CN111976043B - Crystal bar cutting device and crystal bar cutting method - Google Patents
Crystal bar cutting device and crystal bar cutting method Download PDFInfo
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- CN111976043B CN111976043B CN202010869343.7A CN202010869343A CN111976043B CN 111976043 B CN111976043 B CN 111976043B CN 202010869343 A CN202010869343 A CN 202010869343A CN 111976043 B CN111976043 B CN 111976043B
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- mortar
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- crystal bar
- cut
- feeding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a crystal bar cutting device and a crystal bar cutting method, wherein the crystal bar cutting device comprises: the feeding table is used for fixing a to-be-cut crystal bar and driving the to-be-cut crystal bar to move along a feeding direction; and mortar discharge ports of the mortar supply unit are positioned on two sides of the feeding table and are used for spraying mortar to the surface of the crystal bar to be cut. According to the crystal bar cutting device provided by the embodiment of the invention, mortar for linear cutting can be directly sprayed on the surface of the crystal bar instead of the cutting line, so that the phenomenon that the cutting line is impacted and vibrates due to the fact that the mortar with a certain impulse is directly sprayed on the cutting line is avoided, and the phenomenon that the cutting surface is uneven due to the vibrating cutting line is avoided.
Description
Technical Field
The invention relates to the technical field of silicon wafer preparation, in particular to a crystal bar cutting device and a crystal bar cutting method.
Background
At present, in a wire cutting process of a crystal bar, supplied mortar is generally sprayed onto a cutting wire at a certain pressure, and then the cutting wire carries the mortar to cut the crystal bar, wherein the mortar plays a role in lubricating and cleaning chips generated by cutting on one hand, and can take away heat generated by cutting on the other hand.
The quality of the linear cutting process determines the flatness of the surface of the silicon wafer obtained by cutting, and if the surface of the silicon wafer is not flat, an extra finishing step is required to be carried out subsequently to correct the excessively warped silicon wafer, so that the time, cost and other costs of silicon wafer preparation are undoubtedly greatly increased.
Disclosure of Invention
In view of the above, the invention provides a crystal bar cutting device and a crystal bar cutting method, which can solve the problem that in the prior art, the surface of a silicon wafer obtained by cutting is uneven due to the vibration of a cutting line caused by spraying mortar to the cutting line.
In order to solve the technical problems, the invention adopts the following technical scheme:
an embodiment of one aspect of the present invention provides a crystal bar cutting device, including:
the feeding table is used for fixing a to-be-cut crystal bar and driving the to-be-cut crystal bar to move along a feeding direction;
and mortar discharge ports of the mortar supply unit are positioned on two sides of the feeding table and are used for spraying mortar to the surface of the crystal bar to be cut.
Optionally, the method further includes:
the cutting unit is positioned in the feeding direction of the crystal bar to be cut and comprises a driving wheel and a plurality of cutting lines, and the driving wheel is used for driving the cutting lines to move so as to cut the crystal bar.
Optionally, the feeding table comprises an inverted concave wedge-shaped joint, a material table located in a bottom groove of the inverted concave wedge-shaped joint, and a supporting plate fixed to the bottom of the material table, and the supporting plate is used for fixing a to-be-cut crystal bar.
Optionally, the mortar supply unit includes mortar discharge ports opened at both sides of the bottom surface of the inverted concave wedge joint, and a mortar supply pipe communicated with the mortar discharge ports.
Optionally, the mortar outlet is in the shape of a long groove, and the length direction of the mortar outlet is the same as the length direction of the to-be-cut crystal bar.
Optionally, the mortar supply unit further comprises a flow control valve disposed on the mortar supply pipe, and the flow control valve is used for controlling the flow rate in the mortar supply pipe.
Optionally, the feeding table further includes a driving mechanism, and the driving mechanism is connected to the top of the inverted concave wedge-shaped joint and is used for driving the inverted concave wedge-shaped joint to move along the feeding direction.
In another aspect, an embodiment of the present invention provides a method for cutting a crystal bar, which is applied to the above-mentioned crystal bar cutting apparatus, the crystal bar cutting apparatus further includes a cutting unit, and the method includes:
fixing a crystal bar to be cut at the bottom of the feeding table, and starting the cutting unit to enable the cutting line of the cutting unit to operate;
and controlling the crystal bar to move along the feeding direction so that the cutting line cuts the crystal bar, and spraying mortar to the surface of the crystal bar by using a mortar supply unit.
Optionally, in the step of spraying mortar to the surface of the crystal bar by using a mortar supply unit:
and controlling the mortar feeding speed of a mortar feeding unit according to the cutting speed so as to control the surface temperature of the crystal bar.
