JP6087573B2 - 処理装置、それを用いた物品の製造方法 - Google Patents
処理装置、それを用いた物品の製造方法 Download PDFInfo
- Publication number
- JP6087573B2 JP6087573B2 JP2012233558A JP2012233558A JP6087573B2 JP 6087573 B2 JP6087573 B2 JP 6087573B2 JP 2012233558 A JP2012233558 A JP 2012233558A JP 2012233558 A JP2012233558 A JP 2012233558A JP 6087573 B2 JP6087573 B2 JP 6087573B2
- Authority
- JP
- Japan
- Prior art keywords
- support member
- chamber
- support
- opening
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K5/00—Irradiation devices
- G21K5/08—Holders for targets or for other objects to be irradiated
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electron Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Diaphragms And Bellows (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012233558A JP6087573B2 (ja) | 2012-10-23 | 2012-10-23 | 処理装置、それを用いた物品の製造方法 |
| US14/045,880 US9310688B2 (en) | 2012-10-23 | 2013-10-04 | Processing apparatus and article manufacturing method using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012233558A JP6087573B2 (ja) | 2012-10-23 | 2012-10-23 | 処理装置、それを用いた物品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014086524A JP2014086524A (ja) | 2014-05-12 |
| JP2014086524A5 JP2014086524A5 (enExample) | 2015-12-10 |
| JP6087573B2 true JP6087573B2 (ja) | 2017-03-01 |
Family
ID=50485060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012233558A Expired - Fee Related JP6087573B2 (ja) | 2012-10-23 | 2012-10-23 | 処理装置、それを用いた物品の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9310688B2 (enExample) |
| JP (1) | JP6087573B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201643561A (zh) * | 2015-04-17 | 2016-12-16 | 尼康股份有限公司 | 曝光系統 |
| CN105003798A (zh) * | 2015-08-18 | 2015-10-28 | 赵东顺 | 一种建筑施工中工程测量设备的支撑装置 |
| WO2017118508A1 (en) | 2016-01-07 | 2017-07-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2018045958A (ja) * | 2016-09-16 | 2018-03-22 | 東レエンジニアリング株式会社 | 撮像装置および電子線照射装置 |
| WO2018213825A1 (en) | 2017-05-19 | 2018-11-22 | Massachusetts Institute Of Technology | Transport system having a magnetically levitated transportation stage |
| CN108478264B (zh) * | 2018-02-05 | 2020-09-25 | 青岛大学附属医院 | 一种便携式助产装置 |
| WO2019204692A1 (en) * | 2018-04-20 | 2019-10-24 | Massachusetts Institute Of Technology | Magnetically-levitated transporter |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2666953B2 (ja) * | 1988-03-30 | 1997-10-22 | 株式会社東芝 | 荷電ピーム描画装置 |
| JP3200282B2 (ja) * | 1993-07-21 | 2001-08-20 | キヤノン株式会社 | 処理システム及びこれを用いたデバイス製造方法 |
| TW559688B (en) | 1999-04-19 | 2003-11-01 | Asml Netherlands Bv | Lithographic projection apparatus, vacuum apparatus, low-stiffness seal for sealing between vacuum chamber wall and elongate rod, device manufacturing method and integrated circuit manufactured thereof |
| US6778258B2 (en) * | 2001-10-19 | 2004-08-17 | Asml Holding N.V. | Wafer handling system for use in lithography patterning |
| JP2007220910A (ja) * | 2006-02-16 | 2007-08-30 | Nsk Ltd | 真空用位置決め装置 |
| JP2009099723A (ja) * | 2007-10-16 | 2009-05-07 | Nikon Corp | 露光装置 |
| JP2010080861A (ja) * | 2008-09-29 | 2010-04-08 | Nikon Corp | 転写装置及びデバイス製造方法 |
| JP5277059B2 (ja) * | 2009-04-16 | 2013-08-28 | 株式会社日立ハイテクノロジーズ | 成膜装置及び成膜システム |
| JP5758750B2 (ja) * | 2010-10-29 | 2015-08-05 | ギガフォトン株式会社 | 極端紫外光生成システム |
-
2012
- 2012-10-23 JP JP2012233558A patent/JP6087573B2/ja not_active Expired - Fee Related
-
2013
- 2013-10-04 US US14/045,880 patent/US9310688B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20140111780A1 (en) | 2014-04-24 |
| US9310688B2 (en) | 2016-04-12 |
| JP2014086524A (ja) | 2014-05-12 |
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