JP6089507B2 - 発光装置およびその製造方法 - Google Patents

発光装置およびその製造方法 Download PDF

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Publication number
JP6089507B2
JP6089507B2 JP2012192143A JP2012192143A JP6089507B2 JP 6089507 B2 JP6089507 B2 JP 6089507B2 JP 2012192143 A JP2012192143 A JP 2012192143A JP 2012192143 A JP2012192143 A JP 2012192143A JP 6089507 B2 JP6089507 B2 JP 6089507B2
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Japan
Prior art keywords
light
emitting device
conductive material
side electrode
anisotropic conductive
Prior art date
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JP2012192143A
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English (en)
Japanese (ja)
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JP2014049642A5 (enExample
JP2014049642A (ja
Inventor
山田　孝夫
孝夫 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2012192143A priority Critical patent/JP6089507B2/ja
Priority to US14/011,628 priority patent/US9337405B2/en
Priority to CN201310381486.3A priority patent/CN103682038B/zh
Priority to EP13182215.7A priority patent/EP2704223B1/en
Publication of JP2014049642A publication Critical patent/JP2014049642A/ja
Publication of JP2014049642A5 publication Critical patent/JP2014049642A5/ja
Application granted granted Critical
Publication of JP6089507B2 publication Critical patent/JP6089507B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Led Device Packages (AREA)
JP2012192143A 2012-08-31 2012-08-31 発光装置およびその製造方法 Active JP6089507B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012192143A JP6089507B2 (ja) 2012-08-31 2012-08-31 発光装置およびその製造方法
US14/011,628 US9337405B2 (en) 2012-08-31 2013-08-27 Light emitting device and method for manufacturing the same
CN201310381486.3A CN103682038B (zh) 2012-08-31 2013-08-28 发光装置及其制造方法
EP13182215.7A EP2704223B1 (en) 2012-08-31 2013-08-29 Light emitting device and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012192143A JP6089507B2 (ja) 2012-08-31 2012-08-31 発光装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2014049642A JP2014049642A (ja) 2014-03-17
JP2014049642A5 JP2014049642A5 (enExample) 2015-10-15
JP6089507B2 true JP6089507B2 (ja) 2017-03-08

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JP2012192143A Active JP6089507B2 (ja) 2012-08-31 2012-08-31 発光装置およびその製造方法

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JP (1) JP6089507B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6447018B2 (ja) * 2014-10-31 2019-01-09 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP6245229B2 (ja) 2015-07-24 2017-12-13 トヨタ自動車株式会社 半導体装置と半導体装置の製造方法
JP6897729B2 (ja) * 2017-10-12 2021-07-07 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02206670A (ja) * 1989-02-06 1990-08-16 Hitachi Chem Co Ltd 異方導電性を有する回路接続用熱伝導性接着剤組成物及び熱伝導性接着フィルム
JPH0864638A (ja) * 1994-08-26 1996-03-08 Rohm Co Ltd 半導体装置及びその実装構造
US7256483B2 (en) * 2004-10-28 2007-08-14 Philips Lumileds Lighting Company, Llc Package-integrated thin film LED
US7754507B2 (en) * 2005-06-09 2010-07-13 Philips Lumileds Lighting Company, Llc Method of removing the growth substrate of a semiconductor light emitting device
US7867793B2 (en) * 2007-07-09 2011-01-11 Koninklijke Philips Electronics N.V. Substrate removal during LED formation
US7687810B2 (en) * 2007-10-22 2010-03-30 Philips Lumileds Lighting Company, Llc Robust LED structure for substrate lift-off
JP5521325B2 (ja) * 2008-12-27 2014-06-11 日亜化学工業株式会社 発光装置及びその製造方法
JP5402109B2 (ja) * 2009-02-27 2014-01-29 デクセリアルズ株式会社 異方性導電フィルム及び発光装置
JP5689225B2 (ja) * 2009-03-31 2015-03-25 日亜化学工業株式会社 発光装置
US8384121B2 (en) * 2010-06-29 2013-02-26 Cooledge Lighting Inc. Electronic devices with yielding substrates
WO2011108664A1 (ja) * 2010-03-03 2011-09-09 有限会社Ｍｔｅｃ 光半導体装置
CN102194985B (zh) * 2010-03-04 2013-11-06 展晶科技(深圳)有限公司 晶圆级封装之方法
JP5455764B2 (ja) * 2010-04-23 2014-03-26 シチズンホールディングス株式会社 半導体発光装置及びその製造方法
JP5451534B2 (ja) * 2010-06-07 2014-03-26 株式会社東芝 半導体発光装置および半導体発光装置の製造方法
JP5747527B2 (ja) * 2011-01-28 2015-07-15 日亜化学工業株式会社 発光装置の製造方法

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