JP6053256B2 - 半導体チップ及びその製造方法、並びに半導体装置 - Google Patents
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Description
ここで、特許文献1は、半導体チップの表面側に、剥離防止用の溝が設けていることを開示しているが、貫通電極については全く関知しておらず、裏面側へのチッピングに対する対処については何ら開示していない。
また、それに伴い、ダイシング後の裏面外観検査の歩留まりが改善する。
更に、半導体チップのスクライブエリアの縮小が可能となり、それによりチップサイズ全体の縮小化が図れ、ひいてはウエハ当たりの有効チップ数を増加させることができる。
<第一実施形態>
図1は、本発明の半導体チップにおける第一実施形態のメモリチップ(DRAM)の裏面側からみた模式的平面図である。図2は、図1のA−A’における断面図である。
次に、本発明の半導体チップにおける第二実施形態のメモリチップ(DRAM)について説明する。図7は、本発明の半導体チップにおける第二実施形態のメモリチップ(DRAM)の裏面側からみた模式的平面図である。
次に、本発明の半導体チップにおける第三実施形態のメモリチップ(DRAM)について説明する。図8は、本発明の半導体チップにおける第三実施形態のメモリチップ(DRAM)の裏面側からみた模式的平面図である。
次に、本発明の半導体チップにおける第四実施形態のメモリチップ(DRAM)について説明する。図9は、本発明の半導体チップにおける第四実施形態のメモリチップ(DRAM)の裏面側からみた模式的平面図である。
次に、本発明の半導体チップにおける第五実施形態のメモリチップ(DRAM)について説明する。図10は、本発明の半導体チップにおける第五実施形態のメモリチップ(DRAM)の裏面側からみた模式的平面図である。
次に、本発明の半導体チップにおける第六実施形態のメモリチップ(DRAM)について説明する。図11は、本発明の半導体チップにおける第六実施形態のメモリチップ(DRAM)の裏面側からみた模式的平面図である。
次に、本発明の半導体チップにおける第七実施形態のメモリチップ(DRAM)について説明する。図12は、本発明の半導体チップにおける第七実施形態のメモリチップ(DRAM)の裏面側からみた模式的平面図である。
次に、本発明の半導体チップにおける第七実施形態のメモリチップ(DRAM)について説明する。図13及び図14は、本発明の半導体チップにおける第八実施形態のメモリチップ(DRAM)を説明するための図である。
2a,2b…貫通電極
21…貫通孔部
22…配線
23…コンタクトプラグ
24…ピラー部
25…表面バンプ電極
26…裏面バンプ電極
3a,3b…クラックストップ
4…ガードリング
5A〜5G…裏面チッピング防止溝
10…半導体基板
11〜14…層間絶縁膜
100…ウエハ
SC…スクライブセンター
SA…スクライブエリア
GA…ガードリングエリア
AA…アクティブエリア
Claims (11)
- 表面側電極と裏面側電極とをつなぐ貫通電極が貫通する半導体基板を備えた半導体チップであって、
前記半導体基板は、その裏面側周縁と前記貫通電極との間に溝が設けられており、
前記溝は、前記半導体基板の裏面側周縁と、当該半導体チップを積層する際の目印となるマークとの間に、更に設けられていることを特徴とする半導体チップ。 - 1枚のウエハに複数の半導体チップを形成してダイシングにより分断する半導体チップの製造方法であって、
表面バンプ電極形成までの配線工程が完了した後、前記ウエハの表面側を加工して外周を研削した後、支持体を貼り付け、
前記ウエハの裏面側を研削して窒化膜を成長させ、
裏面チッピング防止溝を形成するパターンとしてのフォトレジストを塗布し、露光、現像、浅溝エッチング処理を施し、前記フォトレジストを除去した後、再度窒化膜を成長させ、
貫通孔部を形成するためのフォトレジストを塗布し、露光、現像、貫通孔エッチング処理を施して、前記フォトレジストを除去した後、シード膜をスパッタで形成し、
裏面バンプ電極を形成するためのフォトレジストを塗布し、露光、現像処理を施し、銅をメッキすると共に電極材をメッキし、前記フォトレジストを除去すると共に前記シード膜を除去する各工程を少なくとも含むことを特徴とする半導体チップの製造方法。 - 前記裏面チッピング防止溝を形成するためのフォトレジストを、前記貫通孔部の開口よりも小さい複数の開口を有するパターンで構成することにより、前記裏面チッピング防止溝を形成する各工程と、前記貫通孔部を形成する各工程を同時に行うことを特徴とする請求項2に記載の半導体チップの製造方法。
- 半導体基板と、
前記半導体基板を貫通する貫通電極と、
前記半導体基板の第1面上に設けられた層間絶縁膜と、
前記層間絶縁膜内に設けられたガードリングと、を備え、
前記半導体基板は、前記半導体基板の第2面に設けられ、前記半導体基板の周縁と前記貫通電極との間に位置する溝構造体を含み、
前記ガードリングは、前記半導体基板の前記第2面と直交する第1方向において少なくとも部分的に前記溝構造体と重なる、半導体装置。 - 前記層間絶縁膜内に設けられた多層接続構造体をさらに備え、
前記多層接続構造体は、第1及び第2接続導体と、前記第1接続導体と前記第2接続導体を接続する第1コンタクトプラグとを含み、
前記半導体基板の前記第2面は前記第1面の反対側であり、前記貫通電極の一端は前記第1接続導体に接続されている、請求項4の半導体装置。 - 前記多層接続構造体上に設けられた第1電極をさらに備え、
前記多層接続構造体は、前記第2接続導体に電気的に接続された第3接続導体をさらに含み、
前記第1接続導体は前記第3接続導体に接続されている、請求項5の半導体装置。 - 前記半導体基板の前記第2面上に設けられた第2電極をさらに備え、
前記第2電極は前記貫通電極の他端に接続され、これにより前記第1電極は前記多層接続構造体及び前記貫通電極を介して前記第2電極に電気的に接続されている、請求項6の半導体装置。 - 前記半導体基板は少なくともアライメントマークを有し、前記溝構造体は前記アライメントマークと前記半導体基板の前記周縁との間に位置する、請求項4の半導体装置。
- 前記溝構造体は前記半導体基板を貫通していない、請求項4の半導体装置。
- 配線基板と、
前記配線基板に積層された複数の半導体チップと、を備え、
前記複数の半導体チップのそれぞれは、
互いに反対側に位置する第1面及び第2面を有する半導体基板と、
前記半導体基板の前記第1面上の層間絶縁膜と、
前記層間絶縁膜内に設けられたガードリング構造体と、
前記層間絶縁膜内に設けられた複数の接続導体と、
前記半導体基板を貫通し、前記複数の接続導体に接続された複数の貫通電極と、を備え、
