JP2003068677A - Device and method for dicing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent silicon dust from adhering to a silicon wafer, when dicing the silicon wafer. SOLUTION: A silicon wafer 2 is cut with a blade 4. Rinsing water is jetted from a chip-rinsing water nozzle 7 to this silicon wafer 2 under cutting. Countless fine air bubbles are mixed into the rinsing water to be jetted from this chip-rinsing water nozzle 7 by a fine air bubble generating and a mixing part 6. Thus, each of fine air bubbles contained in the rinsing water is broken, by blowing to the silicon wafer 2 and generates a ultrasonic wave. With vibration caused by this ultrasonic wave, the silicon dust hardly adheres, and the adhered silicon dust is made to float and can be washed away easily.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a dicing apparatus and a dicing method for cutting a wafer into semiconductor chip sizes. Specifically, by mixing micro air bubbles with the cleaning water sprayed onto the wafer during wafer cutting, the dust generated during wafer cutting will not adhere to the wafer and the micro air bubbles contained in the cleaning water will The ultrasonic waves generated when bursting prevent the dust from adhering to the wafer by the ultrasonic waves generated when the microbubbles burst.

[0002]

2. Description of the Related Art FIG. 3 is a schematic side view of a conventional dicing apparatus. The dicing device 11 is a silicon wafer 1.
2 is supported by a chuck table 13, and the supported silicon wafer 12 is cut by a blade 14. The blade 14 has a disk shape and cuts the silicon wafer 12 while rotating at a high speed. Then, for example, by moving the chuck table 13 side, the cutting position of the silicon wafer 12 by the blade 14 is shifted, and the silicon wafer 12 is cut into a diced shape.

Pure water as cooling water is supplied to the blade cooling nozzle 15 and jetted toward the blade 14. As a result, the cooling water is sprayed onto the blade 14, and the blade 14 during cutting the silicon wafer 12 is cut.
Cool down.

Pure water as cleaning water is supplied to the cutting cleaning water nozzle 16 and sprays it toward the silicon wafer 12. As a result, the cleaning water is sprayed onto the silicon wafer 12, and silicon dust generated by dicing is prevented from adhering to the silicon wafer 12.

Pure water as cleaning water is supplied to the nozzle 17 and sprays it toward the silicon wafer 12.
The nozzle 17 has a structure in which a plurality of holes are formed in a pipe extending in a direction orthogonal to the transport direction of the silicon wafer 12 toward the silicon wafer 12 along the extending direction. By moving for dicing at 14, the entire surface of the silicon wafer 12 can be washed away with cleaning water.

[0006]

When the wafer is a silicon wafer, the bonding pads are often made of aluminum. The bonding pad formed of aluminum has a roughened surface to facilitate wire bonding.

Now, when a silicon wafer is cut by a blade, silicon dust is generated. Then, as described above, if the surface of the bonding pad is rough, the silicon dust is likely to adhere in a pierced state.

As described above, when the silicon dust is stuck to the bonding pad, it is difficult to completely remove the cleaning water even if the cleaning water is sprayed on the silicon wafer.

If the silicon dust adheres to the bonding pad, bondability of the bonding wire to the bonding pad is deteriorated in the wire bonding process in the assembly process after the dicing process, and bondability is significantly reduced. It adversely affects reliability and yield. Therefore, it is an important issue to prevent dust from adhering to the wafer in the dicing process.

Therefore, the present invention has been made to solve such a problem, and an object of the present invention is to provide a dicing apparatus and a dicing method capable of suppressing adhesion of dust to a wafer during dicing.

[0011]

In order to solve the above-mentioned problems, a dicing apparatus according to the present invention is a dicing apparatus for cutting a wafer to the size of a semiconductor chip, and spraying cleaning water mixed with fine bubbles onto the wafer. It is equipped with a cleaning means.

Further, the dicing method according to the present invention is a dicing method for cutting a wafer to the size of a semiconductor chip, spraying cleaning water mixed with fine bubbles to the wafer being cut and bursting the fine bubbles on the wafer. The ultrasonic wave is generated.

According to the dicing apparatus and the dicing method according to the present invention described above, the cleaning water mixed with the fine bubbles is sprayed onto the wafer being cut so that the ultrasonic waves generated when the fine bubbles burst on the wafer. This makes it easier for dust to float from the surface of the wafer. This allows
The dust on the surface of the wafer can be easily washed away with the washing water, and the contamination of the wafer in the dicing process can be prevented.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a dicing apparatus of the present invention will be described below with reference to the drawings. That is, FIG.
FIG. 3 is a schematic side view of the dicing device according to the present embodiment.
The dicing apparatus 1 according to the present embodiment mixes the fine bubbles with the cleaning water sprayed on the silicon wafer 2 during the cutting of the silicon wafer 2 to utilize the ultrasonic waves generated when the fine bubbles burst. It suppresses the adhesion of silicon dust.

The dicing apparatus 1 includes a chuck table 3
The silicon wafer 2 placed on is cut by the blade 4. The blade 4 has a disk shape and cuts the silicon wafer 2 while rotating at a high speed. Then, for example, by moving the chuck table 3 side, the cutting position of the silicon wafer 2 by the blade 4 is shifted, and the silicon wafer 2 is cut into a diced shape.

Pure water as cooling water is supplied to the blade cooling nozzle 5 and jetted toward the blade 4. As a result, the cooling water is sprayed onto the blade 4 to cool the blade 4 while the silicon wafer 2 is being cut.

