JP2002110591A - Apparatus and method of cleaning wafers after wire saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and method for cleaning wafers after wire saw, which can provide a uniform gap between the wafers and can enhance a wafer cleaning effect, by injecting a vapor of a mixture of a cleaning solution and a gas or a vapor of the cleaning solution into gaps between the wafers. SOLUTION: In an apparatus 10 for cleaning wafers after wire saw, a plurality of wafers 16 formed by slicing an ingot 11 held in a holding base 13 in a direction crossed by an axial line into thin plates are cleaned while held in the holding base 13. The ingot 11 is held in a gas atmosphere. The apparatus includes nozzles 27 for injecting a mixture of a cleaning solution and a gas into gaps G between the wafers 16 and a movement means 25 for changing a relative position between the nozzles 27 and wafers 16 in the axial line direction, and cleans the wafers 16 by the injection of the mixture.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an apparatus and a method for cleaning a wafer after a wire saw for cleaning a thin wafer formed by slicing an ingot of silicon or the like used as a semiconductor material.

[0002]

2. Description of the Related Art Conventionally, the surface of a thin wafer formed by slicing an ingot of silicon or the like with a wire saw or the like adheres fine dust such as cutting oil, chips, and abrasive grains used during cutting. Cleaning is performed carefully so as not to affect the quality of the post-process. At that time, if the wafers are separated and washed one by one from the holding base that holds the ingot, a lot of man-hours are required in the separation step and the transporting step. Therefore, a method of cleaning while holding the wafer on the holding base has been proposed. . In this case, for example, JP-A-11-11
As disclosed in Japanese Patent No. 1652, in the step of slicing an ingot, the ingot is sliced while being adhered to a holding base made of a carbon block or the like,
A plurality of adjacent wafers are formed with a narrow gap over the entire length of the ingot. Then, the ingot is directly attached to the cleaning device together with the holding base, and the cleaning is performed by immersing the ingot in the cleaning solution or spraying the cleaning solution on the wafer with a shower nozzle or a jet nozzle. In addition,
Generally, when a wafer is formed by slicing an ingot with a wire saw, the diameter of the wafer is about 300 mm, the total length of the ingot is about 600 mm, and the thickness of the wafer is 0.8 mm.
The gap (cut allowance) between adjacent wafers formed by slicing is about 0.2 to 0.25 mm.

[0003]

However, in the above-mentioned conventional method, the gap between adjacent wafers is limited to 0.2 to 0.2.
Since the cleaning liquid is as narrow as about 5 mm and the diameter is extremely large compared to the width of the gap, even if the cleaning liquid is sprayed in the cleaning liquid, the cleaning liquid does not sufficiently pass from the outer periphery to the central portion of the wafer, and fine dust is caught in the gap and cannot be removed. There was a problem.
In addition, since the wafer is only held on one side by adhesion to the holding base, the bonding portion of the wafer is deformed by the force of the jet jet of the cleaning liquid, causing the wafer to fall, and the gap between the plurality of wafers becomes uneven, There is a problem that a portion where the cleaning liquid hardly enters the gap is generated, and the cleaning state varies, and the wafer drops from the holding base.
The present invention has been made in view of such circumstances, and by maintaining a uniform gap between wafers by injecting a mixture of cleaning liquid and gas or vapor of the cleaning liquid toward the gap between wafers, maintaining a uniform gap between wafers. An object of the present invention is to provide an apparatus and a method for cleaning a wafer after a wire saw, which enhances a cleaning effect.

[0004]