前記半導体基板は、前記第2面に溝構造体を有し、
前記溝構造体は、前記半導体基板の縁部と前記複数の貫通電極との間に配置され、
前記ガードリング構造体は、前記半導体基板の前記第2面と直交する第1方向において少なくとも部分的に前記溝構造体と重なる、半導体装置。 - 互いに反対側に位置する第1表面部分及び第2表面部分を有する半導体基板と、
前記半導体基板の前記第1表面部分上に設けられた層間絶縁膜と、
前記層間絶縁膜内に設けられたガードリングと、
前記半導体基板を貫通する複数の貫通電極と、
前記第1表面部分に設けられた複数の回路素子と、
前記第2表面部分において前記半導体基板を貫通することなく設けられた溝と、を備え、
前記ガードリングは、前記半導体基板の前記第2表面部分と直交する第1方向において少なくとも部分的に前記溝と重なる、半導体装置。
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Application Number | Priority Date | Filing Date | Title |
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JP2011067968A JP6053256B2 (ja) | 2011-03-25 | 2011-03-25 | 半導体チップ及びその製造方法、並びに半導体装置 |
US13/427,758 US8633593B2 (en) | 2011-03-25 | 2012-03-22 | Semiconductor device |
US14/139,668 US9117829B2 (en) | 2011-03-25 | 2013-12-23 | Semiconductor device including guard ring and groove |
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JP6053256B2 (ja) * | 2011-03-25 | 2016-12-27 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体チップ及びその製造方法、並びに半導体装置 |
CN104380459B (zh) * | 2012-07-19 | 2017-08-25 | 瑞萨电子株式会社 | 半导体装置 |
JP5968711B2 (ja) * | 2012-07-25 | 2016-08-10 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
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JP6083315B2 (ja) * | 2013-05-08 | 2017-02-22 | 株式会社デンソー | 物理量センサの製造方法 |
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KR20150058778A (ko) * | 2013-11-21 | 2015-05-29 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법, 상기 반도체 장치를 포함하는 반도체 패키지 및 그 제조 방법 |
US9673119B2 (en) * | 2014-01-24 | 2017-06-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for bonding package lid |
DE102015203393A1 (de) * | 2015-02-25 | 2016-08-25 | Infineon Technologies Ag | Halbleiterelement und Verfahren zu Herstellen von diesem |
JP2016174101A (ja) | 2015-03-17 | 2016-09-29 | 株式会社東芝 | 半導体装置およびその製造方法 |
CN107180820B (zh) * | 2016-03-09 | 2019-10-11 | 世界先进积体电路股份有限公司 | 半导体装置结构 |
US10381303B2 (en) * | 2016-07-01 | 2019-08-13 | Vanguard International Semiconductor Corporation | Semiconductor device structures |
US10504859B2 (en) * | 2016-10-01 | 2019-12-10 | Intel Corporation | Electronic component guard ring |
WO2018125069A1 (en) * | 2016-12-28 | 2018-07-05 | Intel Corporation | Methods of forming substrate interconnect structures for enhanced thin seed conduction |
EP3364454B1 (en) * | 2017-02-15 | 2022-03-30 | ams AG | Semiconductor device |
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KR20210055164A (ko) * | 2019-11-07 | 2021-05-17 | 삼성전자주식회사 | 반도체 소자 및 이를 구비한 반도체 패키지 |
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JP2006140404A (ja) | 2004-11-15 | 2006-06-01 | Renesas Technology Corp | 半導体装置 |
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JP6053256B2 (ja) * | 2011-03-25 | 2016-12-27 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 半導体チップ及びその製造方法、並びに半導体装置 |
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US9117829B2 (en) | 2015-08-25 |
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