JP6022715B2 - 時計センサ用の支持要素 - Google Patents
時計センサ用の支持要素 Download PDFInfo
- Publication number
- JP6022715B2 JP6022715B2 JP2015551149A JP2015551149A JP6022715B2 JP 6022715 B2 JP6022715 B2 JP 6022715B2 JP 2015551149 A JP2015551149 A JP 2015551149A JP 2015551149 A JP2015551149 A JP 2015551149A JP 6022715 B2 JP6022715 B2 JP 6022715B2
- Authority
- JP
- Japan
- Prior art keywords
- support element
- sensor
- wire spring
- timepiece
- watch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000003754 machining Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 7
- 241000283070 Equus zebra Species 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/06—Electric connectors, e.g. conductive elastomers
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/04—Mounting of electronic components
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/04—Mounting of electronic components
- G04G17/045—Mounting of the display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Clocks (AREA)
- Structure Of Printed Boards (AREA)
Description
Claims (10)
- 時計センサ(2)用支持要素(1)であって、
前記支持要素は、前記支持要素が三次元形状及び集積された電気的接続経路(10)を有するように、並びに第1の剛性接続インタフェースと、前記電気的接続経路(10)が配設される前記支持要素又は可撓性フィンガピース(13)に組み付けられるワイヤばね(3)によって形成された第2の可撓性接続インタフェースとを更に含むように、3D−MIDとして作製されることを特徴とする、時計センサ(2)用支持要素(1)。 - 前記ワイヤばね(3)は、前記支持要素(1)に固定された第1の部分(31)及び第2の可撓性自由部分(32)を含むことを特徴とする、請求項1に記載の時計センサ(2)用支持要素(1)。
- 前記支持要素は、前記ワイヤばね(3)を組み付けるためのクリップ(18)を含むことを特徴とする、請求項1又は2に記載の時計センサ(2)用支持要素(1)。
- 前記支持要素は第2のビアホール(17)を含み、
前記第2のビアホール(17)内において、前記電気的接続経路(10)は、前記ワイヤばね(3)に電気的に接続されるよう構成されたアイレット(103)を形成することを特徴とする、請求項1〜3のいずれか1項に記載の時計センサ(2)用支持要素(1)。 - 前記ワイヤばね(3)の一方の端部は、前記第2のビアホール(17)にはんだ付けされることを特徴とする、請求項3又は4に記載の時計センサ(2)用支持要素(1)。
- 前記ワイヤばね(3)の一方の端部は、電導性接着剤によって前記第2のビアホール(17)に接合されることを特徴とする、請求項3又は4に記載の時計センサ(2)用支持要素(1)。
- 前記電気的接続経路(10)は、前記支持要素(1)の一方の縁部上に配設された凹部(15)に配置される拡幅部分(101)を含むことを特徴とする、請求項1〜6のいずれか1項に記載の時計センサ(2)用支持要素(1)。
- 前記支持要素は、組み付けのための第1のガイドマーク(19)と、前記電気的接続経路(10)を機械加工するための一連の第2のレーザガイドマーク(110)とを含むことを特徴とする、請求項1〜7のいずれか1項に記載の時計センサ(2)用支持要素(1)。
- 前記支持要素は、軸方向支持表面(1411)及び回転ロック表面(1412)を含む肩部(141)を有する固定用ノッチ(140)を含むことを特徴とする、請求項1〜8のいずれか1項に記載の時計センサ(2)用支持要素(1)。
- センサ(2)で形成されたセンサモジュールを含み、請求項1〜9のいずれか1項に記載の支持要素(1)に取り付けられる、時計であって、
前記支持要素(1)は、取り付け足(4)を用いて、前記時計のケースの内壁に組み付けられることを特徴とする、時計。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13151803 | 2013-01-18 | ||
EP13151803.7 | 2013-01-18 | ||
PCT/EP2013/076444 WO2014111210A1 (fr) | 2013-01-18 | 2013-12-12 | Support pour capteur horloger |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016507738A JP2016507738A (ja) | 2016-03-10 |
JP6022715B2 true JP6022715B2 (ja) | 2016-11-09 |
Family
ID=47665923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015551149A Active JP6022715B2 (ja) | 2013-01-18 | 2013-12-12 | 時計センサ用の支持要素 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9864343B2 (ja) |
EP (1) | EP2946251B1 (ja) |
JP (1) | JP6022715B2 (ja) |
CN (1) | CN104937505B (ja) |
HK (1) | HK1214376A1 (ja) |
WO (1) | WO2014111210A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2747198A1 (en) * | 2012-12-21 | 2014-06-25 | The Swatch Group Research and Development Ltd. | Antenna assembly for a time-piece |
KR20160052253A (ko) * | 2014-11-04 | 2016-05-12 | 삼성전자주식회사 | 안테나 장치 및 그것을 포함하는 전자 장치 |
EP3181515A1 (fr) * | 2015-12-15 | 2017-06-21 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Piece d'horlogerie composite et son procede de fabrication |
EP3882721B1 (en) * | 2020-03-18 | 2024-06-05 | Casio Computer Co., Ltd. | Display device and timepiece |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS48101145A (ja) * | 1972-04-03 | 1973-12-20 | ||
JPS5268467A (en) * | 1975-12-04 | 1977-06-07 | Shimauchi Seiki Kk | Electronic wristwatch |
JPS5273773A (en) * | 1975-12-17 | 1977-06-21 | Seiko Epson Corp | Electronic wristwatch |
