JP6023979B2 - はんだ材料および実装体 - Google Patents
はんだ材料および実装体 Download PDFInfo
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- JP6023979B2 JP6023979B2 JP2012189489A JP2012189489A JP6023979B2 JP 6023979 B2 JP6023979 B2 JP 6023979B2 JP 2012189489 A JP2012189489 A JP 2012189489A JP 2012189489 A JP2012189489 A JP 2012189489A JP 6023979 B2 JP6023979 B2 JP 6023979B2
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- mass
- content
- electrode
- solder material
- soldering
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Description
はじめに、図1を参照しながら、本実施の形態1のはんだ材料に関する原理について説明する。
(数1)
(試験サイクル数)
=−410.7×(In含有率)2+4919.6×(In含有率)−12446
のグラフとして図示されている。
(数2)
(In含有率)
=2.29×(Co含有率)+5.122
のグラフが得られる。
(数3)
(In含有率)
=2.29×(Co含有率)+4.622
のグラフ(一点鎖線で図示されている)となり、In含有率はCo含有率が0.035mass%である場合は4.7mass%である。
602 液相線
700 実装体
711、712 はんだ部
720、740 電子部品
721 Au部品電極
730 電子回路基板
731、732 Cu基板電極
741 Cu部品電極
Claims (2)
- Pを含むNiめっき上にAuフラッシュめっきが施されたAu部品電極のはんだ付けに利用されるはんだ材料であって、
5.6〜6.8mass%のInと、
0.3〜4.0mass%のAgと、
0〜1.0mass%のBiと、
0.26〜0.7mass%のCoを含み、
残部は、87.5mass%以上のSnのみであることを特徴とする、はんだ材料。 - Cu電極の上にPを含むNiめっきを有し、更に該Niめっきの上にAuフラッシュめっきを備えるAu部品電極を有する電子部品と、Cu基板電極又はCu電極の上にPを含むNiめっきを有し、更に該Niめっきの上にAuフラッシュめっきを備えるAu基板電極を有する電子回路基板とが、請求項1に記載のはんだ材料によって接合されていることを特徴とする、実装体。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012189489A JP6023979B2 (ja) | 2012-08-30 | 2012-08-30 | はんだ材料および実装体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012189489A JP6023979B2 (ja) | 2012-08-30 | 2012-08-30 | はんだ材料および実装体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014046319A JP2014046319A (ja) | 2014-03-17 |
JP6023979B2 true JP6023979B2 (ja) | 2016-11-09 |
Family
ID=50606542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012189489A Expired - Fee Related JP6023979B2 (ja) | 2012-08-30 | 2012-08-30 | はんだ材料および実装体 |
Country Status (1)
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JP (1) | JP6023979B2 (ja) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2422918B1 (en) * | 2009-04-20 | 2017-12-06 | Panasonic Intellectual Property Management Co., Ltd. | Soldering material and electronic component assembly |
-
2012
- 2012-08-30 JP JP2012189489A patent/JP6023979B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2014046319A (ja) | 2014-03-17 |
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