JP6010827B2 - Dicing apparatus and dicing method - Google Patents

Description

  The present invention relates to a dicing apparatus and a dicing method for cutting a workpiece such as a semiconductor wafer and separating it into individual chips, and more particularly to a dicing apparatus and a dicing method using an ultrasonic vibrator.

  Conventionally, in the field of a dicing apparatus that cuts a workpiece such as a semiconductor wafer and separates it into individual chips, a dicing apparatus using an ultrasonic vibrator has been proposed (for example, see Patent Document 1).

  The dicing apparatus described in Patent Document 1 is a dicing apparatus that cuts a workpiece using a blade that vibrates ultrasonically in a radial direction by ultrasonic vibration transmitted from an ultrasonic vibrator. As compared with a general dicing apparatus that cuts a workpiece using a blade that does not vibrate, the cutting resistance is reduced.

JP 2006-319214 A

  However, the dicing apparatus described in Patent Document 1 has the following problems.

  First, the dicing apparatus described in Patent Document 1 has a problem that the cutting resistance is not sufficiently reduced depending on the type of workpiece, and the blade is likely to be worn (the blade life (life) is short). For this reason, the further reduction of cutting resistance is calculated | required.

  Second, in the dicing apparatus described in Patent Document 1, the average machining resistance decreases, but the blade vibrates ultrasonically in the radial direction and repeats the expansion and contraction, so the moment when the blade diameter increases. A sudden load acts on the blade and the workpiece (see FIG. 12). Further, in the dicing apparatus described in Patent Document 1, since the force is always applied in the direction perpendicular to the machining surface (arc) with respect to the amplitude direction, the radial load is not dispersed in the other direction, and the blade A sudden load acts on the workpiece (see FIG. 13). For this reason, the dicing apparatus described in Patent Document 1 has a problem that it is difficult to target a workpiece made of a more brittle material or a thinner workpiece. In the dicing apparatus described in Patent Document 1, the principle that the blade vibrates ultrasonically in the radial direction and repeats the expansion and contraction is described in detail in paragraphs 0045 to 0050 of Patent Document 1.

  Thirdly, in the dicing apparatus described in Patent Document 1, since the radial amplitude is the same throughout the circumference, a large amplitude at the machining point may affect the machining quality.

  Fourthly, in the dicing apparatus described in Patent Document 1, a dedicated blade is required for ultrasonic vibration in the radial direction. For this reason, when replacing the blade, it is necessary to replace it with a dedicated blade, which increases the running cost.

  Fifth, the dicing apparatus described in Patent Document 1 has a problem that it is difficult to keep the vibration state constant because the blade diameter changes depending on the blade wear state and the blade vibration state changes accordingly. is there. To maintain the same vibration state, delicate control is required.

  The present invention has been made in view of such circumstances. First, even when the workpiece is a difficult-to-cut material such as SiC, the cutting resistance can be sufficiently reduced, and the blade is not easily worn (blade is not easily worn). It is an object to provide a dicing apparatus and a dicing method having a long life.

  A second object of the present invention is to provide a dicing apparatus and a dicing method in which a sudden load does not act on the blade and the work, and a work made of a more brittle material or a thinner work can be targeted for dicing. .

  A third object of the present invention is to provide a dicing apparatus and a dicing method capable of suppressing a large amplitude from being generated at a processing point and suppressing the influence on the processing quality.

  A fourth object of the present invention is to provide a dicing apparatus and a dicing method that do not require replacement with a dedicated blade and can reduce running costs.

  A fifth object of the present invention is to provide a dicing apparatus and a dicing method capable of keeping the vibration state constant regardless of the blade wear state (excellent reproducibility of the vibration state).

  In order to achieve the object, the invention according to claim 1 is a dicing apparatus for cutting a workpiece placed on a work table via an elastic body along a processing line by a blade rotated by a spindle. Workpiece vibration means for locally ultrasonically vibrating workpiece portions located on both sides of the processing line in the vertical direction is provided.

  According to the first aspect of the present invention, the work portions located on both sides of the processing line are locally ultrasonically vibrated in the vertical direction by the action of the work vibration means. As a result, stress concentrates on the processing progressing portion (the portion in the processing line where the blade is cutting), and the processing progressing portion has a high strain energy. As a result, the processing progress part is in a state of being broken by a slight impact (because the work is made of a brittle material).

  As a result, the cutting force (and the load on the blade) is reduced as compared with the conventional technique (Patent Document 1) in which the workpiece portions located on both sides of the processing line are not locally ultrasonically vibrated in the vertical direction, and the workpiece is, for example, SiC. Even in the case of difficult-to-cut materials such as the above, the blade is less likely to be worn (the blade life (life) becomes longer). In addition, the cutting speed is improved and the machining quality of the workpiece is improved.

  Further, according to the invention according to claim 1, since the vibration of the machining point becomes a spot-like minute vibration, a sudden load does not act on the blade and the workpiece, and a workpiece made of a more brittle material or a thinner workpiece can be obtained. It becomes possible to make it a target of dicing. According to the first aspect of the invention, since the amplitude is always in the vertical direction, the load acting on the blade and the work is distributed in the shear direction (rotation direction) and the direction perpendicular to the machining surface. The load acting on the workpiece becomes smaller. Further, according to the first aspect of the invention, since the vibration at the machining point is a spot-like minute vibration, the machining quality is affected as compared with the conventional technique (Patent Document 1) in which a large amplitude is generated at the machining point. Can be suppressed.

  Further, according to the invention according to claim 1, since it is configured to locally ultrasonically vibrate the work portions located on both sides of the processing line instead of the blade, it is not necessary to replace with a dedicated blade. Compared with the prior art (Patent Document 1) that needs to be replaced with a dedicated blade, the running cost can be reduced.

  In addition, according to the first aspect of the present invention, since the work parts located on both sides of the processing line, not the blades, are locally ultrasonically vibrated in the vertical direction, the vibrations are generated regardless of the blade wear state. It becomes possible to keep the state constant (excellent reproducibility of the vibration state).