US4064552A (en) * | 1976-02-03 | 1977-12-20 | Angelucci Thomas L | Multilayer flexible printed circuit tape |
FR2388460A1 (fr) * | 1977-04-20 | 1978-11-17 | Yema | Dispositif electronique comportant un circuit imprime |
JPS60180187A (ja) * | 1984-01-26 | 1985-09-13 | 松下電器産業株式会社 | ドライプロセス加工用ユニバ−サル基板 |
EP0195636B1 (en) * | 1985-03-19 | 1991-07-10 | Citizen Watch Co. Ltd. | Wristwatch with pressure sensor |
JP2503786Y2 (ja) * | 1990-03-30 | 1996-07-03 | シチズン時計株式会社 | 複合センサユニット |
DE69114291T2 (de) * | 1990-07-03 | 1996-06-20 | Citizen Watch Co Ltd | Uhr mit sensor. |
DE69518569T2 (de) * | 1994-04-14 | 2001-01-04 | Citizen Watch Co., Ltd. | Uhr mit Detektor |
DE10134620A1 (de) * | 2001-07-17 | 2003-02-06 | Bosch Gmbh Robert | Mehraxiales Inertialsensorsystem und Verfahren zu seiner Herstellung |
JP2003124583A (ja) * | 2001-10-15 | 2003-04-25 | Alps Electric Co Ltd | フレキシブル基板 |
ATE533092T1 (de) * | 2003-12-17 | 2011-11-15 | Eta Sa Mft Horlogere Suisse | Tragbares elektronisches gerät, das mit einem drucksensor ausgerüstet ist |
EP1672443B1 (fr) * | 2004-12-17 | 2010-08-18 | ETA SA Manufacture Horlogère Suisse | Montre comportant un capteur de pression |
US9351669B2 (en) * | 2009-09-30 | 2016-05-31 | Abbott Diabetes Care Inc. | Interconnect for on-body analyte monitoring device |
JP2006269627A (ja) * | 2005-03-23 | 2006-10-05 | Nec Corp | プリント配線基板のヴィア構造 |
DE102005053877B4 (de) * | 2005-11-09 | 2010-01-21 | Aktiv-Sensor Gmbh | Drucksensor-Bauelement |
DE102005053973A1 (de) * | 2005-11-11 | 2007-05-31 | Siemens Ag | Sensorbaugruppe |
US7590450B2 (en) * | 2006-01-30 | 2009-09-15 | Medtronic, Inc. | Filtered electrical interconnect assembly |
KR101050334B1 (ko) * | 2006-10-02 | 2011-07-19 | 파나소닉 전공 주식회사 | 압력센서 |
ITTO20080485A1 (it) * | 2008-06-19 | 2009-12-20 | Eltek Spa | Dispositivo sensore di pressione |
TWI355220B (en) | 2008-07-14 | 2011-12-21 | Unimicron Technology Corp | Circuit board structure |
KR100961137B1 (ko) * | 2008-08-05 | 2010-06-09 | 삼성전기주식회사 | 이동통신 단말기 케이스 및 그 제조방법 |
CN201369425Y (zh) * | 2008-11-27 | 2009-12-23 | 番禺得意精密电子工业有限公司 | 电连接器 |
US7963705B2 (en) * | 2009-02-24 | 2011-06-21 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Molded interconnect device (MID) optical connector with metal retaining clip |
US9141087B2 (en) * | 2009-04-26 | 2015-09-22 | Nike, Inc. | Athletic watch |
JP2011191213A (ja) * | 2010-03-15 | 2011-09-29 | Seiko Instruments Inc | センサ付電子機器 |
KR101363157B1 (ko) * | 2010-10-07 | 2014-02-26 | 주식회사 세라젬메디시스 | 입체적 구조의 바이오센서 및 그 제조 방법 |
EP2557904A1 (en) | 2011-08-11 | 2013-02-13 | Research In Motion Limited | Three-dimensionally molded electronic substrate |
GB201120981D0 (en) * | 2011-12-07 | 2012-01-18 | Atlantic Inertial Systems Ltd | Electronic device |
CN202487747U (zh) * | 2012-02-17 | 2012-10-10 | 中兴通讯股份有限公司 | 弹片、防拆装置及电子标签 |
CN202613540U (zh) * | 2012-05-04 | 2012-12-19 | 米技电子电器(上海)有限公司 | 一种改进的商用电磁炉散热结构 |
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CN102810782B (zh) * | 2012-08-22 | 2014-12-17 | 深圳市簧中簧电子有限公司 | 导电端子、安装有导电端子的电路板和板对板连接器 |
-
2013
- 2013-12-12 US US14/648,758 patent/US9864343B2/en active Active
- 2013-12-12 WO PCT/EP2013/076444 patent/WO2014111210A1/fr active Application Filing
- 2013-12-12 CN CN201380070735.5A patent/CN104937505B/zh active Active
- 2013-12-12 EP EP13803036.6A patent/EP2946251B1/fr active Active
- 2013-12-12 JP JP2015551149A patent/JP6022715B2/ja active Active
-
2016
- 2016-02-25 HK HK16102156.8A patent/HK1214376A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US9864343B2 (en) | 2018-01-09 |
WO2014111210A1 (fr) | 2014-07-24 |
EP2946251B1 (fr) | 2017-02-22 |
CN104937505B (zh) | 2017-06-13 |
JP2016507738A (ja) | 2016-03-10 |
EP2946251A1 (fr) | 2015-11-25 |
HK1214376A1 (zh) | 2016-07-22 |
CN104937505A (zh) | 2015-09-23 |
US20150316896A1 (en) | 2015-11-05 |
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