JP6049050B2 - 電気コネクタ組立体 - Google Patents
電気コネクタ組立体 Download PDFInfo
- Publication number
- JP6049050B2 JP6049050B2 JP2012154751A JP2012154751A JP6049050B2 JP 6049050 B2 JP6049050 B2 JP 6049050B2 JP 2012154751 A JP2012154751 A JP 2012154751A JP 2012154751 A JP2012154751 A JP 2012154751A JP 6049050 B2 JP6049050 B2 JP 6049050B2
- Authority
- JP
- Japan
- Prior art keywords
- shield
- connector assembly
- electrical connector
- electrical
- interposer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connecting Device With Holders (AREA)
Description
106 電気コネクタ組立体
110 インタポーザ
114 側面
116 第2側面
118 アレー
120 電気コンタクト
127 シールド壁
127A 第1シールド壁
127B 第2シールド壁
128 接触領域
130 シールドマトリクス
208 実装縁
212 実装突起
244 シールド小領域
256 電気コンタクト
904 ボード基板
P1 格子状の載置平面
Claims (10)
- 側面(114)と、該側面上に配列されると共に該側面上の外部空間に露出する電気コンタクト(120)のアレー(118)とを有するインタポーザ(110)を具備する電気コネクタ組立体(106)であって、
前記電気コンタクトは、前記側面上に実装された電子モジュール(102)と係合するよう構成された電気コネクタ組立体において、
シールドマトリクス(130)が、前記側面に沿って延びると共に前記外部空間を複数のシールド小領域(244)に分割するシールド壁(127)を有し、
前記シールド壁は、導電材料を有すると共に、前記インタポーザに電気接続され、
少なくとも1個の前記電気コンタクトは、各々の前記シールド小領域内に配置され、
前記シールド壁は、隣接する前記電気コンタクト間に延びて、隣接する前記電気コンタクトを電磁妨害からシールドすることを特徴とする電気コネクタ組立体。 - 前記シールド壁は、打抜き加工されて前記インタポーザに機械的に結合され、
前記シールド壁は前記側壁から直交して突出することを特徴とする請求項1記載の電気コネクタ組立体。 - 前記シールド壁は、互いに交差する第1シールド壁(127A)及び第2シールド壁(127B)を具備することを特徴とする請求項1記載の電気コネクタ組立体。
- 複数の前記第1シールド壁は互いに平行に延びており、
複数の前記第2シールド壁は互いに平行に延びていることを特徴とする請求項3記載の電気コネクタ組立体。 - 前記シールドマトリクスは、前記電子モジュールを実装するよう構成された格子状の載置平面(P 1 )を形成することを特徴とする請求項1記載の電気コネクタ組立体。
- 少なくとも2個の前記シールド壁が互いに平行に延びることを特徴とする請求項1記載の電気コネクタ組立体。
- 前記シールド壁は、前記電子モジュールと接続するよう構成された実装縁(208)と、該実装縁に沿って配置された接地構造(214)とを有し、
前記接地構造を通って前記インタポーザまで接地経路が区画されることを特徴とする請求項1記載の電気コネクタ組立体。 - 前記側面は第1側面であり、
前記インタポーザは、前記第1側面とは逆向きの第2側面(116)を有し、
前記シールド壁は、前記インタポーザを貫通すると共に前記第2側面に沿って対応する電気コンタクト(256)に機械的及び電気的に結合される実装突起(212)を有することを特徴とする請求項1記載の電気コネクタ組立体。 - 前記電気コンタクト(906)は、対応するめっきバイア(934)に結合され、
複数の前記めっきバイア(934)の間に、該複数のめっきバイア(934)に取り囲まれた接地バイア(930)が設けられていることを特徴とする請求項1記載の電気コネクタ組立体。 - 前記インタポーザ(952)の前記側面(954)に非導電性シート(958)が形成され、
前記非導電性シートは、前記電気コンタクト(964)の先端の下に位置する停止部を有することを特徴とする請求項1記載の電気コネクタ組立体。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161507400P | 2011-07-13 | 2011-07-13 | |
US61/507400 | 2011-07-13 | ||
US201161555586P | 2011-11-04 | 2011-11-04 | |
US61/555586 | 2011-11-04 | ||
US13/475303 | 2012-05-18 | ||
US13/475,303 US8727808B2 (en) | 2011-07-13 | 2012-05-18 | Electrical connector assembly for interconnecting an electronic module and an electrical component |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016177244A Division JP6168633B2 (ja) | 2011-07-13 | 2016-09-12 | 電気コネクタ組立体 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013020970A JP2013020970A (ja) | 2013-01-31 |
JP2013020970A5 JP2013020970A5 (ja) | 2015-09-03 |
JP6049050B2 true JP6049050B2 (ja) | 2016-12-21 |
Family
ID=47425828
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012154751A Expired - Fee Related JP6049050B2 (ja) | 2011-07-13 | 2012-07-10 | 電気コネクタ組立体 |