  According to the first aspect of the present invention, the horn that transmits ultrasonic vibrations does not wear, so that the running cost can be reduced.

  The invention according to claim 2 is the invention according to claim 1, wherein the work parts located on both sides of the machining line are work parts located on both sides of the cut line in the machining line. .

  According to the invention which concerns on Claim 2, the workpiece | work part located in the both sides of the cut line (cut part in the processing line) locally ultrasonically vibrates to the vertical direction by the effect | action of a workpiece | work vibration means. As a result, the stress concentrates on the processing progress portion (the portion in the processing line where the blade is cutting), and the strain energy of the processing progress portion becomes high. As a result, the processing progress part is in a state of being broken by a slight impact (because the work is made of a brittle material).

  As a result, the cutting resistance (and the load on the blade) is reduced compared to the conventional technique (Patent Document 1) in which the work parts located on both sides of the cut line are not locally ultrasonically vibrated in the vertical direction, and the work is, for example, Even in the case of difficult-to-cut materials such as SiC, the blade is less likely to be worn (blade life (lifetime) becomes longer). In addition, the cutting speed is improved and the machining quality of the workpiece is improved.

  The invention according to claim 3 is the invention according to claim 1 or 2, wherein the work vibration means includes an ultrasonic vibrator fixed to the spindle, a fixing portion fixed to the ultrasonic vibrator, and A pair of horizontal portions that are disposed on both sides of the blade with a blade interposed therebetween and that form a gap between the workpiece portion, and a connecting portion that connects the fixed portion and the pair of horizontal portions. The horn that resonates with the ultrasonic wave generated by the ultrasonic vibrator functions as a medium that transmits the vibration of the horn that resonates with the ultrasonic vibration generated by the ultrasonic vibrator to the gap. Fluid supply means for supplying a fluid.

  According to the invention of claim 3, the work parts located on both sides of the processing line are locally ultrasonicated in the longitudinal direction by the action of the horn (and the fluid held between the pair of horizontal parts and the work part). It becomes possible to vibrate.

The invention according to claim 4 is the invention according to claim 3 , wherein the fluid supply means is a grinding water nozzle for injecting grinding water to the vicinity of the machining point.

  According to the invention which concerns on Claim 4, since it becomes possible to use a grinding water nozzle as a fluid supply means, it becomes possible to omit the installation space of a fluid supply means.

The invention according to claim 5 is the invention according to claim 3 or 4 , wherein the pair of horizontal portions includes a cooling water nozzle that injects cooling water to the blade.

  According to the invention which concerns on Claim 5, since it becomes possible to use a horn as a cooling water nozzle, the installation space of a cooling water nozzle can be abbreviate | omitted.

  According to a sixth aspect of the present invention, in the dicing method of cutting a workpiece placed on the work table via an elastic body along the processing line by a blade rotated by a spindle, the workpiece is positioned on both sides of the processing line. The processing line is cut while locally oscillating the workpiece portion in the longitudinal direction.

  According to the invention which concerns on Claim 6, the workpiece | work part located in the both sides of a processing line locally ultrasonically vibrates to the vertical direction. As a result, stress concentrates on the processing progressing portion (the portion in the processing line where the blade is cutting), and the processing progressing portion has a high strain energy. As a result, the processing progress part is in a state of being broken by a slight impact (because the work is made of a brittle material).

  As a result, the cutting force (and the load on the blade) is reduced compared to the conventional technique (Patent Document 1) in which the workpiece portions located on both sides of the processing line are not locally ultrasonically vibrated in the vertical direction, and the workpiece is made of SiC. Even in the case of such difficult-to-cut materials, the blade is less likely to be worn (blade life (life) becomes longer). In addition, the cutting speed is improved and the machining quality of the workpiece is improved.

  Further, according to the invention of claim 6, since the vibration at the machining point is a spot-like minute vibration, a sudden load does not act on the blade and the workpiece, and a workpiece made of a more brittle material or a thinner workpiece can be obtained. It becomes possible to make it a target of dicing. Further, according to the invention of claim 6, since the amplitude is always in the vertical direction, the load acting on the blade and the work is distributed in the shear direction (rotation direction) and the direction perpendicular to the processing surface. The load acting on the workpiece becomes smaller. Further, according to the invention of claim 6, since the vibration at the machining point is a spot-like minute vibration, the machining quality is affected as compared with the prior art (Patent Document 1) in which a large amplitude is generated at the machining point. Can be suppressed.

  Further, according to the invention according to claim 6, since it is configured to locally ultrasonically vibrate the work parts located on both sides of the processing line instead of the blade, it is not necessary to replace with a dedicated blade. Compared with the prior art (Patent Document 1) that needs to be replaced with a dedicated blade, the running cost can be reduced.

  Further, according to the invention according to claim 6, since it is configured to locally ultrasonically vibrate the work parts located on both sides of the processing line instead of the blade, the vibration is generated regardless of the worn state of the blade. It becomes possible to keep the state constant (excellent reproducibility of the vibration state).

  According to the sixth aspect of the present invention, since the horn that transmits ultrasonic vibrations does not wear, the running cost can be reduced.

  The invention according to claim 7 is the invention according to claim 6, wherein the work parts located on both sides of the machining line are work parts located on both sides of the cut line in the machining line. .

  According to the invention which concerns on Claim 7, the workpiece | work part located in the both sides of the cut line (cut part in the processing line) locally ultrasonically vibrates to the vertical direction. As a result, the stress concentrates on the processing progress portion (the portion in the processing line where the blade is cutting), and the strain energy of the processing progress portion becomes high. As a result, the processing progress part is in a state of being broken by a slight impact (because the work is made of a brittle material).

  As a result, the cutting force (and the load on the blade) is reduced and the workpiece is SiC compared to the prior art (Patent Document 1) in which the workpiece portions located on both sides of the cut line are not locally ultrasonically vibrated in the longitudinal direction. Even in the case of difficult-to-cut materials such as the above, the blade is less likely to be worn (the blade life (life) becomes longer). In addition, the cutting speed is improved and the machining quality of the workpiece is improved.