According to a first aspect of the present invention, there is provided an apparatus for cleaning a wafer after a wire saw, wherein the ingot held by the holding base is sliced into a thin plate in a direction intersecting the axis of the ingot. Multiple wafers
A post-wire saw wafer cleaning apparatus for cleaning while being held by a holding base, a nozzle that holds an ingot in a gas atmosphere and sprays a mixture of a cleaning liquid and a gas toward a gap between wafers, and a nozzle. Moving means for changing the relative position of the wafer and the wafer in the axial direction, and cleaning the wafer by spraying the mixture. With this, the ingot is held in the air or nitrogen gas by the holding base,
For example, when a mixture in which a cleaning liquid composed of water or a solution containing a surfactant and a gas such as compressed air or nitrogen gas are mixed is ejected from a nozzle, the cleaning liquid in the mixture becomes a mist in which fine particles are dispersed. And is fed deep into the gap between the narrow wafers. As a result, the cleaning liquid adheres to the surface of the wafer, and the entire surface is wetted, and the flow of the cleaning liquid gradually occurs on the surface of the wafer, so that the fine dust adhering to the wafer can be washed off together with the flow by the gas injection. In particular, when the cleaning liquid contains a surfactant, the cleaning liquid that wets the surface of the wafer causes the fine dust to float and the fine dust to flow easily.

In the apparatus for cleaning a wafer after a wire saw according to the first invention, the nozzle may have a flow rate adjusting means for the mixture. In this case, the portion held by the adhesive on the holding base of the wafer and its vicinity does not deform the holding portion due to the mixture even if the mixture is strongly sprayed, and the gap between the wafers does not change. On the opposite side of the part held by the base, that is, the tip side where the gap is open,
The moment by the injection of the mixture is large, and the holding portion of the holding base is deformed and falls down, and the gap between the wafers may change. Therefore, by increasing the flow rate of the mixture of the nozzles near the holding base and decreasing the flow rate of the mixture of the nozzles on the opposite side of the holding base, the gap between the wafers can be changed without falling down. A uniform gap can be maintained without the wafer falling off.

In the post-wire saw wafer cleaning apparatus according to the first invention, a plurality of nozzles may be provided at intervals in the axial direction. In this case, the mixture ejected from each nozzle is ejected toward the gap between the other wafers arranged in the axial direction, so that the mixture does not concentrate on the gap between one wafer. Therefore, the gap between the wafers is prevented from being changed by the injection of the mixture, and the uniform gap can be maintained to prevent the variation in the cleaning effect.

In accordance with a second aspect of the present invention, there is provided a method of cleaning a wafer after a wire saw, the method comprising the steps of: cutting an ingot held over its entire length by adhesion to a holding base into a thin plate in a direction intersecting the axis of the ingot; And cleaning the wafer held by the holding base, wherein the cleaning liquid is filled in the gap between the wafers while holding the ingot in a gas atmosphere and changing the relative position of the wafer and the nozzle in the axial direction. And a gas mixture is sprayed by a nozzle to clean the surface of the wafer. In this way, a mixture in which the cleaning liquid and a gas such as air or nitrogen gas are mixed is sprayed from a nozzle in the form of a mist, and the ingot is sliced so that the entire length in the axial direction of the wafer arranged in a narrow gap. , The cleaning liquid can be sent deep into the gap between the wafers and sequentially adhered to the entire surface of the wafer, so that fine dust adhering to the wafer can be efficiently washed away.

According to a third aspect of the present invention, there is provided a method for cleaning a wafer after a wire saw, wherein the ingot held over the entire length by bonding to a holding base is sliced into a thin plate in a direction crossing the axis of the ingot. A cleaning method for forming a wafer and cleaning the wafer held on a holding base, wherein the ingot is held in a gas atmosphere and the gap between the wafer and the nozzle is changed while changing the relative position of the wafer and the nozzle in the axial direction. Then, the vapor of the cleaning liquid is sprayed by a nozzle to clean the surface of the wafer. Thereby, the cleaning liquid is heated by the heating tank, and steam having a vapor pressure of, for example, about 2 to 5 atm is taken out, the steam is jetted by the nozzle, and the ingot is sliced to form a state of being arranged through a narrow gap. Steam can be sent deep into the gap between the wafers over the entire length in the axial direction of the wafer and blown sequentially over the entire surface of the wafer, so that fine dust adhering to the wafer can be efficiently washed off.