The technical scheme of the invention has the following beneficial effects:
according to the crystal bar cutting device provided by the embodiment of the invention, mortar for linear cutting can be directly sprayed on the surface of the crystal bar instead of the cutting line, so that the phenomenon that the cutting line is impacted and vibrates due to the fact that the mortar with a certain impulse is directly sprayed on the cutting line is avoided, and the phenomenon that the cutting surface is uneven due to the vibrating cutting line is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a crystal bar cutting apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a mortar discharge port provided in an embodiment of the present invention;
fig. 3 is a schematic flow chart of a method for cutting a crystal bar according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
The inventor analyzes the existing wire cutting process and finds that when mortar with a certain impulse is sprayed on a cutting wire, the cutting wire is impacted to vibrate, and when the cutting wire enters and is pulled out, the distance between the mortar nozzles distributed on the left side and the right side of a driving wheel and a crystal bar is larger.
In addition, the inventor further analyzes and finds that the mortar can clean the cutting line and reduce the bad phenomenon caused by cutting heat originally, but the mortar can further deteriorate the flatness of the silicon wafer due to the increase of the impact force of the mortar along with the increase of the supply amount and the supply pressure of the mortar, and the opposite effect is achieved.
Therefore, referring to fig. 1, a schematic structural diagram of a crystal bar cutting device according to an embodiment of the present invention is shown. As shown in fig. 1, an embodiment of the invention provides a crystal bar cutting apparatus, which may include: a feeding table 11 and a mortar supply unit 12, wherein the feeding table 11 is used for fixing a crystal bar 13 to be cut and driving the crystal bar 13 to move along a feeding direction, generally speaking, the crystal bar 13 is horizontally placed, and the feeding direction is generally perpendicular to the length direction of the crystal bar 13, namely, the vertical direction; the mortar discharge ports 122 of the mortar supply unit 12 are located on two sides of the feeding table 11, and the mortar supply unit 12 is used for spraying mortar 14 to the surface of the crystal bar 13, so that the mortar 14 is directly sprayed to the surface of the crystal bar 13 instead of being sprayed to the cutting line, thereby preventing the mortar 14 from impacting the cutting line to cause uneven section when the cutting line cuts the crystal bar 13, and finally improving the flatness of the surface of the silicon wafer obtained by cutting.
With continued reference to fig. 1, the ingot cutting apparatus further includes a cutting unit 15, the cutting unit 15 includes a cutting line 151 and a driving wheel 152, a wire slot for placing the cutting line 151 may be disposed on a surface of the driving wheel 152, the driving wheel 152 is configured to drive the cutting line 151 to move at a high speed, the cutting unit 15 is disposed in a feeding direction of the ingot 13, when the ingot 13 contacts the cutting line 151, the cutting line 151 moves at a high speed to perform friction cutting on the ingot 13, and at the same time of cutting, the mortar supply unit 12 sprays mortar 14 on the surface of the ingot 13 to carry away powder formed on the surfaces of the cutting line 151 and the ingot 13 during the cutting process, and simultaneously can carry away heat generated by friction between the cutting line 151 and the ingot 13 to reduce adverse problems such as warpage of the cutting surface caused by thermal expansion of the ingot 13 due to thermal cutting.
With reference to fig. 1, the feeding stage 11 may specifically include an inverted concave wedge-shaped joint 111, a material stage 112 and a supporting plate 113, wherein the inverted concave wedge-shaped joint 111 is in an inverted concave shape, an inner concave portion of the inverted concave wedge-shaped joint is in a wedge shape, and the material stage 112 is fixed in a bottom groove of the inverted concave wedge-shaped joint 111; the part of the material platform 112, which is positioned in the bottom groove of the inverted concave wedge-shaped joint 111, is matched with the shape of the bottom groove; the supporting plate 113 is fixed at the bottom of the material table 112, and the ingot 13 may be fixed at the bottom of the supporting plate 113 by glue or the like. Thus, when the feed table 11 is fed in the direction of the scribe line 151, the ingot 13 fixed thereto is also moved in the direction of the scribe line 151.
In an embodiment of the present invention, the mortar supply unit 12 may include a mortar supply pipe 121 and a mortar discharge port 122, wherein the mortar discharge port 122 is opened at both sides of the bottom surface of the inverted concave wedge-shaped joint 111, the mortar supply pipe 121 is communicated with the mortar discharge port 122, the mortar 14 is discharged from the mortar discharge port 122 through the mortar supply pipe 121, and the mortar discharge port 122 is located above the boule 13, so that the mortar 14 may be directly sprayed onto the surface of the boule 13, and the functions of lubrication, cleaning, heat dissipation, etc. are performed during the cutting process.