JP2016177244A Expired - Fee Related JP6168633B2 (ja) | 2011-07-13 | 2016-09-12 | 電気コネクタ組立体 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016177244A Expired - Fee Related JP6168633B2 (ja) | 2011-07-13 | 2016-09-12 | 電気コネクタ組立体 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8727808B2 (ja) |
JP (2) | JP6049050B2 (ja) |
CN (1) | CN103117486B (ja) |
DE (1) | DE102012212223A1 (ja) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI525943B (zh) * | 2013-04-29 | 2016-03-11 | 鴻海精密工業股份有限公司 | 電連接器 |
CN104134880B (zh) * | 2013-05-03 | 2016-08-10 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
TWM464847U (zh) | 2013-05-07 | 2013-11-01 | Hon Hai Prec Ind Co Ltd | 電連接器組合 |
TWI514682B (zh) | 2013-05-30 | 2015-12-21 | Hon Hai Prec Ind Co Ltd | 電連接器及其製造方法 |
CN104241901B (zh) * | 2013-06-13 | 2017-05-03 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其制造方法 |
JP2015065553A (ja) * | 2013-09-25 | 2015-04-09 | 株式会社東芝 | 接続部材、半導体デバイスおよび積層構造体 |
CN105098516B (zh) * | 2014-04-22 | 2019-04-30 | 泰连公司 | 夹层插座连接器 |
JP6344072B2 (ja) * | 2014-06-10 | 2018-06-20 | 富士通株式会社 | 半導体部品用ソケット、プリント基板ユニット、及び情報処理装置 |
US9912084B2 (en) | 2014-08-20 | 2018-03-06 | Te Connectivity Corporation | High speed signal connector assembly |
CN105470732B (zh) * | 2014-08-27 | 2019-10-08 | 富士康(昆山)电脑接插件有限公司 | 插头连接器 |
US10079443B2 (en) | 2016-06-16 | 2018-09-18 | Te Connectivity Corporation | Interposer socket and connector assembly |
CN109411937B (zh) * | 2017-08-14 | 2021-09-21 | 富顶精密组件(深圳)有限公司 | 电连接器及其制造方法 |
CN110071381B (zh) * | 2017-11-13 | 2023-05-09 | 泰连公司 | 用于电子封装件的电缆插座连接器组件 |
US10348015B2 (en) | 2017-11-13 | 2019-07-09 | Te Connectivity Corporation | Socket connector for an electronic package |
KR102550209B1 (ko) * | 2018-09-19 | 2023-06-30 | 삼성전자주식회사 | 인쇄 회로 기판에 배치된 회로 소자를 둘러싸는 인터포저를 포함하는 전자 장치 |
CN109687204B (zh) | 2018-12-11 | 2020-09-25 | 番禺得意精密电子工业有限公司 | 电连接器 |
CN113491035B (zh) * | 2019-01-14 | 2024-06-14 | 安费诺有限公司 | 中板线缆端接组件 |
KR102062071B1 (ko) * | 2019-07-11 | 2020-01-03 | 김문식 | 일체형 침상 접지판 및 그 제조방법 및 이를 이용한 접지부 시공방법 |
CN113131265B (zh) * | 2019-12-31 | 2023-05-19 | 富鼎精密工业(郑州)有限公司 | 电连接器 |
US20220022348A1 (en) * | 2020-07-15 | 2022-01-20 | GITech, Inc. | Shielded Interconnect System |
CN114597712A (zh) * | 2020-08-14 | 2022-06-07 | 富士康(昆山)电脑接插件有限公司 | 芯片电连接器 |
WO2022076433A1 (en) * | 2020-10-08 | 2022-04-14 | Advanced Energy Industries, Inc. | Mechanical and electrical connection clamp |
CN215266745U (zh) * | 2020-12-29 | 2021-12-21 | 番禺得意精密电子工业有限公司 | 连接器组件 |
CN216145874U (zh) * | 2021-02-09 | 2022-03-29 | 中航光电科技股份有限公司 | 一种高速子连接器 |
KR102688214B1 (ko) * | 2022-02-15 | 2024-07-25 | 네오코닉스 인크 | 신호 전송용 전기 커넥터 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3246208A (en) * | 1962-08-31 | 1966-04-12 | Leeds & Northrup Co | Programming pinboard |
US3587028A (en) * | 1969-04-28 | 1971-06-22 | Ibm | Coaxial connector guide and grounding structure |
JPS55180281U (ja) * | 1979-06-13 | 1980-12-24 | ||
US4611867A (en) * | 1985-07-08 | 1986-09-16 | Japan Aviation Electronics Industry Limited | Coaxial multicore receptacle |
US5201855A (en) * | 1991-09-30 | 1993-04-13 | Ikola Dennis D | Grid system matrix for transient protection of electronic circuitry |