  According to the present invention, firstly, even if the workpiece is a difficult-to-cut material such as SiC, the cutting resistance can be sufficiently reduced, and the blade is not easily worn (the blade life (life) is long). It becomes possible to provide a method.

  Second, it is possible to provide a dicing apparatus and a dicing method capable of dicing a work made of a more brittle material or a thinner work without sudden load acting on the blade and the work. .

  Thirdly, it is possible to provide a dicing apparatus and a dicing method capable of suppressing the influence on the processing quality without generating a large amplitude at the processing point.

  Fourth, it is possible to provide a dicing apparatus and a dicing method that do not require replacement with a dedicated blade and can reduce running costs.

  Fifth, it is possible to provide a dicing apparatus and a dicing method capable of keeping the vibration state constant (excellent reproducibility of the vibration state) regardless of the blade wear state.

1 is a perspective view of a dicing apparatus 10. FIG. 2 is a perspective view of a workpiece W. FIG. FIG. 4 is a side sectional view for explaining the coupling relationship between the ultrasonic transducer 18 and the horn 20 and the like. 2 is a perspective view of a horn 20. FIG. FIG. 6 is a perspective view of a modified example of the horn 20. FIG. 6 is a perspective view of a modified example of the horn 20. (A) Side view showing a state immediately before the work table 16 holding the workpiece W is ground and fed in the X direction and the blade 12 cuts into the workpiece W from the processing start point P1, (b) the work table 16 holding the workpiece W. Is a side view showing a state in which the blade 12 is ground and fed in the X direction, the blade 12 cuts into the workpiece W from the machining start point P1, and the machining point P2 in the machining line La is being cut. It is a figure showing a mode that the force of a shear direction acts on the workpiece | work W at the process start point P1 at the time of a process start. (A) Perspective view showing a state in which workpiece parts W2 and W2 located on both sides of the cut line Lb are locally oscillating in the vertical direction, (b) the vertical axis is the amplitude of the workpiece W, and the horizontal axis is the machining line. It is the figure which wrote the vibration waveform of the workpiece | work W in the coordinate system of La. It is a perspective view of horn 20A (modified example of horn 20). It is a side view of the conventional dicing apparatus 90 to which the horn 20A is applied. It is a figure for pointing out the problem of the conventional dicing apparatus. It is a figure for pointing out the problem of the conventional dicing apparatus. It is a figure for demonstrating that the load which acts on the braid | blade 12 and the workpiece | work W becomes smaller.

  Hereinafter, preferred embodiments of a dicing apparatus and a dicing method according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a perspective view of the dicing apparatus 10.

  The dicing device 10 is a device that cuts the workpiece W and separates it into individual chips. As shown in FIG. 1, the dicing device 10 has a blade 12, a spindle 14, a work table 16, and these in the XYZθ directions as in a general dicing device. In addition to a driving mechanism (not shown) for driving, an alignment device (not shown), and the like, an ultrasonic transducer 18, a horn 20 and the like are further provided. In addition, the dicing apparatus 10 includes a control device (not shown) that controls the spindle 14, the drive mechanism, the alignment device, the ultrasonic transducer 18, and the like.

  The blade 12 is, for example, a thin disk-shaped blade (also called a dicing blade) holding diamond fine abrasive grains on its surface, and is used as a spindle shaft (not shown) of an air bearing spindle 14 incorporating a high-frequency motor. It is mounted and rotated at a high speed of up to 80,000 rpm.

  The blade 12 is covered with a flange cover 28 whose outer periphery other than the lower part is fixed to the spindle 14. A cooling water nozzle (not shown) for injecting cooling water to both side surfaces of the blade 12 is fixed inside the flange cover 28. A grinding water nozzle 22 for injecting grinding water to the vicinity of the processing point of the blade 12 (for example, above the processing point) is fixed to the flange cover 28 via a block 24. The grinding water nozzle 22 is disposed in a vertical plane including the blade 12.

  The blade 12 (and the spindle 14 on which it is mounted) is indexed in the axial direction of the spindle shaft (in the direction indicated by the arrow Y in FIG. 1) by a known drive mechanism (not shown), and the vertical direction (indicated by the arrow Z in FIG. 1). Direction).

  FIG. 2 is a perspective view of the workpiece W. FIG.

  The workpiece W is, for example, a semiconductor wafer on which a large number of integrated circuits are formed. As shown in FIG. 2, the work W is in a state where the back surface is pasted on a dicing tape S that is an elastic body attached to a ring-shaped frame F Is mounted on the work table 16 and is vacuum-sucked on the work table 16 and held on the work table 16.

  The work table 16 (and the work W held by the work table 16) is moved in an X direction (a direction perpendicular to a plane including the Y axis and the Z axis; an arrow X direction in FIG. 1) by a known drive mechanism (not shown). While being ground, it is rotated by θ around the vertical axis (θ axis).

  FIG. 3 is a side sectional view for explaining the coupling relationship between the ultrasonic transducer 18 and the horn 20.

  As shown in FIG. 3, the ultrasonic transducer 18 is, for example, a bolt-clamped Langevin transducer, and is composed of metal blocks 18a and 18b arranged above and below, and PZT arranged between the metal blocks 18a and 18b. A piezoelectric element 18c, a bolt 18d for fastening them, and the like are provided. The ultrasonic transducer 18 (lower metal block 18 b) is fixed to the spindle 14 via a block 26 and a flange cover 28.

  When an AC voltage is applied to the piezoelectric element 18c via the terminal 18e, the ultrasonic transducer 18 having the above-described configuration changes the thickness of the piezoelectric element 18c in synchronization with the AC frequency and vibrates in the vertical direction. A sonic vibration is generated (hereinafter, this vertical vibration is referred to as a vertical vibration). The ultrasonic transducer 18 is not limited to a bolt-clamped Langevin type transducer, and may be a transducer having other structure as long as it generates ultrasonic vibration in the vertical direction.

