JP6065408B2 - 発光装置およびその製造方法 - Google Patents

発光装置およびその製造方法 Download PDF

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Publication number
JP6065408B2
JP6065408B2 JP2012103116A JP2012103116A JP6065408B2 JP 6065408 B2 JP6065408 B2 JP 6065408B2 JP 2012103116 A JP2012103116 A JP 2012103116A JP 2012103116 A JP2012103116 A JP 2012103116A JP 6065408 B2 JP6065408 B2 JP 6065408B2
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Japan
Prior art keywords
light emitting
resin
light
emitting element
emitting device
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JP2012103116A
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English (en)
Japanese (ja)
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JP2013232484A5 (enExample
JP2013232484A (ja
Inventor
圭宏 木村
圭宏 木村
佐藤　崇
崇 佐藤
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Nichia Corp
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Nichia Corp
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Priority to JP2012103116A priority Critical patent/JP6065408B2/ja
Publication of JP2013232484A publication Critical patent/JP2013232484A/ja
Publication of JP2013232484A5 publication Critical patent/JP2013232484A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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JP2012103116A 2012-04-27 2012-04-27 発光装置およびその製造方法 Active JP6065408B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012103116A JP6065408B2 (ja) 2012-04-27 2012-04-27 発光装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012103116A JP6065408B2 (ja) 2012-04-27 2012-04-27 発光装置およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016094145A Division JP2016139833A (ja) 2016-05-09 2016-05-09 発光装置

Publications (3)

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JP2013232484A JP2013232484A (ja) 2013-11-14
JP2013232484A5 JP2013232484A5 (enExample) 2015-06-11
JP6065408B2 true JP6065408B2 (ja) 2017-01-25

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JP2012103116A Active JP6065408B2 (ja) 2012-04-27 2012-04-27 発光装置およびその製造方法

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JP (1) JP6065408B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180137841A (ko) * 2017-06-19 2018-12-28 엘지이노텍 주식회사 반도체 소자 패키지

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10490711B2 (en) 2014-10-07 2019-11-26 Nichia Corporation Light emitting device
JP6657735B2 (ja) * 2014-10-07 2020-03-04 日亜化学工業株式会社 発光装置
DE112016002425B4 (de) 2015-05-29 2022-03-03 Citizen Electronics Co., Ltd. Herstellungsverfahren für eine Licht emittierende Vorrichtung
JP6715593B2 (ja) * 2015-12-18 2020-07-01 シチズン電子株式会社 発光装置
JP6387954B2 (ja) 2015-12-24 2018-09-12 日亜化学工業株式会社 波長変換部材を用いた発光装置の製造方法
JP6685738B2 (ja) * 2016-01-25 2020-04-22 コーデンシ株式会社 発光装置
JP7030057B2 (ja) * 2016-03-10 2022-03-04 ルミレッズ ホールディング ベーフェー Ｌｅｄモジュール
JP7372512B2 (ja) * 2018-09-28 2023-11-01 日亜化学工業株式会社 発光装置および発光装置の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3546650B2 (ja) * 1997-07-28 2004-07-28 日亜化学工業株式会社 発光ダイオードの形成方法
JP2004119838A (ja) * 2002-09-27 2004-04-15 Toshiba Corp 光半導体装置の製造方法
JP2004288760A (ja) * 2003-03-20 2004-10-14 Stanley Electric Co Ltd 多層ｌｅｄ
JP4539235B2 (ja) * 2004-08-27 2010-09-08 日亜化学工業株式会社 半導体装置およびその製造方法
JP4582773B2 (ja) * 2004-09-14 2010-11-17 スタンレー電気株式会社 Ｌｅｄ装置
JP4756841B2 (ja) * 2004-09-29 2011-08-24 スタンレー電気株式会社 半導体発光装置の製造方法
JP4984824B2 (ja) * 2006-10-26 2012-07-25 豊田合成株式会社 発光装置
JP2008218511A (ja) * 2007-02-28 2008-09-18 Toyoda Gosei Co Ltd 半導体発光装置及びその製造方法
US7777412B2 (en) * 2007-03-22 2010-08-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Phosphor converted LED with improved uniformity and having lower phosphor requirements
WO2009028861A2 (en) * 2007-08-31 2009-03-05 Lg Innotek Co., Ltd Light emitting device package
JP5286585B2 (ja) * 2007-10-05 2013-09-11 シャープ株式会社 発光装置
TW201003979A (en) * 2008-07-11 2010-01-16 Harvatek Corp Light emitting diode chip packaging structure using sedimentation and manufacturing method thereof
JP2011071242A (ja) * 2009-09-24 2011-04-07 Toshiba Lighting & Technology Corp 発光装置及び照明装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180137841A (ko) * 2017-06-19 2018-12-28 엘지이노텍 주식회사 반도체 소자 패키지
KR102388371B1 (ko) * 2017-06-19 2022-04-19 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지

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Publication number Publication date
JP2013232484A (ja) 2013-11-14

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