JP6083769B2 - 小型製造装置及びこれを用いた製造システム - Google Patents
小型製造装置及びこれを用いた製造システム Download PDFInfo
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- JP6083769B2 JP6083769B2 JP2015501439A JP2015501439A JP6083769B2 JP 6083769 B2 JP6083769 B2 JP 6083769B2 JP 2015501439 A JP2015501439 A JP 2015501439A JP 2015501439 A JP2015501439 A JP 2015501439A JP 6083769 B2 JP6083769 B2 JP 6083769B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 87
- 238000012545 processing Methods 0.000 claims description 194
- 239000000758 substrate Substances 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 24
- 238000002360 preparation method Methods 0.000 claims description 12
- 210000002159 anterior chamber Anatomy 0.000 claims description 6
- 230000007723 transport mechanism Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 84
- 235000012431 wafers Nutrition 0.000 description 44
- 230000007246 mechanism Effects 0.000 description 14
- 230000007704 transition Effects 0.000 description 14
- 238000012546 transfer Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000011161 development Methods 0.000 description 6
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
以下、この発明の実施の形態1について、本発明を小型の半導体製造装置に適用する場合を例に採って説明する。
(1)処理室正常動作信号NORM_PROCESS:処理室110が正常動作中であることを示す信号
(2)搬入要求信号REQ_LOAD:前室120から処理室110へ半導体ウェハ140を搬入するように要求する信号
(3)搬出要求信号REQ_UNLOAD:処理室110から前室120に半導体ウェハ140を搬出するように要求する信号
(4)前室正常動作信号NORM_PORT:前室120が正常動作中であることを示す信号
(5)遷移要求信号AUTO:処理室110へ自動モードへの遷移を要求する信号
(6)搬入通知信号ACK_LOAD:半導体ウェハ140の処理室110への搬入を終了して、処理室110にプロセスの開始を許可する信号
(7)搬出通知信号ACK_UNLOAD:半導体ウェハ140の処理室110からの搬出を終了して、処理室110に次回プロセスの準備開始を許可する信号
110 処理室
111 搬入口
112,121 載置台
113 処理室操作部
114 処理室制御部
115,126 電源ユニット
120 前室
122 搬送機構
123 搬出口
124 前室操作部
125 前室制御部
130 ゲートバルブ
140 半導体ウェハ
150 集中管理部
311,321 発光素子
312,322 受光素子
313 定電流ダイオード
314 逆接続保護用ダイオード
Claims (3)
- 処理基板に所望の処理を施す処理室と、
内部に設けられた搬送機構を用いて、該処理室との間で前記処理基板の搬入及び搬出を行う前室と、
前記処理室による前記処理基板の処理を制御するために該処理室に設けられた処理室用制御部と、
前記処理室と前記前室との間での前記処理基板の搬入及び搬出を制御するために該前室に設けられた前室用制御部と、
を備え、
前記処理室用制御部は、
前記処理の準備が終了すると、前記前室から前記処理室への該処理基板の搬入を前記前室用制御部に要求する搬入要求信号を送信し、
前記処理基板の前記搬入が終了したことを示す搬入通知信号を前記前室用制御部から受信すると、前記処理を開始し、
該処理が終了すると、前記処理室から前記前室への前記処理基板の搬出を前記前室用制御部に要求する搬出要求信号を送信し、
前記処理基板の前記搬出が終了したことを示す搬出通知信号を前記前室用制御部から受信すると、前記処理の準備を開始し、
前記前室用制御部は、
前記処理室用制御部から前記搬入要求信号を受信すると、前記処理基板の搬入動作を開始し、
前記処理基板の搬入動作が終了すると、前記搬入通知信号を前記処理室用制御部に送信し、
該処理室用制御部から前記搬出要求信号を受信すると、前記処理基板の搬出動作を開始し、
該処理基板が前記処理室から搬出されると、前記搬出通知信号を前記処理室用制御部に送信する、
ことを特徴とする小型製造装置。 - 前記前室は、前記処理室への前記処理基板の搬入及び搬出を行う際に開かれるロードポートを更に備え、
前記前室用制御部は、
前記処理室用制御部から前記搬入要求信号を受信すると、前記処理基板の搬入前に前記ロードポートを開く動作と、該処理基板の搬入後に前記ロードポートを閉じる動作との制御を更に行い、
該処理室用制御部から前記搬出要求信号を受信すると、前記処理基板の搬出前に前記ロードポートを開く動作と、該処理基板の搬出後に前記ロードポートを閉じる動作との制御を更に行う、
ことを特徴とする請求項1に記載の小型製造装置。 - 請求項1又は2に記載の小型製造装置を複数台備える製造システムであって、
いずれかの該小型製造装置として、前記処理室の構成が異なるものを一台以上含み、且つ、全ての該小型製造装置において、前記前室の構成が互いに同一であることを特徴とする製造システム。