  The horn 20 (corresponding to the work vibration means of the present invention) is a metal rod-like member that vibrates (resonates) due to ultrasonic vibration generated by the ultrasonic vibrator 18, and as shown in FIG. The part 20a) is screwed to the lower end surface of the ultrasonic transducer 18 and is supported in a cantilever shape.

  4 is a perspective view of the horn 20, and FIGS. 5 and 6 are perspective views of the horn 20A (modified example of the horn 20).

  As shown in FIGS. 3 and 4, the horn 20 includes a fixed portion 20 a fixed to the ultrasonic transducer 18 with a screw, a pair of horizontal portions 20 b and 20 b, a fixed portion 20 a and a pair of horizontal portions 20 b and 20 b. The size, shape, etc. are set so that the vibration (resonance) by the ultrasonic vibration which the ultrasonic transducer | vibrator 18 generate | occur | produces is included including the connection part 20c etc. to connect.

  In addition, the front-end | tip part of a pair of horizontal parts 20b and 20b does not need to be connected mutually (refer FIG. 4), and may be connected mutually (refer FIG. 5, FIG. 6). When the tip portions of the pair of horizontal portions 20b and 20b are connected to each other, the rigidity is increased. Therefore, there is an advantage that the pair of horizontal portions 20b and 20b can be resonated even if they are extended in the X direction. .

  The pair of horizontal portions 20b and 20b have a symmetrical shape, and are arranged on both sides of the blade 12 with the blade 12 in between, with the fixing portion 20a fixed to the ultrasonic transducer 18 with screws. It is parallel to the side surface and extends in the X direction (see FIG. 1). The length in the X direction of the pair of horizontal portions 20b and 20b is preferably long, but if the length is long, it will cause problems such as interference with surrounding portions. Therefore, in this embodiment, the length in the X direction of the pair of horizontal portions 20b and 20b is about 20 mm.

  The pair of horizontal portions 20b, 20b includes planar lower surfaces 20b3, 20b3 extending in the X direction and parallel to the upper surface of the workpiece W (see FIG. 7A). As shown in FIG. 7A, the lower portion of the blade 12 protrudes downward by a predetermined amount from the lower surfaces 20b3 and 20b3 of the pair of horizontal portions 20b and 20b. This protrusion amount is obtained when the blade 12 is cut and fed in the Z direction and positioned at a predetermined cutting position (for example, a full cut position or a half cut position) (see FIG. 7A). A predetermined gap (for example, 1 to 3 mm) is formed between the portions 20b and 20b (the lower surfaces 20b3 and 20b3) and the workpiece W (the upper surface).

  The full cut position is a position where cutting is performed with a depth deeper than the workpiece W thickness (no uncut), and the half cut position is a position where cutting is performed with a depth shallower than the workpiece W thickness. (There is an uncut portion).

  As shown in FIG. 7A, the pair of horizontal portions 20b and 20b includes a first horizontal portion 20b1 and a second horizontal portion 20b2.

  The first horizontal portion 20b1 (the lower surface 20b3 thereof) is a portion extending from the machining start point P1 to the side opposite to the fixed portion 20a (see symbol L1 in FIG. 7A), and the blade 12 extends from the machining start point P1. Immediately before cutting into the workpiece W, the workpiece W is disposed above the workpiece W (the workpiece portions W1 and W1 located on both sides of the uncut machining line La) (see FIG. 7A). Thus, a gap H1 (for example, 1 to 3 mm) is formed between the first horizontal portions 20b1 and 20b1 (the lower surfaces 20b3 and 20b3 thereof) and the workpiece W (work portions W1 and W1).

  Fluid (mainly, grinding water sprayed from the grinding water nozzle 22) is supplied to the gap H1, and the gap H1 holds this. The fluid held in the gap H1 serves as a medium for transmitting the vibration (ultrasonic vibration) of the horn 20 that vibrates (resonates) by the ultrasonic vibration generated by the ultrasonic vibrator 18 to the workpiece W (workpiece portions W1, W1). Function.

  The processing line La is a line scheduled to be cut, and when the workpiece W is a semiconductor wafer, it is also referred to as a street (or a scribe line) that partitions chips (integrated circuits) formed on the workpiece W. ).

  The second horizontal portion 20b2 (the lower surface 20b3 thereof) is a portion extending from the machining start point P1 toward the fixed portion 20a (see reference numeral L2 in FIG. 7A), and the blade 12 moves from the machining start point P1 to the workpiece W. During the cutting and cutting of the processing point P2 in the processing line La, it is arranged above the workpiece parts W2 and W2 located on both sides of the cut line Lb (see FIG. 7B). Thereby, a gap H2 (for example, 1 to 3 mm) is formed between the second horizontal portions 20b2 and 20b2 (the lower surfaces 20b3 and 20b3 thereof) and the work portions W2 and W2.

  Fluid (mainly, grinding water sprayed from the grinding water nozzle 22) is supplied to the gap H2, and the gap H2 holds this. The fluid held in the gap H2 is a medium for transmitting the vibration (ultrasonic vibration) of the horn 20 that vibrates (resonates) by the ultrasonic vibration generated by the ultrasonic vibrator 18 to the workpiece W (workpiece portions W2, W2). Function.

  The cut line Lb is a cut part in the processing line La, that is, a part between the processing start point P1 and the processing point P2 in the processing line La.

  Next, the operation of the dicing apparatus 10 having the above configuration will be described.

  First, as shown in FIG. 2, the workpiece W is mounted with a back surface attached on a dicing tape S which is an elastic body attached to a ring-shaped frame F, and is vacuum-sucked on the work table 16. Held by this.

  Next, using an alignment device (not shown), alignment is performed to match the processing line with the X direction (the cutting direction of the blade 12).