Micro-bubble generating / mixing section 6 constituting a cleaning means
And a tank 6a to which pure water as cleaning water is supplied, and a tank 6a.
It is composed of a gas supply unit 6b for supplying dry air or a gas such as nitrogen gas into the pure water in a. The gas supply unit 6b is made of a porous material such as ceramics. By supplying dry air or nitrogen gas into pure water via the gas supply unit 6b, countless micro bubbles are generated in the pure water. .

The cutting water nozzle 7 constituting the cleaning means is supplied with cleaning water mixed with innumerable minute bubbles from the minute bubble generating / mixing section 6 and jets this toward the silicon wafer 2. As a result, cleaning water containing innumerable minute bubbles is sprayed onto the silicon wafer 2, and silicon dust generated by dicing is prevented from adhering to the silicon wafer 2.

Pure water as cleaning water is supplied to the nozzle 8 and sprays it toward the silicon wafer 2. The nozzle 8 has a structure in which a pipe extending in a direction orthogonal to the transport direction of the silicon wafer 2 is provided with a plurality of holes toward the silicon wafer 2 along the extending direction. By moving the wafer for dicing at 4, the entire surface of the silicon wafer 2 can be washed away with cleaning water.

FIG. 2 is a plan view showing a cleaning range by the cutting cleaning water nozzle 7 described above. The cutting cleaning water nozzle 7
It is provided on the left and right sides of the blade 4. Then, by spraying the cleaning water mixed with the micro bubbles to both sides of the blade 4 along the direction of the blade 4, the range of application of the cleaning water mixed with the micro bubbles is roughly as shown in FIG. It becomes a substantially fan-shaped range indicated by a dotted line. Therefore,
By carrying the silicon wafer 2 in the direction of the arrow for dicing with the blade 4, the silicon wafer 2
It is possible to spray washing water mixed with micro bubbles on the entire surface of the.

The operation of the dicing apparatus of this embodiment will be described below as an example of the embodiment of the dicing method of the present invention. Here, in the case of the silicon wafer 2, many bonding pads are made of aluminum. The bonding pad formed of aluminum has a roughened surface to facilitate wire bonding.

When the silicon wafer 2 is cut by the blade 4, silicon dust is generated. Then, as described above, if the surface of the bonding pad is rough, the silicon dust is likely to adhere in a pierced state.

Therefore, cleaning water in which the minute bubbles are mixed is prepared in the minute bubble generating / mixing section 6, and this is sprayed from the cutting cleaning water nozzle 7 and sprayed onto the silicon wafer 2. Innumerable micro bubbles contained in the cleaning water are blown onto the silicon wafer 2 to generate ultrasonic waves when bursting on the silicon wafer 2. The vibration caused by the ultrasonic waves makes it easier for the silicon dust existing on the surface of the silicon wafer 2 to float. As a result, the silicon dust can be easily washed off with the washing water or the like flowing on the surface of the silicon wafer 2.

Also, the silicon dust that sticks to the bonding pad and adheres easily by ultrasonic waves due to the rupture of fine bubbles in the cleaning water, and can be easily washed away by the cleaning water flowing on the surface of the silicon wafer 2. You can

As described above, the cleaning water sprayed on the silicon wafer 2 during the cutting of the silicon wafer 2 mixes innumerable minute bubbles, so that the silicon dust generated by cutting the silicon wafer 2 causes the bonding pads and the bonding pads to be removed. It can be prevented from adhering to the periphery.

Since the micro-bubble generating / mixing section 6 for mixing micro-bubbles in the cleaning water can be realized with a simple structure, it is possible to prevent the silicon wafer from being contaminated in the dicing process without increasing the cost.

[0027]

As described above, according to the present invention, cleaning water mixed with microscopic bubbles is sprayed onto a wafer in a dicing process for cutting the wafer into semiconductor chip sizes.

Therefore, the dust can be easily floated from the surface of the wafer by the ultrasonic waves generated by the bursting of the fine bubbles when the cleaning water is sprayed on the wafer. As a result, the dust can be easily washed away with the washing water, and the contamination of the wafer in the dicing process can be prevented.

Since the wafer can be prevented from being contaminated in the dicing process, the reliability and the yield in the wire bonding process can be improved. Moreover, since dust can be easily removed, the amount of water used for cleaning can be reduced, and the load on the environment can be reduced.

[Brief description of drawings]

FIG. 1 is a schematic side view of a dicing device according to the present embodiment.

FIG. 2 is a plan view showing a cleaning range by a cutting cleaning water nozzle.

FIG. 3 is a schematic side view of a conventional dicing device.

[Explanation of symbols]

1 ... Dicing device, 2 ... Silicon wafer,
3 ... Chuck table, 4 ... Blade, 5 ...
・ Blade cooling nozzle, 6 ・ ・ ・ Micro bubble generation mixing section, 7 ・ ・ ・ Cutting water nozzle, 8 ・ ・ ・ Nozzle

Claims (2)

[Claims] 1. A dicing apparatus for cutting a wafer into a semiconductor chip size, comprising a cleaning means for spraying cleaning water mixed with microscopic bubbles onto the wafer. 2. A dicing method for cutting a wafer to the size of a semiconductor chip, spraying cleaning water mixed with micro bubbles on the wafer being cut, and rupturing the micro bubbles on the wafer to generate ultrasonic waves. A dicing method characterized by: