JP6063475B2 - パッケージングに適合する、ｍｅｍｓデバイスのウェハレベルキャッピング - Google Patents

パッケージングに適合する、ｍｅｍｓデバイスのウェハレベルキャッピング Download PDF

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Publication number
JP6063475B2
JP6063475B2 JP2014546048A JP2014546048A JP6063475B2 JP 6063475 B2 JP6063475 B2 JP 6063475B2 JP 2014546048 A JP2014546048 A JP 2014546048A JP 2014546048 A JP2014546048 A JP 2014546048A JP 6063475 B2 JP6063475 B2 JP 6063475B2
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Japan
Prior art keywords
sacrificial layer
cavity
overcoat
layer
sacrificial
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JP2014546048A
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English (en)
Japanese (ja)
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JP2015501734A (ja
JP2015501734A5 (https=
Inventor
ポール・エイ・コール
ラジャーシ・サハ
ネイサン・フリッツ
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Georgia Tech Research Corp
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Georgia Tech Research Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0108—Sacrificial polymer, ashing of organics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
JP2014546048A 2011-12-07 2012-12-06 パッケージングに適合する、ｍｅｍｓデバイスのウェハレベルキャッピング Expired - Fee Related JP6063475B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161567877P 2011-12-07 2011-12-07
US61/567,877 2011-12-07
PCT/US2012/068092 WO2013086083A1 (en) 2011-12-07 2012-12-06 Packaging compatible wafer level capping of mems devices

Publications (3)

Publication Number Publication Date
JP2015501734A JP2015501734A (ja) 2015-01-19
JP2015501734A5 JP2015501734A5 (https=) 2015-10-01
JP6063475B2 true JP6063475B2 (ja) 2017-01-18

Family

ID=47505302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014546048A Expired - Fee Related JP6063475B2 (ja) 2011-12-07 2012-12-06 パッケージングに適合する、ｍｅｍｓデバイスのウェハレベルキャッピング

Country Status (8)

Country Link
US (1) US8765512B2 (https=)
EP (1) EP2788280B1 (https=)
JP (1) JP6063475B2 (https=)
KR (1) KR101583498B1 (https=)
CN (1) CN104093662B (https=)
SG (1) SG11201402261SA (https=)
TW (1) TWI600609B (https=)
WO (1) WO2013086083A1 (https=)

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JP2018527206A (ja) * 2015-09-03 2018-09-20 ゼネラル・エレクトリック・カンパニイ 電気めっきｍｅｍｓ構造の高融点シード金属

