-04 | Panasonic Corp | 部品実装装置および部品実装方法 |
JP5223819B2 (ja) * | 2009-08-20 | 2013-06-26 | パナソニック株式会社 | 基板固定装置及び電子部品実装装置 |
-
2012
- 2012-09-25 WO PCT/JP2012/074572 patent/WO2014049688A1/fr active Application Filing
- 2012-09-25 JP JP2014537870A patent/JP6092233B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
WO2014049688A1 (fr) | 2014-04-03 |
JPWO2014049688A1 (ja) | 2016-08-22 |
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