JP5982642B2 - はんだ材料および実装体 - Google Patents
はんだ材料および実装体 Download PDFInfo
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- JP5982642B2 JP5982642B2 JP2012189492A JP2012189492A JP5982642B2 JP 5982642 B2 JP5982642 B2 JP 5982642B2 JP 2012189492 A JP2012189492 A JP 2012189492A JP 2012189492 A JP2012189492 A JP 2012189492A JP 5982642 B2 JP5982642 B2 JP 5982642B2
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- Prior art keywords
- mass
- content
- electrode
- solder material
- plating
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Description
はじめに、図1を参照しながら、本実施の形態1のはんだ材料に関する原理について説明する。
(数1)
(試験サイクル数)
=−410.7×(In含有率)2+4919.6×(In含有率)−12446
のグラフとして図示されている。
(数2)
(In含有率)
=2.33×(Mo含有率)+5.142
のグラフが得られる。
(数3)
(In含有率)
=2.33×(Mo含有率)+4.642
のグラフとなり、In含有率はMo含有率が0.025mass%である場合は4.7mass%である。
611、612 はんだ部
620、640 電子部品
621 Au部品電極
630 電子回路基板
631、632 Cu基板電極
641 Cu部品電極
Claims (2)
- Cu電極の上にPを含むNiめっきを有し、更に該Niめっきの上にAuフラッシュめっきを備える、Au部品電極のはんだ付けに利用されるはんだ材料であって、
5.6〜6.8mass%のInと、
0.3〜4.0mass%のAgと、
0〜1.0mass%のBiと、
0.025〜1.0mass%のMoを含み、
残部は、87.2mass%以上のSnのみであることを特徴とする、はんだ材料。 - Cu電極の上にPを含むNiめっきを有し、更に該Niめっきの上にAuフラッシュめっきを備える、Au部品電極を有する電子部品と、Cu基板電極又はCu電極の上にPを含むNiめっきを有し、更に該Niめっきの上にAuフラッシュめっきを備える、Au基板電極を有する電子回路基板とが、請求項1に記載のはんだ材料によって接合されていることを特徴とする、実装体。
Priority Applications (1)
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---|---|---|---|
JP2012189492A JP5982642B2 (ja) | 2012-08-30 | 2012-08-30 | はんだ材料および実装体 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2012189492A JP5982642B2 (ja) | 2012-08-30 | 2012-08-30 | はんだ材料および実装体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014046320A JP2014046320A (ja) | 2014-03-17 |
JP5982642B2 true JP5982642B2 (ja) | 2016-08-31 |
Family
ID=50606543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012189492A Expired - Fee Related JP5982642B2 (ja) | 2012-08-30 | 2012-08-30 | はんだ材料および実装体 |
Country Status (1)
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JP (1) | JP5982642B2 (ja) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2177305B1 (en) * | 2007-07-18 | 2013-07-03 | Senju Metal Industry Co., Ltd | In-containing lead-free solder for on-vehicle electronic circuit |
CN102066044B (zh) * | 2009-04-20 | 2014-05-21 | 松下电器产业株式会社 | 焊锡材料及电子部件接合体 |
-
2012
- 2012-08-30 JP JP2012189492A patent/JP5982642B2/ja not_active Expired - Fee Related
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JP2014046320A (ja) | 2014-03-17 |
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