JP6038882B2 - 光ファイバの構成体及びこのような構成体を形成する方法 - Google Patents

光ファイバの構成体及びこのような構成体を形成する方法 Download PDF

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Publication number
JP6038882B2
JP6038882B2 JP2014505662A JP2014505662A JP6038882B2 JP 6038882 B2 JP6038882 B2 JP 6038882B2 JP 2014505662 A JP2014505662 A JP 2014505662A JP 2014505662 A JP2014505662 A JP 2014505662A JP 6038882 B2 JP6038882 B2 JP 6038882B2
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Prior art keywords
fiber
aperture
array
substrate
fibers
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Japanese (ja)
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JP2014517503A5 (enExample
JP2014517503A (ja
Inventor
デ・ボア、ギード
ファン・メール、ラルフ
ファン・デ・ペウト、テウニス
デルクス、ヘンク
スピーゲルハルダー、フレデリク・マティアス
スムルデルス、エドウィン・ヨハンネス・テオドラス
デルクス、ロイ・ジョセフス・ステファヌス
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マッパー・リソグラフィー・アイピー・ビー.ブイ.
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/142Laminating of sheets, panels or inserts, e.g. stiffeners, by wrapping in at least one outer layer, or inserting into a preformed pocket
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284Application of adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284Application of adhesive
    • B32B37/1292Application of adhesive selectively, e.g. in stripes, in patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0012Mechanical treatment, e.g. roughening, deforming, stretching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3608Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
    • G02B6/3612Wiring methods or machines
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/36Mechanical coupling means
    • G02B6/3628Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177Multi-beam, e.g. fly's eye, comb probe
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2551/00Optical elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04Means for controlling the discharge
    • H01J2237/043Beam blanking
    • H01J2237/0435Multi-aperture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/248Components associated with the control of the tube
    • H01J2237/2482Optical means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1002Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electron Beam Exposure (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Guides In General And Applications Therefor (AREA)
JP2014505662A 2011-04-20 2012-04-20 光ファイバの構成体及びこのような構成体を形成する方法 Active JP6038882B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161477228P 2011-04-20 2011-04-20
US61/477,228 2011-04-20
US201161479263P 2011-04-26 2011-04-26
US61/479,263 2011-04-26
PCT/EP2012/057331 WO2012143541A1 (en) 2011-04-20 2012-04-20 Arrangement of optical fibers, and a method of forming such arrangement

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016215308A Division JP6696887B2 (ja) 2011-04-20 2016-11-02 光ファイバの構成体及びこのような構成体を形成する方法

Publications (3)

Publication Number Publication Date
JP2014517503A JP2014517503A (ja) 2014-07-17
JP2014517503A5 JP2014517503A5 (enExample) 2015-06-18
JP6038882B2 true JP6038882B2 (ja) 2016-12-07

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Application Number Title Priority Date Filing Date
JP2014505662A Active JP6038882B2 (ja) 2011-04-20 2012-04-20 光ファイバの構成体及びこのような構成体を形成する方法
JP2016215308A Active JP6696887B2 (ja) 2011-04-20 2016-11-02 光ファイバの構成体及びこのような構成体を形成する方法

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US (3) US9036962B2 (enExample)
JP (2) JP6038882B2 (enExample)
WO (1) WO2012143541A1 (enExample)

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CN113424291B (zh) * 2018-12-20 2024-03-22 Asml荷兰有限公司 平台装置
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Also Published As

Publication number Publication date
WO2012143541A1 (en) 2012-10-26
JP2014517503A (ja) 2014-07-17
US20150190994A1 (en) 2015-07-09
USRE48287E1 (en) 2020-10-27
US20130043413A1 (en) 2013-02-21
US9457549B2 (en) 2016-10-04
JP2017072839A (ja) 2017-04-13
JP6696887B2 (ja) 2020-05-20
US9036962B2 (en) 2015-05-19

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