In the second and third methods of cleaning a wafer after a wire saw according to the present invention, the wafer may be held via a buffer member by a holding base and an auxiliary support base provided on the opposite side of the holding base. In this case, since the wafer is held at two places on the opposite side of the holding base and the holding base, even if a strong mixture is injected from the side, the gap between the wafers does not change, and a uniform gap is formed. It can be washed while maintaining it.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. Here, FIG. 1 is a front view of a post-wire saw wafer cleaning apparatus according to the first embodiment of the present invention,
FIG. 2 is a plan view of the post-saw wafer cleaning apparatus, and FIG.
FIG. 4 is a perspective view showing a holding state of a wafer mounted on the post-wire saw wafer cleaning apparatus, FIGS. 4A and 4B are a plan view, a side view, and FIG. FIG. 6 is a side view showing an arrangement state of nozzles of a post-wire saw wafer cleaning apparatus according to a second embodiment of the present invention. FIG. 6 is a side view of a wafer of the post-wire saw wafer cleaning apparatus according to the third embodiment of the present invention. It is a perspective view showing a holding state.

As shown in FIGS. 1 and 2, a post-wire saw wafer cleaning apparatus 10 according to a first embodiment of the present invention.
Has a width capable of loading a cylindrical ingot 11 made of, for example, silicon having a diameter of about 300 mm and a length of about 600 mm, and a cleaning tank having a length in the longitudinal direction exceeding twice the total length of the ingot 11. 12 are provided. As shown in FIG. 3, the ingot 11 is held in a state of being suspended from a holding base 13, and the holding base 13 is attached to a base 14 made of a flat metal plate.
5 is formed. Then, the ingot 11 is fixed to the carbon block 15 with an adhesive. In this state, the ingot 11 is sliced into a thin plate by a wire saw or the like in a direction crossing the axis of the ingot 11, and a gap G (for example, 0.2 to 0) is formed in the axial direction. (Approximately .25 mm) to form a plurality of arranged wafers 16.

A linear guide 18 composed of a ball guide extending in the longitudinal direction is provided at the upper end of a side wall 17 formed along the longitudinal direction of the cleaning tank 12.
A pair of moving bases 19 guided along the linear guides 18 is mounted on both linear guides 18, and both moving bases 19 are U-shaped at positions substantially separated by the entire length of the ingot 11. The movable base 19 and the connecting member 20 form a supporting frame 21. The holding base 13 is placed on the connecting member 20 so that the ingot 11 can be held so as to be hung downward. One side wall 17
Is provided with a ball screw 22 extending in parallel with the linear guide 18, and a ball nut 23 screwed into the ball screw 22.
Is fixed to the moving base 19, and the ball screw 22 is driven to rotate by a driving motor 24. As described above, the linear guide 18, the support frame 21, the ball screw 22, the ball nut 23, and the drive motor 24 can move the ingot 11 placed on the support frame 21 together with the moving base 19 in the longitudinal direction of the cleaning tank 12. 25 are formed.

At the center in the longitudinal direction of the cleaning tank 12, a mounting hole 26 penetrating the side wall 17 is provided linearly.
The nozzles 27 are mounted at intervals in the vertical direction, and the nozzle bodies 28 of the plurality of nozzles 27 are arranged in the vertical direction so as to protrude inside the side wall 17. Nozzle 27
As shown in FIG. 4, a mixer 29 for supplying a mixture of a cleaning liquid and a gas to a nozzle body 28 is provided. The mixer 29 supplies a cleaning liquid supplied from a liquid tank (not shown) by a pump or the like through a first valve 30, for example, a cleaning liquid made of, for example, hot water, pure water, or water containing a surfactant. A gas supply for introducing a gas such as compressed air or compressed nitrogen gas through a second valve 32 through a port 31 and a compressor (not shown) through an air purifier by a compressor (not shown). It has a mouth 33. The first and second valves 30 and 32 form a flow rate adjusting means 34 for the mixture. In addition, the mixer 2
A third valve may be provided between the nozzle 9 and the nozzle body 28 to form the flow rate adjusting means.

The injection port 35 of the nozzle body 28 from which the mixture is ejected is formed so that its cross section is formed in a flat rectangular shape, the long side of the cross section is parallel to the gap G between the wafers 16 and the ingot 11 The mixture is sprayed over the entire surface from the upper part to the lower part of the side surface of the. After the nozzle 27 is mounted, the mounting hole 26 is sealed by packing or the like so that no gap is formed between the side wall 17 and the nozzle 27. A drainage tank 36 is provided below the cleaning tank 12 so as to receive the cleaning liquid falling from the gap G between the wafers 16.