US5399104A (en) * | 1992-09-28 | 1995-03-21 | Mckenzie Socket Technology, Inc. | Socket for multi-lead integrated circuit packages |
JPH06325810A (ja) * | 1993-03-08 | 1994-11-25 | Whitaker Corp:The | コンタクトモジュール及びそれを使用するピングリッドアレイ |
JP4040206B2 (ja) * | 1999-04-28 | 2008-01-30 | 信越ポリマー株式会社 | 電気コネクタ |
US6533613B1 (en) | 1999-12-20 | 2003-03-18 | Intel Corporation | Shielded zero insertion force socket |
US6471525B1 (en) | 2000-08-24 | 2002-10-29 | High Connection Density, Inc. | Shielded carrier for land grid array connectors and a process for fabricating same |
US6428358B1 (en) * | 2000-12-28 | 2002-08-06 | Intel Corporation | Socket with embedded conductive structure and method of fabrication therefor |
US6686649B1 (en) | 2001-05-14 | 2004-02-03 | Amkor Technology, Inc. | Multi-chip semiconductor package with integral shield and antenna |
US6903541B2 (en) | 2001-05-25 | 2005-06-07 | Tyco Electronics Corporation | Film-based microwave and millimeter-wave circuits and sensors |
US6400577B1 (en) | 2001-08-30 | 2002-06-04 | Tyco Electronics Corporation | Integrated circuit socket assembly having integral shielding members |
US6780057B2 (en) | 2001-12-21 | 2004-08-24 | Intel Corporation | Coaxial dual pin sockets for high speed I/O applications |
US6891266B2 (en) | 2002-02-14 | 2005-05-10 | Mia-Com | RF transition for an area array package |
US6923656B2 (en) | 2003-10-14 | 2005-08-02 | Sun Microsystems, Inc. | Land grid array socket with diverse contacts |
JP4689196B2 (ja) * | 2003-11-05 | 2011-05-25 | 日本発條株式会社 | 導電性接触子ホルダ、導電性接触子ユニット |
US6971916B2 (en) * | 2004-03-29 | 2005-12-06 | Japan Aviation Electronics Industry Limited | Electrical connector for use in transmitting a signal |
KR20060025785A (ko) * | 2004-09-17 | 2006-03-22 | 삼성전자주식회사 | 액정 표시 장치 |
US7170169B2 (en) | 2005-03-11 | 2007-01-30 | Tyco Electronics Corporation | LGA socket with EMI protection |
US8083553B2 (en) * | 2005-06-30 | 2011-12-27 | Amphenol Corporation | Connector with improved shielding in mating contact region |
US7553187B2 (en) * | 2006-01-31 | 2009-06-30 | 3M Innovative Properties Company | Electrical connector assembly |
US7393214B2 (en) * | 2006-02-17 | 2008-07-01 | Centipede Systems, Inc. | High performance electrical connector |
US20070259541A1 (en) | 2006-05-08 | 2007-11-08 | Tyco Electronics Corporation | Electrical interconnection device having dielectric coated metal substrate |
JP2008140560A (ja) * | 2006-11-30 | 2008-06-19 | Nidec-Read Corp | 多極コネクタ |
US7622793B2 (en) | 2006-12-21 | 2009-11-24 | Anderson Richard A | Flip chip shielded RF I/O land grid array package |
CN201036236Y (zh) * | 2007-01-26 | 2008-03-12 | 番禺得意精密电子工业有限公司 | 一种电连接器 |
US8179693B2 (en) * | 2007-03-30 | 2012-05-15 | International Business Machines Corporation | Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements |
US7726976B2 (en) | 2007-11-09 | 2010-06-01 | Tyco Electronics Corporation | Shielded electrical interconnect |
JP5500870B2 (ja) * | 2009-05-28 | 2014-05-21 | 新光電気工業株式会社 | 接続端子付き基板及び電子部品のソケット等 |
