JP2003068680A - Working liquid supplying mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem of blowout of a working liquid from a blowout nozzle being delayed, when supplying the working liquid from a supply source or working liquid is dripped from the blowout nozzle during the stop of supply in a working liquid supplying mechanism, for supplying the working liquid from the supply source through a channel to the blowout nozzle in a working region. SOLUTION: On a channel (16) located close to a blowout nozzle (14), a valve means (20) is provided for stopping the flow-out of the working liquid in the channel (16) toward the blowout nozzle (14), when supplying no working liquid from a working liquid supply source (18), and for permitting the flow-out by being opened by the flow of the working liquid when that working liquid is supplied.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a working fluid supply mechanism for feeding a working fluid to a working area of a workpiece.

[0002]

2. Description of the Related Art A semiconductor wafer on which a large number of circuits such as ICs and LSIs are formed is divided into individual chips by a cutting device such as a dicing device. This dicing device cuts a wafer held on a chuck table into chips by cutting the wafer while supplying, for example, pure water as a working liquid along a grid-shaped cutting line.
The working fluid is supplied to the injection nozzle in the working area through a flow path such as a pipe by operating the opening / closing valve of the working fluid supply source.

[0003]

The conventional machining fluid supply mechanism having the above-described configuration has the following problems due to the increase in the distance between the machining fluid supply source and the jet nozzle due to the increase in size of the cutting device. There is a problem to be solved as shown in.

(1) Delay of injection of machining liquid from the injection nozzle: After the semiconductor wafer cutting work is completed and the supply source on-off valve is closed to stop the supply of the machining liquid, the on-off valve is opened again to perform the cutting work. When starting, it takes a while (for example, 2 to 3 seconds) until the machining liquid is ejected from the ejection nozzle. If the cutting process is performed in the state where the working fluid is not supplied, the quality and the processing are defective, so that the start of the processing is delayed until the working fluid is supplied, and the productivity is deteriorated. The supply of the working fluid in the cutting process of the semiconductor wafer is stopped at the end of this cutting work, for example, when the state of the cutting groove is detected while the wafer is being cut, and the cutting reference position of the cutting blade is detected. It is also done when you do. Therefore, due to the jetting delay of the machining fluid, smooth machining is disturbed each time.

(2) Dripping of machining liquid from the jet nozzle: In order to detect a reference position at which the wafer is cut in a lattice by a cutting blade, the supply of the machining liquid is stopped and a reference position consisting of a light emitting element and a light receiving element. When the position of the cutting blade is detected by the detection means, there is a problem that the working liquid drips from the jet nozzle and the reference position is erroneously detected.

The present invention has been made in view of the above facts, and its technical problem is to reduce the working liquid in a working liquid supply mechanism in which the working liquid is supplied from a supply source to a jet nozzle in a processing region through a flow path. Provided is a machining fluid supply mechanism capable of eliminating problems such as a delay in jetting of the machining fluid from the jet nozzle during supply, and a problem such as dripping of the machining fluid from the jet nozzle when the supply is stopped. That is.

[0007]

As a result of intensive studies by the present inventor, these problems have been found to be caused by the injection nozzle after the machining liquid in the flow path connecting the machining liquid supply source and the injection nozzle stops the supply source. Through, the machining fluid in the flow channel becomes empty, and when the supply is restarted, the supply of the machining fluid is delayed by that amount, and the machining fluid in the flow channel drips through the injection nozzle. It was found that it was caused. In particular, the problem is remarkable when the flow path of the working liquid is provided in the jet nozzle from above. Therefore, it was confirmed that stopping the outflow of the working fluid from this flow path is effective as a means for solving the problem.

That is, according to the present invention, as a working fluid supply mechanism that solves the above technical problems, a working fluid supply mechanism in which a working fluid from a working fluid supply source is supplied to a jet nozzle in a working region through a flow path. When the machining fluid is not supplied from the machining fluid supply source, the outflow of the machining fluid in the flow channel toward the ejection nozzle is stopped in the channel near the jet nozzle, and when the machining fluid is supplied, A working fluid supply mechanism is provided, which is provided with a valve means that is opened by a flow to allow outflow.

Then, the valve means is used to stop the outflow of the working fluid in the flow path when the working fluid is not supplied and hold it, thereby eliminating the injection delay when supplying the working fluid. And again, the dripping of the working liquid from the jet nozzle is stopped.

In the preferred embodiment, the valve means is formed by a check valve with a defined opening pressure.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a working fluid supply mechanism constructed according to the present invention will be described in more detail with reference to the accompanying drawings illustrating preferred embodiments.

Referring first to FIG. 1, a dicing apparatus, generally designated by the numeral 2, which is a semiconductor wafer cutting apparatus provided with a working fluid supply mechanism according to the present invention will be described. The dicing device 2 is provided with a chuck table 6 for holding a semiconductor wafer, which is a workpiece, rotatably and movable in a cutting feed direction (arrow X direction) on an upper surface of a substantially rectangular parallelepiped housing 4. Has been. The chuck table 6 includes a support base 6a and a suction chuck 6b provided thereon, and a semiconductor wafer is suction-held on the suction chuck 6b.

The dicing device 2 is provided with a spindle unit 10 to which a cutting blade 8 as cutting means is attached. The spindle unit 10 includes a spindle housing 10a and a cutting blade 8 mounted on a moving base.
Is equipped with a rotating shaft 10b. The spindle housing 10a is provided so as to be movable and adjustable in the indexing direction (arrow Y direction) and the cutting direction (arrow Z direction), and the rotary shaft 10b is rotationally driven by a drive means (not shown) provided in the spindle housing 10a. To be done. A cover 10c for covering the cutting blade 8 is provided at the tip of the spindle housing 10a.