Here, a method for cleaning a wafer after a wire saw using the apparatus for cleaning a wafer after a wire saw 10 according to the first embodiment of the present invention will be described. (1) First, the support frame 21 is moved to one side of the cleaning tank 12 indicated by a solid line in FIG. (2) The ingot 11 held over the entire length of the holding base 13 is sliced into a thin plate shape in a direction intersecting the axis with a wire saw or the like to form a plurality of wafers 16 arranged with a gap G in the axial direction. With the holding base 13 up and the ingot 11 down
Is placed on the connecting member 20 of the support frame 21. (3) The first and second valves 30 and 32 are opened to supply the cleaning liquid and the gas to the mixer 29, and a mist-like mixture is formed by the mixer 29 so that the mixture is formed from the nozzle body 28 to the end of the ingot 11. Injection is performed toward the gap G between the formed wafers 16.

(4) While the mixture is being sprayed from the nozzle body 28, the drive motor 24 of the moving means 25 is driven, and is mounted on the connecting member 20 together with the moving base 19 via the ball screw 22 and the ball nut 23. While moving the placed ingot 11 to the other side of the cleaning tank 12, the mixture is sprayed toward the gap G between the wafers 16 held in the holding base 13 to wash the surface of the wafer 16. (5) When the support frame 21 has moved to the other side of the cleaning tank 12 indicated by the two-dot chain line in FIG. 2, the moving direction is reversed, and the wafer is moved while the support frame 21 is moved to one side of the cleaning tank 12. The surface of No. 16 is washed again. (6) When the cleaning is completed, when the support frame 21 comes to one side of the cleaning tank 12, the moving means 25 is stopped, the ingot 11 is detached from the support frame 21, and sent to the next step. Next, the ingot 11 to be washed next is attached, and the washing operation is continued. Depending on the cleaning state of the wafer 16, the ingot 11 may be removed from the support frame 21 when the support frame 21 has moved to the other side of the cleaning tank 12.
The ingot 11 may be removed from the support frame 21 on one side or the other side of the cleaning tank 12 after reciprocating one side and the other side of the cleaning tank 12 a plurality of times by 5.

In this manner, the mixture of the cleaning liquid and the gas is injected from the injection port 35 of the nozzle 27 toward the gap between the wafers 16 while moving the ingot 11 in a gas atmosphere such as air, so that the cleaning liquid is The mist formed of fine particles enters deep into the gap between the narrow wafers 16, and the surface of the wafer 16 is wetted by the cleaning liquid, the cleaning liquid gradually flows, and fine dust attached to the wafer 16 flows down. In the case where the injection of the mixture is too strong, the holding portion of the wafer is deformed and the gap between the wafers 16 changes, the first and second valves 3 serving as the flow rate adjusting means 34 are used.
The flow rates of the cleaning liquid and the gas are adjusted by adjusting the opening degrees of the nozzles 0 and 32, and the flow rate of the mixture of the nozzle 27 near the holding base 13 holding the wafer 16 is increased. By reducing the flow rate of the mixture of the nozzles 27 on the side, the wafers are prevented from falling down, and the uniform gaps are maintained without changing the gaps between the wafers 16 and preventing the wafers 16 from falling off due to adhesion. As a result, variations in the cleaning effect can be prevented.