Fig. 2 is a schematic view of a mortar discharge port according to an embodiment of the present invention. As shown in fig. 2, the mortar discharge port 122 in the embodiment of the present invention may be configured as a long groove shape, that is, a long slit shape, and the length direction of the mortar discharge port 122 is the same as the length direction of the boule 13, so that the mortar 14 sprayed from the mortar discharge port 122 may cover any surface of the boule 13, so that the mortar flows on more surfaces of the boule 13 to efficiently take away heat of each part of the boule 13, thereby achieving a better cooling effect, and further reducing warpage of the silicon wafer surface obtained by cutting due to expansion of the boule 13 caused by absorbing cutting heat during the cutting process.
In the embodiment of the present invention, the mortar supply unit 12 further includes a flow control valve (not shown) disposed on the mortar supply pipe 121, the flow control valve is used for controlling the flow rate of the mortar in the mortar supply pipe 121, and the temperature of the surface of the crystal bar 13 can be controlled by controlling the flow rate of the mortar; of course, in an alternative embodiment, the flow control valve may be replaced by a mortar over-regulation device, which can ensure that the mortar is supplied to the surface of the crystal rod 13 at a given flow rate after the mortar supply pipe 121 is completely filled with the mortar.
In the embodiment of the present invention, the feeding stage 11 further includes a driving mechanism (not shown) connected to the top of the inverted concave wedge joint 111 for driving the inverted concave wedge joint 111 to move at a predetermined speed in the feeding direction.
According to the crystal bar cutting device provided by the embodiment of the invention, mortar for linear cutting can be directly sprayed on the surface of the crystal bar instead of the cutting line, so that the phenomenon that the cutting line is impacted and vibrates due to the fact that the mortar with a certain impulse is directly sprayed on the cutting line is avoided, and the phenomenon that the cutting surface is uneven due to the vibrating cutting line is avoided.
Fig. 3 is a schematic flow chart of a method for cutting a crystal bar according to an embodiment of the present invention. As shown in fig. 3, another embodiment of the present invention further provides a crystal bar cutting method, which is applied to the crystal bar cutting apparatus in the foregoing embodiment, the crystal bar cutting apparatus further includes a cutting unit, and the crystal bar cutting method may include:
step 31: fixing a crystal bar to be cut at the bottom of the feeding table, and starting the cutting unit to enable the cutting line of the cutting unit to operate.
In the step, a crystal bar to be cut is fixed at the bottom of a feeding table, specifically, the bottom of a supporting plate of the feeding table, and then a cutting unit is started to enable a driving wheel in the cutting unit to rotate so as to drive a cutting line on the cutting unit to rotate at a high speed.
Step 32: and controlling the crystal bar to move along the feeding direction so that the cutting line cuts the crystal bar, and spraying mortar to the surface of the crystal bar by using a mortar supply unit.
In the step, the supporting plate and the crystal bar fixed on the supporting plate are driven by a driving mechanism of the feeding table to move at a preset speed along the feeding direction, so that the crystal bar is in contact with a cutting line moving at a high speed, the cutting line performs friction cutting on the crystal bar, meanwhile, the mortar supply unit also sprays mortar to the surface of the crystal bar, more specifically, the mortar is sprayed to the surface of the crystal bar below through the mortar supply pipe from a mortar discharge port, firstly, chips generated by friction between the crystal bar and the cutting line are cleaned, secondly, heat generated by friction between the crystal bar and the cutting line is taken away, and thirdly, a lubricating effect can be achieved on the cutting point. The mortar is directly sprayed on the surface of the crystal bar instead of the cutting line, so that the phenomenon that the cutting line is impacted by the mortar to cause uneven section when the cutting line cuts the crystal bar is avoided, and finally the flatness of the surface of the silicon wafer obtained by cutting is improved.
In some embodiments of the present invention, in the spraying of the mortar to the surface of the boule using the mortar supply unit:
and controlling the mortar feeding speed of a mortar feeding unit according to the cutting speed so as to control the surface temperature of the crystal bar.
Specifically, the mortar supply unit may include a flow control valve, and the mortar supply speed of the mortar supply unit is further controlled according to the speed of cutting the crystal bar by the cutting line, that is, the flow of the mortar flowing through the mortar supply pipe of the mortar supply unit is controlled by the flow control valve, so as to achieve the purpose of controlling the surface temperature of the crystal bar, thereby effectively reducing the expansion volume of the crystal bar caused by absorbing cutting heat, finally improving the surface flatness of the silicon wafer obtained by cutting, and eliminating the need of an additional finishing step due to poor flatness of the silicon wafer.
According to the crystal bar cutting method provided by the embodiment of the invention, the mortar for linear cutting can be directly sprayed on the surface of the crystal bar instead of the cutting line, so that the phenomenon that the cutting line is impacted and vibrates due to the fact that the mortar with a certain impulse is directly sprayed on the cutting line is avoided, and the phenomenon that the cutting surface is uneven due to the vibrating cutting line is avoided.
While the foregoing is directed to embodiments of the present invention, it will be appreciated by those skilled in the art that various changes and modifications may be made without departing from the principles of the invention, and it is intended that all such changes and modifications be considered as within the scope of the invention.
Claims (9)
1. A crystal bar cutting apparatus, comprising:
the feeding table is used for fixing a to-be-cut crystal bar and driving the to-be-cut crystal bar to move along a feeding direction;
and mortar discharge ports of the mortar supply unit are positioned on two sides of the feeding table and used for spraying mortar to the surface of the crystal bar to be cut.
2. The apparatus according to claim 1, further comprising:
the cutting unit is positioned in the feeding direction of the crystal bar to be cut and comprises a driving wheel and a plurality of cutting lines, and the driving wheel is used for driving the cutting lines to move so as to cut the crystal bar.
3. The apparatus according to claim 1, wherein the feed table comprises an inverted concave wedge joint, a material table positioned in a bottom groove of the inverted concave wedge joint, and a support plate fixed to the bottom of the material table, the support plate being used for fixing the ingot to be cut.
4. The ingot cutting apparatus according to claim 3, wherein the mortar supply unit comprises mortar discharge ports opened on both sides of a bottom surface of the inverted concave wedge joint, and a mortar supply pipe communicating with the mortar discharge ports.
5. The ingot cutting device according to claim 4, wherein the mortar discharge port has a shape of a long groove, and a longitudinal direction of the mortar discharge port is the same as a longitudinal direction of the ingot to be cut.
6. The apparatus according to claim 4, wherein the mortar supply unit further comprises a flow control valve provided on the mortar supply pipe for controlling a flow rate in the mortar supply pipe.
7. The apparatus according to claim 3, wherein the feed stage further comprises a driving mechanism connected to a top of the inverted concave wedge adapter for driving the inverted concave wedge adapter to move in the feeding direction.
8. A method for cutting a crystal ingot, applied to the crystal ingot cutting apparatus according to any one of claims 1 to 7, further comprising a cutting unit, the method comprising:
fixing a crystal bar to be cut at the bottom of the feeding table, and starting the cutting unit to enable the cutting line of the cutting unit to operate;
and controlling the crystal bar to move along the feeding direction so that the cutting line cuts the crystal bar, and spraying mortar to the surface of the crystal bar by using a mortar supply unit.
9. The method according to claim 8, wherein the step of spraying mortar on the surface of the ingot by the mortar supply means comprises:
and controlling the mortar feeding speed of a mortar feeding unit according to the cutting speed so as to control the surface temperature of the crystal bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010869343.7A CN111976043B (en) | 2020-08-26 | 2020-08-26 | Crystal bar cutting device and crystal bar cutting method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010869343.7A CN111976043B (en) | 2020-08-26 | 2020-08-26 | Crystal bar cutting device and crystal bar cutting method |
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| CN111976043A CN111976043A (en) | 2020-11-24 |
| CN111976043B true CN111976043B (en) | 2022-05-31 |
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| CN116749371A (en) * | 2023-08-24 | 2023-09-15 | 内蒙古晶环电子材料有限公司 | Crystal bar cutting device and wafer production system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000141220A (en) * | 1998-11-02 | 2000-05-23 | Tokyo Seimitsu Co Ltd | Work plate temperature control device of wire saw |
| JP2002046067A (en) * | 2000-08-07 | 2002-02-12 | Yasunaga Corp | Machining liquid for wire saw |
| JP4314582B2 (en) * | 2004-11-29 | 2009-08-19 | 株式会社Ｓｕｍｃｏ | Work cutting method using wire saw |
| JP2011014561A (en) * | 2009-06-30 | 2011-01-20 | Sumco Corp | Method of cutting silicon ingot |
| JP2011224761A (en) * | 2010-04-19 | 2011-11-10 | Kazumasa Onishi | Wire saw apparatus and cutting method using the same |
| DE102012201938B4 (en) * | 2012-02-09 | 2015-03-05 | Siltronic Ag | A method of simultaneously separating a plurality of slices from a workpiece |
| CN107553763A (en) * | 2016-06-30 | 2018-01-09 | 广东先导先进材料股份有限公司 | A kind of method and cutter device of multi-wire saw chip |
| CN110202707B (en) * | 2019-06-19 | 2021-04-20 | 广东先导先进材料股份有限公司 | Multi-wire cutting device and cutting fluid supply assembly thereof |
| CN110497546A (en) * | 2019-08-26 | 2019-11-26 | 哈尔滨商业大学 | The method and apparatus of free-consolidation abrasive compound multiline cut silicon chips |
| CN111186041A (en) * | 2020-02-25 | 2020-05-22 | 青岛高测科技股份有限公司 | Immersion type diamond wire cutting crystalline silicon and cooling and lubricating method |
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Effective date of registration: 20211028 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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