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JP2013030596 | 2013-02-20 | ||
JP2013030596 | 2013-02-20 | ||
PCT/JP2014/053617 WO2014129421A1 (ja) | 2013-02-20 | 2014-02-17 | 小型製造装置及びこれを用いた製造システム |
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JPWO2014129421A1 JPWO2014129421A1 (ja) | 2017-02-02 |
JP6083769B2 true JP6083769B2 (ja) | 2017-02-22 |
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US (1) | US9478452B2 (ja) |
EP (1) | EP2960932B1 (ja) |
JP (1) | JP6083769B2 (ja) |
KR (1) | KR20150120436A (ja) |
CN (1) | CN105009270B (ja) |
WO (1) | WO2014129421A1 (ja) |
Families Citing this family (1)
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CN109249567B (zh) * | 2018-10-25 | 2023-06-23 | 遂宁市金虹机械厂 | 一种滴塑机卸模控制系统及方法 |
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US6714832B1 (en) * | 1996-09-11 | 2004-03-30 | Hitachi, Ltd. | Operating method of vacuum processing system and vacuum processing system |
JPH10112489A (ja) * | 1996-10-07 | 1998-04-28 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および基板処理装置 |
US20020045967A1 (en) * | 2000-10-17 | 2002-04-18 | Masayuki Nakano | Substrate processing system |
JP4722416B2 (ja) | 2004-06-16 | 2011-07-13 | 株式会社日立国際電気 | 半導体製造装置及び基板搬送方法並びに半導体装置の製造方法 |
JP4985031B2 (ja) * | 2007-03-29 | 2012-07-25 | 東京エレクトロン株式会社 | 真空処理装置、真空処理装置の運転方法及び記憶媒体 |
DE102007025339A1 (de) * | 2007-05-31 | 2008-12-04 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter |
JP4616873B2 (ja) * | 2007-09-28 | 2011-01-19 | 東京エレクトロン株式会社 | 半導体製造装置、基板保持方法及びプログラム |
JP5575507B2 (ja) * | 2010-03-02 | 2014-08-20 | 株式会社日立国際電気 | 基板処理装置、基板搬送方法、半導体装置の製造方法および基板処理装置のメンテナンス方法 |
JP5361002B2 (ja) * | 2010-09-01 | 2013-12-04 | 独立行政法人産業技術総合研究所 | デバイス製造装置および方法 |
JP5773200B2 (ja) * | 2011-07-28 | 2015-09-02 | 株式会社ダイフク | 処理設備 |
JP5660391B2 (ja) * | 2011-09-06 | 2015-01-28 | 株式会社ダイフク | 物品搬送設備 |
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- 2014-02-17 KR KR1020157025353A patent/KR20150120436A/ko active Search and Examination
- 2014-02-17 CN CN201480009585.1A patent/CN105009270B/zh active Active
- 2014-02-17 WO PCT/JP2014/053617 patent/WO2014129421A1/ja active Application Filing
- 2014-02-17 JP JP2015501439A patent/JP6083769B2/ja active Active
- 2014-02-17 US US14/768,352 patent/US9478452B2/en active Active
- 2014-02-17 EP EP14753798.9A patent/EP2960932B1/en active Active
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Publication number | Publication date |
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EP2960932A4 (en) | 2016-11-09 |
EP2960932B1 (en) | 2017-08-30 |
KR20150120436A (ko) | 2015-10-27 |
WO2014129421A1 (ja) | 2014-08-28 |
EP2960932A1 (en) | 2015-12-30 |
US9478452B2 (en) | 2016-10-25 |
CN105009270A (zh) | 2015-10-28 |
JPWO2014129421A1 (ja) | 2017-02-02 |
US20150380289A1 (en) | 2015-12-31 |
CN105009270B (zh) | 2017-06-30 |
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