As shown in FIG. 5, a post-wire saw wafer cleaning apparatus 40 according to a second embodiment of the present invention comprises
Post-saw wafer cleaning apparatus 10 according to the embodiment of the present invention
Instead of the arrangement in which the nozzles 27 are arranged linearly in the vertical direction, a plurality of nozzles are provided at intervals D in the axial direction, and the nozzles are arranged obliquely. The same components as those in the first embodiment will be described with the same reference numerals. That is, an opening 43 that penetrates the side wall 42 is provided at the central portion in the longitudinal direction of the cleaning tank 41, and the opening 43 is covered with the nozzle mounting plate 44, and the nozzle mounting plate 44 is provided with mounting holes vertically and axially. A plurality of nozzles 27 are mounted at predetermined intervals. Then, the injection ports 35 of the nozzles 27 are opened toward the inside of the cleaning tank 41, and the injection ports 35 are spaced apart in the up-down direction, and the distance D between adjacent nozzles in the axial direction is set to about 10 to 20 mm. And are arranged in a diagonal direction. As a result, the mixture injected from the injection port 35 of each nozzle 27 is injected into the gap G of another wafer 16 shifted in the axial direction, so that the mixture is concentrated in one gap of the wafer 16. However, since the force applied to each wafer 16 by the injection of the mixture is dispersed and weakened, the gap between the wafers 16 is maintained uniform.

As shown in FIG. 6, a post-wire saw wafer cleaning apparatus 50 according to a third embodiment of the present invention comprises
Post-saw wafer cleaning apparatus 10 according to the embodiment of the present invention
Instead of a configuration in which only the upper part of the ingot 11 is fixed to the holding base 13 by bonding, the holding base and an auxiliary support base provided on the opposite side of the holding base hold the wafer via the buffer member. Is what you do. That is, the holding base 51 used for the wafer cleaning apparatus 50 after the wire saw is formed by fixing the carbon block 52 to the base 53, and the mounting members 54 such as connecting bolts are detachably attached to both ends of the base 53 in the axial direction. It can be attached to. In addition, a plate-shaped auxiliary support base 56 to which a buffer member 55 such as a sponge is fixed is prepared, and can be attached to the base 53 of the holding base 51 via an attachment member 54. Then, in a state where the ingot 11 is fixed to the carbon block 52 with an adhesive, the wafer 16 is formed by slicing with a wire saw, and the buffer member 55 is pressed against the ingot 11 on the side opposite to the holding base 51 side.
The ingot 11 is sandwiched between the buffer member 55 and the carbon block 52, the auxiliary support base 56 is fixed to the base 53 by the mounting member 54, and the upper and lower ends of the wafer 16 are suppressed so that the gap between the wafers 16 does not change. To do.

As a result, the nozzle 2 is located on the side of the wafer 16.
The gap G of the wafer 16 does not change even when the strong mixture is injected from the nozzle 7, and the uniform gap G can be maintained over the entire length of the ingot 11. Note that the cushioning member 55 of the auxiliary support base 56 is
When pressed against the ingot 11, the auxiliary support base 56 is pushed up from below the ingot 11 by a linear actuator such as an air cylinder movably provided together with the support frame 21 by the moving means 25, for example.
1 may be held from above and below by the holding base 51 and the auxiliary support base 56.

The present invention has been described above with reference to the first to third embodiments of the apparatus and method for cleaning a wafer after a wire saw. However, the present invention is not limited to the configuration described in the above embodiment. However, the present invention also includes other embodiments and modifications that can be considered within the scope of the matters described in the claims. For example, in the post-wire saw wafer cleaning apparatus according to the above-described embodiment, an example was described in which a plurality of nozzles were fixed so as to protrude inside the side wall of the cleaning tank. The mixture may be ejected while swinging. This allows the mixture to be sprayed more evenly into the gap between the wafers. Further, in the cleaning method using the post-wire saw wafer cleaning apparatus according to the above-described embodiment, cleaning of a silicon wafer has been described, but the wafer is not limited to a silicon wafer, but may be a semiconductor such as a gallium arsenide wafer or an alumina wafer. The present invention can also be applied to various wafers sliced into thin plates from an ingot made of a material to be used.

Further, a variable speed motor may be used as the drive motor of the moving means, and the moving speed of the ingot sent by the moving means may be changed according to the cleaning state of the wafer. In this case, it is possible to realize an optimal cleaning state of the wafer. Further, in the post-saw wafer cleaning apparatus according to the embodiment, the moving means includes a ball screw that is rotationally driven by a drive motor, a ball nut screwed into the ball screw, a moving base attached to the ball nut, and a moving base. Although an example with a linear guide to guide has been described, instead of providing a ball screw and a ball nut screwed into the ball screw, a fixed portion of the linear motor is arranged at a position where the linear guide is arranged, and instead of a moving base, Provide a movable part of a linear motor that can move along the fixed part, attach a support frame to the movable part,
The ingot may be moved together with the support frame by a linear motor. Further, in the post-wire saw wafer cleaning apparatus according to the embodiment, an example in which the holding base to which the ingot is attached is moved in the axial direction via the support frame has been described, but the holding base to which the ingot is attached is placed in the cleaning tank. Alternatively, the plurality of nozzles may be attached to one moving means capable of moving in the axial direction while the plurality of nozzles are simultaneously moved along the entire length of the cleaning tank in the axial direction of the ingot. In this case, the amount of ingot that can be stored in the cleaning tank at one time can be increased,
The cleaning efficiency can be improved.

Further, in the apparatus for cleaning a wafer after a wire saw according to the above-described embodiment, an example in which a mixture of a cleaning liquid and a gas is injected from a nozzle into a gap between wafers has been described, but the cleaning liquid is heated by a heating tank. For example, a vapor having a vapor pressure of about 2 to 5 atm is taken out, the vapor is ejected by a nozzle, and the ingot is sliced to form an ingot. The steam may be sent deep into the gap and sprayed sequentially over the entire surface of the wafer.

[0024]

In the apparatus for cleaning a wafer after a wire saw according to any one of claims 1 to 3, a nozzle for holding an ingot in a gas atmosphere and injecting a mixture of a cleaning liquid and a gas toward a gap between the wafers; A moving means for changing the relative position of the nozzle and the wafer in the axial direction is provided, and the wafer is cleaned by spraying the mixture, so that the cleaning liquid in the mixture becomes a mist composed of fine particles and becomes a mist between narrow wafers. It is possible to penetrate deep into the gap and flow down fine dust attached to the wafer.

In particular, in the apparatus for cleaning a wafer after a wire saw according to the second aspect, since the nozzle has the flow rate adjusting means for the mixture, the flow rate of the mixture of the nozzle near the holding base for holding the wafer is maintained. By increasing the flow rate of the mixture at the nozzle opposite the holding base,
A uniform gap can be maintained without changing the gap between the wafers or falling off of the wafers, thereby preventing variations in the cleaning effect. In the apparatus for cleaning a wafer after a wire saw according to claim 3, since a plurality of nozzles are provided at intervals in the axial direction, the mixture ejected from the nozzles is ejected toward a gap between different wafers. ,
It is not concentrated in one gap between the wafers, the gap between the wafers is not changed by the injection of the mixture, and a uniform gap can be maintained to prevent a variation in the cleaning effect.

According to a fourth aspect of the present invention, there is provided a method of cleaning a wafer after a wire saw, wherein the ingot held over the entire length by bonding to the holding base is sliced into a thin plate in a direction intersecting with the axis. With the ingot held on the holding base in a gaseous atmosphere while changing the relative position of the wafer and the nozzle in the axial direction, a mixture of the cleaning liquid and the gas is atomized by the nozzle in the gap between the wafers. Therefore, the cleaning liquid can be sent deep into the gap between the wafers, adhered to the entire surface of the wafer, and the fine dust can be efficiently washed off.

According to a fifth aspect of the present invention, there is provided a method for cleaning a wafer after a wire saw, wherein the ingot held over its entire length by bonding to a holding base is sliced into a thin plate in a direction intersecting the axis. Since the wafer is formed, the ingot is held in a gas atmosphere, and while changing the relative position of the wafer and the nozzle in the axial direction, the vapor of the cleaning liquid is injected into the gap between the wafers by the nozzle to clean the surface of the wafer. The heated steam is sent deep into the gap between the wafers, and is blown sequentially over the entire surface of the wafer, so that fine dust adhering to the wafer can be more efficiently washed off. In particular, in the method of cleaning a wafer after a wire saw according to claim 6, since the wafer is held via the buffer member by the holding base and the auxiliary support base provided on the opposite side of the holding base, the strong mixture is injected. However, the gap between the wafers does not change, and a uniform gap can be maintained to prevent a variation in the cleaning effect.

