JP6066612B2 - 液体吐出ヘッド及びその製造方法 - Google Patents
液体吐出ヘッド及びその製造方法 Download PDFInfo
- Publication number
- JP6066612B2 JP6066612B2 JP2012173756A JP2012173756A JP6066612B2 JP 6066612 B2 JP6066612 B2 JP 6066612B2 JP 2012173756 A JP2012173756 A JP 2012173756A JP 2012173756 A JP2012173756 A JP 2012173756A JP 6066612 B2 JP6066612 B2 JP 6066612B2
- Authority
- JP
- Japan
- Prior art keywords
- bump
- substrate
- electrode pad
- protrusion
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012173756A JP6066612B2 (ja) | 2012-08-06 | 2012-08-06 | 液体吐出ヘッド及びその製造方法 |
| US13/956,737 US9174439B2 (en) | 2012-08-06 | 2013-08-01 | Liquid ejection head and method for manufacturing liquid ejection head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012173756A JP6066612B2 (ja) | 2012-08-06 | 2012-08-06 | 液体吐出ヘッド及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014030980A JP2014030980A (ja) | 2014-02-20 |
| JP2014030980A5 JP2014030980A5 (enExample) | 2015-09-10 |
| JP6066612B2 true JP6066612B2 (ja) | 2017-01-25 |
Family
ID=50025075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012173756A Expired - Fee Related JP6066612B2 (ja) | 2012-08-06 | 2012-08-06 | 液体吐出ヘッド及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9174439B2 (enExample) |
| JP (1) | JP6066612B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016141149A (ja) * | 2015-02-05 | 2016-08-08 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法、及び該製造方法で製造された液体吐出ヘッド用基板 |
| TWI645586B (zh) * | 2017-12-05 | 2018-12-21 | 國家中山科學研究院 | 一種可提升光均勻度之中空奈米結構二次光學透鏡之製作方法 |
| CN119852281B (zh) * | 2025-03-19 | 2025-09-23 | 深圳市联合蓝海应用材料科技股份有限公司 | 一种半导体器件结构及其制备方法和芯片 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0797587B2 (ja) * | 1987-03-12 | 1995-10-18 | 株式会社東芝 | 半導体装置の製造方法 |
| JP2653179B2 (ja) * | 1989-08-21 | 1997-09-10 | 富士電機株式会社 | 集積回路装置用バンプ電極の製造方法 |
| US20020053734A1 (en) * | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
| JP3584509B2 (ja) * | 1994-12-27 | 2004-11-04 | 松下電器産業株式会社 | インクジェットプリンタヘッド及びその製造方法 |
| US6833613B1 (en) * | 1997-12-18 | 2004-12-21 | Micron Technology, Inc. | Stacked semiconductor package having laser machined contacts |
| US6426556B1 (en) * | 2001-01-16 | 2002-07-30 | Megic Corporation | Reliable metal bumps on top of I/O pads with test probe marks |
| JP4630680B2 (ja) * | 2005-01-31 | 2011-02-09 | キヤノン株式会社 | 半導体素子の製造方法およびインクジェット記録ヘッドの製造方法 |
| WO2007000697A2 (en) * | 2005-06-29 | 2007-01-04 | Koninklijke Philips Electronics N.V. | Method of manufacturing an assembly and assembly |
| US8438729B2 (en) * | 2006-03-09 | 2013-05-14 | Canon Kabushiki Kaisha | Method of producing liquid discharge head |
| JP4822353B2 (ja) * | 2006-03-09 | 2011-11-24 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
| JP2007307833A (ja) | 2006-05-19 | 2007-11-29 | Canon Inc | インクジェット記録ヘッド |
| JP5168443B2 (ja) * | 2006-08-08 | 2013-03-21 | セイコーエプソン株式会社 | 圧電素子、アクチュエータ装置、液体噴射ヘッド及び液体噴射装置 |
| JP2008153470A (ja) * | 2006-12-18 | 2008-07-03 | Renesas Technology Corp | 半導体装置および半導体装置の製造方法 |
| JP5379527B2 (ja) * | 2009-03-19 | 2013-12-25 | パナソニック株式会社 | 半導体装置 |
| US8581420B2 (en) * | 2010-10-18 | 2013-11-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Under-bump metallization (UBM) structure and method of forming the same |
-
2012
- 2012-08-06 JP JP2012173756A patent/JP6066612B2/ja not_active Expired - Fee Related
-
2013
- 2013-08-01 US US13/956,737 patent/US9174439B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20140035999A1 (en) | 2014-02-06 |
| US9174439B2 (en) | 2015-11-03 |
| JP2014030980A (ja) | 2014-02-20 |
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