US7927144B2 (en) * | 2009-08-10 | 2011-04-19 | 3M Innovative Properties Company | Electrical connector with interlocking plates |
US8025531B1 (en) * | 2010-12-16 | 2011-09-27 | Intel Corporation | Shielded socket housing |
-
2012
- 2012-05-18 US US13/475,303 patent/US8727808B2/en not_active Expired - Fee Related
- 2012-07-10 JP JP2012154751A patent/JP6049050B2/ja not_active Expired - Fee Related
- 2012-07-12 DE DE102012212223A patent/DE102012212223A1/de not_active Withdrawn
- 2012-07-13 CN CN201210389733.XA patent/CN103117486B/zh not_active Expired - Fee Related
-
2016
- 2016-09-12 JP JP2016177244A patent/JP6168633B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN103117486B (zh) | 2016-12-21 |
JP2016219440A (ja) | 2016-12-22 |
DE102012212223A1 (de) | 2013-01-17 |
JP2013020970A (ja) | 2013-01-31 |
US8727808B2 (en) | 2014-05-20 |
US20130017721A1 (en) | 2013-01-17 |
CN103117486A (zh) | 2013-05-22 |
JP6168633B2 (ja) | 2017-07-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6168633B2 (ja) | 電気コネクタ組立体 | |
JP4258432B2 (ja) | 基板接合部材ならびにそれを用いた三次元接続構造体 | |
US7857632B2 (en) | Power connector | |
US8485831B2 (en) | Tall mezzanine connector | |
KR101003027B1 (ko) | 암 커넥터, 그에 끼워 맞춰지는 수 커넥터, 이들이 끼워 맞춰져 이루어진 전기 접속구조, 이들을 이용한 전기·전자 부품 및, 반도체 패키지 소켓 또는 반도체 검사용 소켓 | |
US8821188B2 (en) | Electrical connector assembly used for shielding | |
US8167644B2 (en) | Electrical connector for an electronic module | |
US20090221164A1 (en) | Connector | |
JP2013020970A5 (ja) | ||
US20100029102A1 (en) | Electrical connector having reinforced contacts arrangement | |
EP3032655A1 (en) | Separable electrical connecting structure and connector for electrical connection which includes same, semiconductor package assembly, and electronic device | |
US7549871B2 (en) | Connector with dual compression polymer and flexible contact array | |
US8172615B2 (en) | Electrical connector for an electronic module | |
JP3134262U (ja) | 表面実装型コネクタ | |
US7234946B2 (en) | Land grid array socket | |
CN110829069B (zh) | 连接器及其组合 | |
US8110751B2 (en) | Semiconductor memory module and electronic component socket for coupling with the same | |
JP2007287394A (ja) | 基板コネクタ及び基板コネクタ対 | |
TWI536675B (zh) | 電子模組之電氣連接器 | |
US6575791B1 (en) | Electrical connector providing reliable electrical interconnection with mated devices | |
KR101019368B1 (ko) | 반도체 메모리 모듈 및 그와 결합 되는 전자 부품 소켓 | |
JPS5826153B2 (ja) | 多極コネクタ | |
JP4920557B2 (ja) | エッジコネクタ | |
CN115966928A (zh) | 电性连接装置 | |
JP2003257520A (ja) | 押し当て式基板用コネクター |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150707 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150707 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160408 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160420 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20160720 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160912 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20161117 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20161117 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6049050 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |