JP6064519B2 - レーザー加工装置、および、パターン付き基板の加工条件設定方法 - Google Patents

レーザー加工装置、および、パターン付き基板の加工条件設定方法 Download PDF

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Publication number
JP6064519B2
JP6064519B2 JP2012237738A JP2012237738A JP6064519B2 JP 6064519 B2 JP6064519 B2 JP 6064519B2 JP 2012237738 A JP2012237738 A JP 2012237738A JP 2012237738 A JP2012237738 A JP 2012237738A JP 6064519 B2 JP6064519 B2 JP 6064519B2
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JP
Japan
Prior art keywords
processing
offset
substrate
crack
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012237738A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014087806A (ja
Inventor
佑磨 岩坪
佑磨 岩坪
久司 五十川
久司 五十川
正平 長友
正平 長友
郁祥 中谷
郁祥 中谷
直哉 木山
直哉 木山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2012237738A priority Critical patent/JP6064519B2/ja
Priority to TW102120283A priority patent/TWI550754B/zh
Priority to KR1020130069851A priority patent/KR101854679B1/ko
Priority to CN201310337996.0A priority patent/CN103785957B/zh
Publication of JP2014087806A publication Critical patent/JP2014087806A/ja
Application granted granted Critical
Publication of JP6064519B2 publication Critical patent/JP6064519B2/ja
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
JP2012237738A 2012-10-29 2012-10-29 レーザー加工装置、および、パターン付き基板の加工条件設定方法 Active JP6064519B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012237738A JP6064519B2 (ja) 2012-10-29 2012-10-29 レーザー加工装置、および、パターン付き基板の加工条件設定方法
TW102120283A TWI550754B (zh) 2012-10-29 2013-06-07 A laser processing apparatus and a substrate having a pattern are provided
KR1020130069851A KR101854679B1 (ko) 2012-10-29 2013-06-18 레이저 가공 장치 및, 패턴이 있는 기판의 가공 조건 설정 방법
CN201310337996.0A CN103785957B (zh) 2012-10-29 2013-08-02 激光加工装置及具有图案的基板的加工条件设定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012237738A JP6064519B2 (ja) 2012-10-29 2012-10-29 レーザー加工装置、および、パターン付き基板の加工条件設定方法

Publications (2)

Publication Number Publication Date
JP2014087806A JP2014087806A (ja) 2014-05-15
JP6064519B2 true JP6064519B2 (ja) 2017-01-25

Family

ID=50662240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012237738A Active JP6064519B2 (ja) 2012-10-29 2012-10-29 レーザー加工装置、および、パターン付き基板の加工条件設定方法

Country Status (4)

Country Link
JP (1) JP6064519B2 (ko)
KR (1) KR101854679B1 (ko)
CN (1) CN103785957B (ko)
TW (1) TWI550754B (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020090913A1 (ja) * 2018-10-30 2020-05-07 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
US11833611B2 (en) 2018-10-30 2023-12-05 Hamamatsu Photonics K.K. Laser machining device
US11897056B2 (en) 2018-10-30 2024-02-13 Hamamatsu Photonics K.K. Laser processing device and laser processing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6127526B2 (ja) * 2012-10-29 2017-05-17 三星ダイヤモンド工業株式会社 レーザー加工装置、および、パターン付き基板の加工条件設定方法
KR101854676B1 (ko) * 2012-10-29 2018-06-20 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저 가공 장치 및, 패턴이 있는 기판의 가공 조건 설정 방법
JP6036173B2 (ja) * 2012-10-31 2016-11-30 三星ダイヤモンド工業株式会社 レーザー加工装置
JP6241174B2 (ja) * 2013-09-25 2017-12-06 三星ダイヤモンド工業株式会社 レーザー加工装置、および、パターン付き基板の加工条件設定方法
JP6388823B2 (ja) * 2014-12-01 2018-09-12 株式会社ディスコ レーザー加工装置
CN104827191A (zh) * 2015-05-12 2015-08-12 大族激光科技产业集团股份有限公司 蓝宝石的激光切割方法
JP6594699B2 (ja) * 2015-08-18 2019-10-23 浜松ホトニクス株式会社 加工対象物切断方法及び加工対象物切断装置
WO2017030039A1 (ja) * 2015-08-18 2017-02-23 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
JP6542630B2 (ja) 2015-09-29 2019-07-10 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
DE102016103055A1 (de) * 2015-12-22 2017-06-22 Konrad Gmbh Verfahren zum Bearbeiten eines Werkstücks
JP6801312B2 (ja) * 2016-09-07 2020-12-16 村田機械株式会社 レーザ加工機、及びレーザ加工方法
JP6912267B2 (ja) * 2017-05-09 2021-08-04 株式会社ディスコ レーザ加工方法