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US9416003B2 (en) * 2014-02-24 2016-08-16 Freescale Semiconductor, Inc. Semiconductor die with high pressure cavity
CN106030771A (zh) * 2014-03-24 2016-10-12 英特尔公司 穿体过孔形成技术
JP6469960B2 (ja) * 2014-03-31 2019-02-13 住友精化株式会社 ポジ型フォトレジスト
TWI590735B (zh) 2014-12-15 2017-07-01 財團法人工業技術研究院 訊號傳輸板及其製作方法
JP2016163917A (ja) * 2015-03-06 2016-09-08 株式会社東芝 Ｍｅｍｓ装置
CN104985241B (zh) * 2015-05-16 2017-04-05 哈尔滨工业大学 一种基于压电陶瓷片逆压电效应的一维振动装置
TWI576026B (zh) 2015-07-17 2017-03-21 財團法人工業技術研究院 電路結構
DE112015007070T5 (de) * 2015-10-29 2018-09-13 Intel Corporation Metallfreie Rahmengestaltung für Siliziumbrücken für Halbleitergehäuse
CN108136415B (zh) * 2015-11-05 2024-04-26 惠普发展公司，有限责任合伙企业 在模制面板中形成三维特征
WO2017094176A1 (ja) * 2015-12-04 2017-06-08 株式会社日立製作所 断面観察試料作製装置及び断面観察試料作製方法
JP2017208417A (ja) * 2016-05-17 2017-11-24 住友ベークライト株式会社 中空構造体の製造方法
CN110248725B (zh) 2016-12-22 2022-08-02 伊鲁米那股份有限公司 包括树脂膜和图案化的聚合物层的阵列
CN106788306A (zh) * 2017-03-07 2017-05-31 杭州左蓝微电子技术有限公司 一种薄膜体声波谐振器及其制备方法
KR102369434B1 (ko) 2017-04-19 2022-03-03 삼성전기주식회사 체적 음향 공진기 및 이의 제조방법
WO2018194648A1 (en) * 2017-04-21 2018-10-25 Hewlett-Packard Development Company Coplanar microfluidic manipulation
US10269587B2 (en) 2017-06-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit packages and methods of forming same
US10584027B2 (en) 2017-12-01 2020-03-10 Elbit Systems Of America, Llc Method for forming hermetic seals in MEMS devices
KR102401711B1 (ko) 2018-03-02 2022-05-26 도쿄엘렉트론가부시키가이샤 패턴을 층에 전사하기 위한 방법
KR20190111743A (ko) * 2018-03-22 2019-10-02 스미토모 세이카 가부시키가이샤 복합부재 및 그 제조방법
CN108507558B (zh) * 2018-03-28 2024-04-30 株洲菲斯罗克光电科技股份有限公司 一种轻量化三轴一体光纤陀螺仪
CN108878370A (zh) * 2018-06-27 2018-11-23 深圳市华星光电技术有限公司 一种透明导电电极及其制备方法、显示装置
US20200115224A1 (en) 2018-10-12 2020-04-16 Stmicroelectronics S.R.L. Mems device having a rugged package and fabrication process thereof
CN111039254A (zh) * 2018-10-15 2020-04-21 无锡华润上华科技有限公司 Mems样品纵向截面的制备方法及形貌观察方法
CN114477073B (zh) * 2021-12-08 2024-05-03 江苏普诺威电子股份有限公司 改善mems载板边缘掉屑的制作方法

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US20030183916A1 (en) * 2002-03-27 2003-10-02 John Heck Packaging microelectromechanical systems
JP4608317B2 (ja) 2002-11-01 2011-01-12 ジョージア・テック・リサーチ・コーポレーション 犠牲組成物、その使用方法、及びその分解方法
WO2005089348A2 (en) 2004-03-15 2005-09-29 Georgia Tech Research Corporation Packaging for micro electro-mechanical systems and methods of fabricating thereof
JP4426413B2 (ja) 2004-09-24 2010-03-03 日本電信電話株式会社 半導体装置の製造方法
CN101283042A (zh) * 2005-08-09 2008-10-08 查珀尔希尔北卡罗来纳大学 制造微流体器件的方法和材料
US7635606B2 (en) 2006-08-02 2009-12-22 Skyworks Solutions, Inc. Wafer level package with cavities for active devices
JP5110575B2 (ja) * 2007-08-24 2012-12-26 エムテックスマツムラ株式会社 中空パッケージ及び半導体装置
CN101554987B (zh) * 2009-04-30 2011-04-20 华中科技大学 一种微机电系统的圆片级真空封装工艺
CN102001616A (zh) * 2009-08-31 2011-04-06 上海丽恒光微电子科技有限公司 装配和封装微型机电系统装置的方法
JP2011142229A (ja) * 2010-01-07 2011-07-21 Toyota Motor Corp 電子部品用パッケージ、電子部品装置、及び電子部品装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018527206A (ja) * 2015-09-03 2018-09-20 ゼネラル・エレクトリック・カンパニイ 電気めっきｍｅｍｓ構造の高融点シード金属

Also Published As

Publication number Publication date
WO2013086083A1 (en) 2013-06-13
TWI600609B (zh) 2017-10-01
KR20140126696A (ko) 2014-10-31
EP2788280B1 (en) 2018-06-20
JP2015501734A (ja) 2015-01-19
SG11201402261SA (en) 2014-08-28
KR101583498B1 (ko) 2016-01-08
US20130341736A1 (en) 2013-12-26
EP2788280A1 (en) 2014-10-15
US8765512B2 (en) 2014-07-01
TW201336775A (zh) 2013-09-16
CN104093662B (zh) 2015-11-25
CN104093662A (zh) 2014-10-08

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