Referring to FIG. 2, a working fluid supply mechanism generally designated by reference numeral 12 will be described. The working liquid supply mechanism 12 is
A pair of injection nozzles 1 provided on the cover 10c of the spindle unit 10 and extending on both sides of the lower end of the cutting blade 8.
4 and 14 and a machining liquid supply source 18 connected to each of the jet nozzles 14 by a flow channel 16, and the flow channel 16 flows to a portion near the jet nozzle 14 where the jet nozzles 14 and 14 branch off. Valve means 2 for controlling the flow of machining fluid in the passage 16
0 is provided.

The machining liquid supply source 18 intermittently connects the machining liquid tank 18a for storing, for example, pure water as a machining liquid, a pump 18b for discharging the machining liquid, and the machining liquid discharged from the pump 18b to the flow path 16. And an on-off valve 18c for switching. The on-off valve 18c is formed by a normally-closed two-position electromagnetic valve, and is opened when energized by the switch means 22 and excited to flow the machining fluid discharged from the pump 18b into the flow path 1.
Pour to 6.

The injection nozzle 14 is formed of a pipe material and has a large number of injection holes on the lower surface thereof.

The valve means 20 is a check valve which allows only the flow of the working fluid in the direction of the injection nozzle 14 in the flow path 16 at a prescribed valve opening pressure or higher. In the check valve 20, the valve opening pressure of the valve body 20a is set by the spring 20b. This valve opening pressure stops the outflow of the working fluid in the flow path 16 toward the injection nozzle 14 when the working fluid is not supplied from the supply source 18, and when the working fluid is supplied, it is opened by the flow and flows. To allow, pump 18b
Is set on the basis of the discharge pressure, the arrangement of the flow path 16, and the like. The check valve 20 is preferably installed at a position as close to the injection nozzle 14 as possible in order to prevent the working fluid in the flow path 16 from escaping when the supply of the working fluid is stopped. .

The operation of the working fluid supply mechanism 12 as described above will be described mainly with reference to FIG.

(1) Elimination of machining liquid jetting delay: Inverse of the valve means which is set to a predetermined valve opening pressure in the vicinity of the jet nozzle 14 of the flow path 16 connecting the machining liquid supply source 18 and the jet nozzle 14. Since the stop valve 20 is provided, the check valve 20 is not opened when the opening / closing valve 18c of the working liquid supply mechanism 12 is closed (state of FIG. 2) and the working liquid is not supplied. The working liquid inside does not flow out in the direction of the jet nozzle 14 and is stopped and held. Then, when the opening / closing valve 18c is opened by operating the switch 22 to supply the processing liquid from the processing liquid supply source 18, since the processing liquid is filled in the flow path 16, the check valve 20 is opened instantly. The machining fluid is supplied to the jet nozzle 14 and jetted from the jet holes. Therefore, the problem of the ejection delay of the machining fluid from the ejection nozzle 14 is solved. Then, problems such as the conventional impediment of smooth machining due to the injection delay and deterioration of productivity due to waiting time are solved.

(2) Elimination of dripping of machining fluid: Even when the supply of machining fluid is stopped and the position of the cutting blade 8 is detected by the reference position detecting means, the check valve 20 is used in the flow path 16 as described above. Since the outflow of the working fluid is stopped, the problem of the working fluid dripping from the injection nozzle 14 is solved. Further, the problem of erroneous position detection of the reference position detecting means is solved.

(3) Easy installation and low cost: Since the check valve 20 having a simple structure as the valve means may be installed in the flow path 16, it is necessary to remodel the working fluid supply mechanism. It is easy to install and low cost.

The present invention has been described above in detail based on the embodiments. However, the present invention is not limited to the above embodiments, and various changes or modifications can be made within the scope of the present invention. Is.

For example, in the present embodiment, the check valve 20 is used as the valve means, but the valve means for controlling the flow of the machining fluid may be opened by the flow of the machining fluid supplied. Therefore, it may be a pilot opening / closing valve that is opened / closed by using the supplied working fluid as a pilot fluid.

[0024]

According to the machining fluid supply mechanism constructed according to the present invention, when the machining fluid is supplied from the supply source to the jet nozzle in the machining area from the supply source, the machining fluid is supplied. Delay of machining fluid from the jet nozzle of
Further, there is provided a working fluid supply mechanism capable of eliminating problems such as dripping of the working fluid from the jet nozzle when the supply is stopped.

[Brief description of drawings]

FIG. 1 is a perspective view of a dicing apparatus which is a semiconductor wafer cutting apparatus provided with a working liquid supply mechanism configured according to the present invention.

FIG. 2 is a block configuration diagram showing a working fluid supply mechanism configured according to the present invention.

[Explanation of symbols]

2: Dicing device 8: Cutting blade 12: Working fluid supply mechanism 14: injection nozzle 16: flow path 18: Processing liquid supply source 20: Check valve (valve means)

Claims (2)

[Claims] 1. A machining fluid supply mechanism in which a machining fluid from a machining fluid supply source is supplied to an injection nozzle in a machining area through a flow channel, and a machining fluid in the flow channel is provided in a flow channel near the injection nozzle. Outflow in the direction of the injection nozzle is stopped when the machining fluid is not supplied from the machining fluid supply source, and when the machining fluid is supplied, there is provided a valve means that is opened by the flow to allow outflow. Working fluid supply mechanism. 2. The working fluid supply mechanism according to claim 1, wherein the valve means is formed of a check valve having a valve opening pressure regulated.