[Brief description of the drawings]

FIG. 1 is a front view of a post-saw wafer cleaning apparatus according to a first embodiment of the present invention.

FIG. 2 is a plan view of the post-saw wafer cleaning apparatus.

FIG. 3 is a perspective view showing a holding state of a wafer mounted on the wafer cleaning apparatus after the wire saw.

FIGS. 4A and 4B are a plan view and a side view of a nozzle of the post-wire saw wafer cleaning apparatus, respectively.

FIG. 5 is a side view showing an arrangement state of nozzles in a post-wire saw wafer cleaning apparatus according to a second embodiment of the present invention.

FIG. 6 is a perspective view showing a wafer holding state of a wafer cleaning apparatus according to a third embodiment of the present invention.

[Explanation of symbols]

10: Wafer cleaning device after wire saw, 11: Ingot, 12: Cleaning tank, 13: Holding base, 14: Base, 1
5: carbon block, 16: wafer, 17: side wall, 1
8: linear guide, 19: moving base, 20: connecting member, 21: support frame, 22: ball screw, 23: ball nut, 24: drive motor, 25: moving means, 2
6: mounting hole, 27: nozzle, 28: nozzle body, 29:
Mixer, 30: first valve, 31: cleaning liquid supply port, 3
2: second valve, 33: gas supply port, 34: flow control means, 35: injection port, 36: drain tank, 40: wafer cleaning device after wire saw, 41: cleaning tank, 42: side wall, 4
3: opening, 44: nozzle mounting plate, 50: wafer cleaning device after wire saw, 51: holding base, 52: carbon block, 53: base, 54: mounting member, 55: buffer member, 56: auxiliary support base

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Mitsumori Kinoshita 1-1, Tsukiji-cho, Yawatanishi-ku, Kitakyushu-city, Fukuoka Prefecture Inside Takada Kogyosho Co., Ltd. No. F-term in Takada Kogyo Co., Ltd. (reference) 3B201 AA03 AB01 AB37 AB42 BB03 BB22 BB82 BB88 BB92 BB93 BB94

Claims (6)

[Claims] A wafer after a wire saw for cleaning a plurality of wafers formed by slicing an ingot held by a holding base into a thin plate in a direction intersecting the axis of the ingot while holding the plurality of wafers held by the holding base. A cleaning device, wherein the nozzle is configured to hold the ingot in a gas atmosphere and spray a mixture of a cleaning liquid and a gas toward a gap between the wafers, and the nozzle and the wafer are positioned relative to each other in the axial direction. A wafer cleaning apparatus after a wire saw, comprising: moving means for changing a position, and cleaning the wafer by spraying the mixture. 2. The post-wire saw wafer cleaning apparatus according to claim 1, wherein the nozzle has a flow rate adjusting means for the mixture. 3. The post-wire saw wafer cleaning apparatus according to claim 1, wherein a plurality of the nozzles are provided at intervals in the axial direction. 4. A plurality of wafers are formed by slicing an ingot held over the entire length of a holding base by bonding to a direction intersecting the axis of the ingot to form a plurality of wafers, and the wafer held by the holding base is formed. A cleaning method for cleaning the ingot, while maintaining the ingot in a gas atmosphere, while changing the relative position of the wafer and the nozzle in the axial direction, a mixture of cleaning liquid and gas in the gap between the wafer by the nozzle. A method of cleaning a wafer after a wire saw, wherein the cleaning is performed by spraying the surface of the wafer. 5. A plurality of wafers are formed by slicing an ingot held over the entire length of the ingot onto a holding base in a direction crossing the axis of the ingot to form a plurality of wafers, and the wafer held by the holding base is provided. A cleaning method for cleaning, wherein the ingot is held in a gas atmosphere, and while the relative position of the wafer and the nozzle in the axial direction is changed, vapor of a cleaning liquid is injected into the gap between the wafers by the nozzle. A method for cleaning a wafer after a wire saw, comprising cleaning a surface of the wafer. 6. The method for cleaning a wafer after a wire saw according to claim 4, wherein the wafer is held via a buffer member by the holding base and an auxiliary support base provided on the opposite side of the holding base. Characteristic method of cleaning wafer after wire saw.