  Next, the blade 12 is rotated at a high speed by the spindle 14, and grinding water and cooling water are jetted from the grinding water nozzle 22 and a cooling water nozzle (not shown) to the blade 12.

  Next, the blade 12 (and the spindle 14 on which the blade 12 is mounted) is indexed in the Y direction, positioned to the first processing line La, and incised in the Z direction. Full cut position or half cut position).

  Next, the work table 16 holding the work W is ground and fed in the X direction, and the positioned blade 12 cuts the work W held on the work table 16 along the first processing line La. When the cutting of the first processing line La is completed, the blade 12 (and the spindle 14 to which the blade 12 is mounted) is indexed in the Y direction and positioned to the next processing line La. The positioned blade 12 cuts the workpiece W held on the workpiece table 16 that is ground and fed in the X direction along the next processing line La, as described above. The above is repeated and the cutting of all the processing lines La is completed.

  Next, the work table 16 is rotated 90 degrees (θ rotation). In the same manner as described above, the blade 12 cuts the workpiece W held on the workpiece table 16 that is ground and fed in the X direction along the machining line La orthogonal to the machined machining line La. Thus, the workpiece W is separated into individual chips T (see FIG. 2).

  Next, the operation of the horn 20 and the like during the cutting will be described.

  In the following description, it is assumed that the ultrasonic vibrator 18 generates ultrasonic vibration and the horn 20 vibrates (resonates) by the ultrasonic vibration generated by the ultrasonic vibrator 18.

  First, the operation of the horn 20 and the like at the start of processing will be described.

  FIG. 7A shows a state immediately before the work table 16 holding the work W is ground and fed in the X direction and the blade 12 is cut into the work W from the processing start point P1.

  As shown in FIG. 7A, the pair of horizontal portions 20b and 20b (first horizontal portions 20b1 and 20b1) is formed immediately before the blade 12 cuts into the workpiece W from the machining start point P1. Arranged above the workpiece parts W1, W1) located on both sides of La. Thus, a gap H1 (for example, 1 to 3 mm) is formed between the first horizontal portions 20b1 and 20b1 (the lower surfaces 20b3 and 20b3 thereof) and the workpiece W (the upper surfaces of the workpiece portions W1 and W1).

  The gap H1 is supplied with fluid (mainly, grinding water sprayed from the grinding water nozzle 22) that is entrained by the blade 12 that rotates at high speed, and the gap H1 holds this fluid. The fluid held in the gap H1 serves as a medium for transmitting the vibration (ultrasonic vibration) of the horn 20 that vibrates (resonates) by the ultrasonic vibration generated by the ultrasonic vibrator 18 to the workpiece W (workpiece portions W1, W1). Function.

  The vibration (ultrasonic vibration) of the horn 20 that vibrates (resonates) due to the ultrasonic vibration generated by the ultrasonic vibrator 18 passes through the fluid held in the gap H1 due to the density fluctuation of the fluid held in the gap H1. It is transmitted to the work W (work parts W1, W1), and the work W (work parts W1, W1) is locally vibrated in the vertical direction (ultrasonic vibration). Since the workpiece W is mounted on the dicing tape S which is an elastic body, the vibration (ultrasonic vibration) of the horn 20 that vibrates (resonates) by the ultrasonic vibration generated by the ultrasonic vibrator 18 is the workpiece W (workpiece). Good transmission to the parts W1, W1).

  The vibration transmitted to the workpiece W (work portions W1 and W1) is longitudinal vibration (ultrasonic vibration). The reason is that the vertical direction of the fluid held in the gap H1 is sandwiched between the horn 20 (first horizontal portions 20b1 and 20b1) and the workpiece W (workpiece portions W1 and W1). This is because the horizontal vibration (ultrasonic vibration) is not transmitted because the horizontal direction is open (see FIG. 7A).

  If horizontal vibration (ultrasonic vibration) is transmitted to the workpiece W (workpiece parts W1, W1), the workpiece W vibrates in the spindle axis direction or the like by horizontal vibration, and the position of the cut line, the machining groove Although the width may adversely affect quality such as variation, in the present embodiment, since the horizontal vibration (ultrasonic vibration) is not transmitted as described above, the adverse effect can be suppressed.

  As described above, in the dicing apparatus 10 according to the present embodiment, the workpiece parts W1 and W1 located on both sides of the uncut machining line La locally vibrate (ultrasonic vibration) at the start of machining. This produces the following advantages.

  First, since the vibration transmitted to the workpiece W (the workpiece portions W1, W1) is local longitudinal vibration (ultrasonic vibration), a shearing force acts on the workpiece W at the processing start point P1. (See FIG. 8). FIG. 8 shows a state in which a force in the shearing direction acts on the workpiece W at the machining start point P1 at the start of machining.

  Thereby, compared with the prior art (patent document 1) in which the work parts located on both sides of the processing line do not locally ultrasonically vibrate in the longitudinal direction, the cutting resistance (and the load on the blade 12) is reduced, and the work W is reduced. For example, even in the case of a difficult-to-cut material such as SiC, the blade 12 is less likely to be worn (the blade life (life) becomes longer). In addition, the cutting speed is improved and the machining quality of the workpiece is improved.

  Secondly, since fluid (for example, grinding water sprayed from the grinding water nozzle 22) to which ultrasonic waves are applied is supplied into the machining groove of the workpiece W, cavitation occurs in the machining groove of the workpiece W. As a result, it is possible to prevent clogging of the blade 12, suppress precipitation of cutting waste on the workpiece W, reduce contamination, and the like. Thereby, processing quality improves.

  Thirdly, since the pair of horizontal portions 20b and 20b are symmetrically arranged on both sides of the blade 12, the workpiece portions W1 and W1 located on both sides of the uncut machining line La are evenly vibrated. It becomes possible to make it. Thereby, the cut surfaces of the work W cut by the blade 12 are the same on the left and right, and the quality of each chip T is improved.

  In addition, since the ultrasonic transducer | vibrator 18 (and horn 20) does not contact the workpiece | work W at the time of a process start (refer Fig.7 (a)), a physical damage is not given to the quality of the workpiece | work W. FIG.

  Next, the operation of the horn 20 and the like after the start of processing of one processing line La and before completion of processing (that is, during cutting of one processing line La) will be described.

  FIG. 7B shows a state in which the work table 16 holding the workpiece W is ground and fed in the X direction, and the blade 12 cuts into the workpiece W from the machining start point P1 to cut the machining point P2 in the machining line La. Represents.

  As shown in FIG. 7B, in the pair of horizontal portions 20b and 20b (second horizontal portions 20b2 and 20b2), the blade 12 cuts the processing point P2 in the processing line La from the processing start point P1 into the work W. During cutting, the workpiece parts W2 and W2 located on both sides of the cut line Lb are disposed above. Accordingly, a gap H2 (for example, 1 to 3 mm) is formed between the second horizontal portions 20b2 and 20b2 (the lower surfaces 20b3 and 20b3) and the work portions W2 and W2 (the upper surfaces thereof).

  The gap H2 is supplied with a fluid (mainly, grinding water sprayed from the grinding water nozzle 22) that is entrained by the blade 12 that rotates at a high speed, and the gap H2 holds the fluid. The fluid held in the gap H2 is a medium for transmitting the vibration (ultrasonic vibration) of the horn 20 that vibrates (resonates) by the ultrasonic vibration generated by the ultrasonic vibrator 18 to the workpiece W (workpiece portions W2, W2). Function.

  The vibration (ultrasonic vibration) of the horn 20 that vibrates (resonates) due to the ultrasonic vibration generated by the ultrasonic vibrator 18 passes through the fluid held in the gap H2 by the density fluctuation of the fluid held in the gap H2. It is transmitted to the work W (work parts W2, W2), and the work W (work parts W2, W2) is locally vibrated in the vertical direction (ultrasonic vibration). Since the workpiece W is mounted on the dicing tape S which is an elastic body, the vibration (ultrasonic vibration) of the horn 20 that vibrates (resonates) by the ultrasonic vibration generated by the ultrasonic vibrator 18 is the workpiece W (workpiece). Good transmission to the parts W2, W2).

  The vibration transmitted to the workpiece W (work portions W2, W2) is a longitudinal vibration (ultrasonic vibration). The reason is that the vertical direction of the fluid held in the gap H2 is sandwiched between the horn 20 (second horizontal portions 20b2 and 20b2) and the workpiece W (workpiece portions W2 and W2). This is because the horizontal vibration (ultrasonic vibration) is not transmitted because the horizontal direction is open (see FIG. 7B).

  If horizontal vibration (ultrasonic vibration) is transmitted to the workpiece W (work portions W2, W2), the workpiece W vibrates in the spindle axis direction or the like due to the horizontal vibration, and the position of the cut line, the machining groove Although the width may adversely affect quality such as variation, in the present embodiment, since the horizontal vibration (ultrasonic vibration) is not transmitted as described above, the adverse effect can be suppressed.

  As described above, in the dicing apparatus 10 of the present embodiment, the machining line La is positioned on both sides of the cut line Lb after the machining is started and before the machining is completed (that is, the machining line La is being cut). The work parts W2 and W2 locally vibrate in the vertical direction (ultrasonic vibration). This produces the following advantages.

  First, the process progressing part is in a state of being destroyed by a slight impact. The processing progressing portion is a portion in the processing line La where the blade 12 is cutting, that is, a tip portion of the cut line Lb.

  Hereinafter, the reason why the processing progress portion is in a state of being broken by a slight impact will be described.

  FIG. 9A shows a state in which the work parts W2 and W2 located on both sides of the cut line Lb in the machining line La are locally vibrated in the vertical direction (ultrasonic vibration). The arrow in FIG. 9A represents the distribution of stress (strain energy), and the length of the arrow represents the magnitude of stress (strain energy).

  The rigidity of the workpiece W is different between the machining start point P1 side and the machining point P2 side of the cut line Lb (the rigidity becomes lower from the machining point P2 toward the machining start point P1). When the workpiece parts W2 and W2 located on both sides of the cut line Lb are locally vibrated in the vertical direction (ultrasonic vibration), stress is concentrated on the machining progress portion 30 as in the case of a cantilever beam to which an equally distributed load is added. Then, the strain energy of the processing progressing portion 30 becomes high (see the longest arrow in FIG. 9A). Since the workpiece W is made of a brittle material, the work progressing portion 30 in which stress is concentrated and the strain energy is high is in a state of being broken by a slight impact.

  As a result, the cutting resistance (and the load on the blade 12) is reduced compared to the prior art (Patent Document 1) in which the work parts positioned on both sides of the cut line are not locally ultrasonically vibrated in the longitudinal direction. However, even in the case of a difficult-to-cut material such as SiC, the blade 12 is less likely to be worn (the blade life (life) becomes longer). In addition, the cutting speed is improved and the machining quality of the workpiece is improved.

  Secondly, the amplitude of the workpiece W is different between the machining start point P1 side and the machining point P2 side of the cut line Lb (the amplitude decreases from the machining start point P1 toward the machining point P2). reference). That is, since the vibration of the machining point P2 of the workpiece W is a spot-like minute vibration (see FIG. 9B), the machining point P2 does not flutter and a large amplitude is generated at the machining point (Patent Document 1). ), It is possible to suppress the influence on the processing quality. This makes it possible to reduce the load on the blade 12 (particularly at the machining start point P1 where the load on the blade 12 is large).

  Third, since fluid (for example, grinding water sprayed from the grinding water nozzle 22) to which ultrasonic waves are applied is supplied into the machining groove of the workpiece W, cavitation occurs in the machining groove of the workpiece W. As a result, it is possible to prevent clogging of the blade 12, suppress precipitation of cutting waste on the workpiece W, reduce contamination, and the like. Thereby, processing quality improves.

  Fourth, since the pair of horizontal portions 20b and 20b are symmetrically arranged on both sides of the blade 12, the workpiece portions W2 and W2 positioned on both sides of the cut line Lb are evenly vibrated. Is possible. Thereby, the cut surfaces of the work W cut by the blade 12 are the same on the left and right, and the quality of each chip T is improved.

  Note that the ultrasonic transducer 18 (and the horn 20) does not come into contact with the workpiece W after the start of processing of one processing line La but before processing is completed (that is, during cutting of one processing line La) (FIG. 7B). )), And does not cause physical damage to the quality of the workpiece W.

  In addition, a conventional dicing apparatus (see, for example, FIG. 11) is simply retrofitted with an ultrasonic transducer 18 or a horn 20 (without using large-scale equipment or consumables, etc.). Therefore, it is possible to configure the dicing apparatus 10 that exhibits the above effects at a very low cost.

  Next, a modified example of the horn 20 will be described.

  FIG. 10 is a perspective view of the horn 20A (a modification of the horn 20), and FIG. 11 is a side view of a conventional dicing apparatus 90 to which the horn 20A is applied.

  Compared with the horn 20 of the above-described embodiment, the horn 20A of the present modification includes a cooling water nozzle 20d in which a pair of horizontal portions 20b and 20b inject cooling water onto the side surfaces of the blade 12 (built in). Is different. Other than that, the configuration is the same as that of the horn 20.

  According to the horn 20A of the present modified example, compared to a conventional general dicing apparatus 90 (see FIG. 11) having cooling water nozzles 94 disposed on both sides of the blade 92 with the blade 92 interposed therebetween, By simply attaching the sonic transducer 18 and replacing the cooling water nozzle 94 with the horn 20A, it is possible to configure the dicing apparatus 10 that exhibits the above effects at a very low cost. Further, since the horn 20A can be used also as the cooling water nozzle 20d, the installation space for the cooling water nozzle 20d can be omitted.

  Moreover, although the said embodiment demonstrated the example which combines the grinding water nozzle 22 which injects grinding water to the process point vicinity as a fluid supply means of this invention, this invention is not limited to this. For example, a dedicated fluid supply nozzle may be provided separately from the grinding water nozzle 22. In addition, the fluid supplied by the fluid supply means may be processed water containing additives and the like in addition to water, pure water, and the like.

  Next, advantages of the dicing apparatus 10 of the present embodiment will be described in comparison with the dicing apparatus described in Patent Document 1 (Japanese Patent Laid-Open No. 2006-319214).

  The dicing apparatus described in Patent Document 1 is a dicing apparatus that cuts a workpiece using a blade that vibrates ultrasonically in a radial direction by ultrasonic vibration transmitted from an ultrasonic vibrator. As compared with a general dicing apparatus that cuts a workpiece using a blade that does not vibrate, the cutting resistance is reduced.

  When the dicing apparatus 10 of the present embodiment is compared with the dicing apparatus described in Patent Document 1, they match in that an ultrasonic transducer is used, but are essentially different in the following points.

  First, the dicing apparatus described in Patent Document 1 has a problem that the cutting resistance is not sufficiently reduced depending on the type of workpiece, and the blade is likely to be worn (the blade life (life) is short). For this reason, the further reduction of cutting resistance is calculated | required.

  On the other hand, according to the dicing apparatus 10 of the present embodiment, the horn 20 is provided, and the work portions W2 and W2 positioned on both sides of the cut line Lb by the action of the horn 20 locally extend in the vertical direction. The sound wave vibrates. Thereby, a stress concentrates on the process progress part 30, and the strain energy of the process progress part 30 will be in a high state (refer Fig.9 (a)). Thereby, the process progress part 30 will be in the state which will be destroyed by a slight impact (because the workpiece | work W consists of brittle materials).

  As a result, the cutting resistance (and the load on the blade 12) is reduced compared to the prior art (Patent Document 1) in which the work parts positioned on both sides of the cut line are not locally ultrasonically vibrated in the longitudinal direction. However, even in the case of a difficult-to-cut material such as SiC, the blade 12 is less likely to be worn (blade life (life) becomes longer). Further, the cutting speed is improved, and the processing quality of the workpiece W is improved.

  Second, in the dicing apparatus described in Patent Document 1, the average machining resistance decreases, but the blade vibrates ultrasonically in the radial direction and repeats the expansion and contraction, so the moment when the blade diameter increases. A sudden load acts on the blade and the workpiece (see FIG. 12). Further, in the dicing apparatus described in Patent Document 1, since the force is always applied in the direction perpendicular to the machining surface (arc) with respect to the amplitude direction, the radial load is not dispersed in the other direction, and the blade A sudden load acts on the workpiece 96 and the workpiece W (see FIG. 13). For this reason, the dicing apparatus described in Patent Document 1 has a problem that it is difficult to target a workpiece made of a more brittle material or a thinner workpiece.

  On the other hand, according to the dicing apparatus 10 of the present embodiment, since the vibration of the processing point P2 becomes a spot-like minute vibration (see FIG. 9B), a sudden load is applied to the blade 12 and the workpiece W. A workpiece W made of a more brittle material or a thinner workpiece W can be used as a dicing target without acting.

  Further, according to the dicing apparatus 10 of the present embodiment, since the amplitude is always in the vertical direction, the load acting on the blade 12 and the workpiece W is distributed in the shear direction (rotation direction) and the direction perpendicular to the processing surface. (See FIG. 14), the load acting on the blade 12 and the workpiece W becomes smaller.

  Thirdly, in the dicing apparatus described in Patent Document 1, since the radial amplitude is the same throughout the circumference, a large amplitude at the machining point may affect the machining quality.

  On the other hand, according to the dicing apparatus 10 of the present embodiment, since the vibration at the processing point P2 becomes a spot-like minute vibration (see FIG. 9B), a conventional technique in which a large amplitude is generated at the processing point ( Compared with Patent Document 1), it is possible to suppress the influence on the processing quality.

  Fourthly, in the dicing apparatus described in Patent Document 1, a dedicated blade is required for ultrasonic vibration in the radial direction. For this reason, when replacing the blade, it is necessary to replace it with a dedicated blade, which increases the running cost.

  On the other hand, according to the dicing apparatus 10 of the present embodiment, the workpiece portions W2 and W2 located on both sides of the cut line Lb are not locally bladed, but are configured to locally ultrasonically vibrate. Therefore, it is not necessary to replace the blade with a dedicated blade, and the running cost can be reduced as compared with the conventional technique (Patent Document 1) that needs to be replaced with a dedicated blade.

  Fifth, the dicing apparatus described in Patent Document 1 has a problem that it is difficult to keep the vibration state constant because the blade diameter changes depending on the blade wear state and the blade vibration state changes accordingly. is there. To maintain the same vibration state, delicate control is required.

  On the other hand, according to the dicing apparatus 10 of the present embodiment, since the work parts W2 and W2 located on both sides of the processing line Lb, not the blade 12, are configured to locally ultrasonically vibrate, Regardless of the wear state of the blade 12, the vibration state can be kept constant (excellent reproducibility of the vibration state). Further, according to the dicing apparatus 10 of the present embodiment, the horn 20 that transmits ultrasonic vibrations does not wear, so that running costs can be suppressed.

  The above embodiment is merely an example in all respects. The present invention is not construed as being limited to these descriptions. The present invention can be implemented in various other forms without departing from the spirit or main features thereof.

  DESCRIPTION OF SYMBOLS 10 ... Dicing apparatus, 12 ... Blade, 14 ... Spindle, 16 ... Worktable, 18 ... Ultrasonic vibrator, 18a, 18b ... Metal block, 18c ... Piezoelectric element, 18d ... Bolt, 18e ... Terminal, 20, 20A ... Horn, 20a ... fixed portion, 20b ... a pair of horizontal portions, 20b1 ... first horizontal portion, 20b2 ... second horizontal portion, 20b3 ... bottom surface, 20c ... connecting portion, 22 ... grinding water nozzle, 24 ... block, 26 ... block 28 ... Flange cover, 30 ... Processing progress part, La ... Processing line, Lb ... Cut line, P1 ... Processing start point, P2 ... Processing point, S ... Dicing tape, W ... Work, W1 ... Work part, W2 ... Work part

Claims (12)

In a dicing apparatus that cuts the upper surface of a work placed on a work table via an elastic body along a processing line by a blade rotated by a spindle,
Workpiece vibration means for generating ultrasonic vibration that vibrates in a direction perpendicular to the upper surface of the workpiece and locally transmitting the ultrasonic vibration to work portions located on both sides of the processing line is provided. Dicing equipment.   2. The dicing apparatus according to claim 1, wherein the workpiece portions located on both sides of the machining line are workpiece portions located on both sides of the cut line in the machining line. The work vibration means is
An ultrasonic transducer fixed to the spindle;
A fixed portion fixed to the ultrasonic transducer, a pair of horizontal portions disposed on both sides of the blade with the blade interposed therebetween, and forming a gap between the workpiece portion, the fixed portion, and the A horn that resonates with ultrasonic waves generated by the ultrasonic vibrator, and a connecting portion that connects a pair of horizontal portions;
Fluid supply means for supplying a fluid that functions as a medium for transmitting the vibration of the horn resonated by the ultrasonic vibration generated by the ultrasonic vibrator to the work portion, to the gap;
The dicing apparatus according to claim 1 or 2, further comprising: In a dicing apparatus that cuts a work placed on a work table via an elastic body along a processing line by a blade rotated by a spindle,
Workpiece vibration means for locally ultrasonically vibrating the work parts located on both sides of the processing line in the vertical direction ,
The work vibration means is
An ultrasonic transducer fixed to the spindle;
A fixed portion fixed to the ultrasonic transducer, a pair of horizontal portions disposed on both sides of the blade with the blade interposed therebetween, and forming a gap between the workpiece portion, the fixed portion, and the A horn that resonates with ultrasonic waves generated by the ultrasonic vibrator, and a connecting portion that connects a pair of horizontal portions;
Fluid supply means for supplying a fluid that functions as a medium for transmitting the vibration of the horn resonated by the ultrasonic vibration generated by the ultrasonic vibrator to the work portion, to the gap;
A dicing apparatus comprising: The dicing apparatus according to claim 3 or 4 , wherein the fluid supply means is a grinding water nozzle that injects grinding water in the vicinity of a processing point. 6. The dicing apparatus according to claim 3, wherein the pair of horizontal portions includes a cooling water nozzle that injects cooling water to the blade. In a dicing method of cutting an upper surface of a work placed on a work table via an elastic body along a processing line by a blade rotated by a spindle,
By generating ultrasonic vibrations which vibrates in the direction perpendicular to the upper surface of the workpiece, to cut the processing line while locally is transmitted to the work portion located the ultrasonic vibration to both sides of the processing line A dicing method characterized by the above. The dicing method according to claim 7 , wherein the workpiece portions located on both sides of the machining line are workpiece portions located on both sides of the cut line in the machining line. By resonating the horn with ultrasonic waves generated by an ultrasonic transducer and transmitting the resonating vibration of the horn to the work part via a fluid, the work parts located on both sides of the processing line are locally The dicing method according to claim 7, wherein ultrasonic vibration is performed on the dicing method. In a dicing method of cutting a work placed on a work table via an elastic body along a processing line by a blade rotated by a spindle,
The horn is resonated by ultrasonic waves generated by an ultrasonic vibrator, and the vibration of the resonating horn is transmitted to the work parts located on both sides of the processing line via a fluid, thereby locally transferring the work part. A dicing method characterized by causing ultrasonic vibration in the vertical direction. The dicing method according to claim 9 or 10, wherein the fluid is grinding water sprayed from a cutting water nozzle to the vicinity of a machining point. The dicing method according to claim 9, wherein the cooling water is jetted from the cooling water nozzle provided in the horn to the blade.

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