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JP4318415B2 (ja) * 2001-09-19 2009-08-26 三洋電機株式会社 レーザ溶接方法およびレーザ溶接装置
WO2003042895A1 (ko) * 2001-11-17 2003-05-22 Insstek Inc. Method and system for real-time monitoring and controlling height of deposit by using image photographing and image processing technology in laser cladding and laser-aided direct metal manufacturing process
ATE534142T1 (de) * 2002-03-12 2011-12-15 Hamamatsu Photonics Kk Verfahren zum auftrennen eines substrats
JP2009032832A (ja) * 2007-07-25 2009-02-12 Dainippon Screen Mfg Co Ltd 基板検出装置および基板処理装置
US8728916B2 (en) * 2009-02-25 2014-05-20 Nichia Corporation Method for manufacturing semiconductor element
KR101769158B1 (ko) * 2009-04-07 2017-08-17 하마마츠 포토닉스 가부시키가이샤 레이저 가공 장치 및 레이저 가공 방법
TWI446984B (zh) * 2010-06-28 2014-08-01 Mitsuboshi Diamond Ind Co Ltd 被加工物的加工方法、被加工物的分割方法及雷射加工裝置
JP5770436B2 (ja) * 2010-07-08 2015-08-26 株式会社ディスコ レーザー加工装置およびレーザー加工方法
KR101940333B1 (ko) * 2010-07-26 2019-01-18 하마마츠 포토닉스 가부시키가이샤 기판 가공 방법
TWI469842B (zh) * 2010-09-30 2015-01-21 Mitsuboshi Diamond Ind Co Ltd 雷射加工裝置、被加工物之加工方法及被加工物之分割方法
JP5670765B2 (ja) * 2011-01-13 2015-02-18 浜松ホトニクス株式会社 レーザ加工方法
JP5670764B2 (ja) * 2011-01-13 2015-02-18 浜松ホトニクス株式会社 レーザ加工方法
JP5472278B2 (ja) * 2011-12-15 2014-04-16 三星ダイヤモンド工業株式会社 レーザー加工装置
JP6003496B2 (ja) * 2012-10-02 2016-10-05 三星ダイヤモンド工業株式会社 パターン付き基板の加工方法
JP6127526B2 (ja) * 2012-10-29 2017-05-17 三星ダイヤモンド工業株式会社 レーザー加工装置、および、パターン付き基板の加工条件設定方法
JP6036173B2 (ja) * 2012-10-31 2016-11-30 三星ダイヤモンド工業株式会社 レーザー加工装置
JP2014216556A (ja) * 2013-04-26 2014-11-17 三星ダイヤモンド工業株式会社 パターン付き基板の加工方法およびパターン付き基板の加工装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020090913A1 (ja) * 2018-10-30 2020-05-07 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
US11833611B2 (en) 2018-10-30 2023-12-05 Hamamatsu Photonics K.K. Laser machining device
US11897056B2 (en) 2018-10-30 2024-02-13 Hamamatsu Photonics K.K. Laser processing device and laser processing method

Also Published As

Publication number Publication date
TW201417203A (zh) 2014-05-01
CN103785957A (zh) 2014-05-14
KR20140068753A (ko) 2014-06-09
CN103785957B (zh) 2016-08-24
KR101854679B1 (ko) 2018-05-04
TWI550754B (zh) 2016-09-21
JP2014087806A (ja) 2014-05-15

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