CN107553763A - A kind of method and cutter device of multi-wire saw chip - Google Patents
A kind of method and cutter device of multi-wire saw chip Download PDFInfo
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- CN107553763A CN107553763A CN201610514877.1A CN201610514877A CN107553763A CN 107553763 A CN107553763 A CN 107553763A CN 201610514877 A CN201610514877 A CN 201610514877A CN 107553763 A CN107553763 A CN 107553763A
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- crystal bar
- mortar
- cutting
- steel wire
- spray
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Abstract
This application discloses a kind of method of multi-wire saw chip, the mortar containing Cutting Medium is sprayed to the cutting steel wire above crystal bar, and the mortar vertically and/or favours vertical direction and sprayed on the cutting steel wire for entering edge of a knife both sides perimeter positioned at the crystal bar.In the inventive method, what mortar was not directly injected into crystal bar enters knife-edge part, reduces impulsive force of the mortar to the chip in cutting, and tilts to spray and offset in active force on cutting steel wire or so, so as to reduce shake during chip cutting, reduce chip and saw line, the situation of uneven thickness occur.The invention also discloses a kind of cutter device of the method based on the multi-wire saw chip.
Description
Technical field
The present invention relates to semiconductor wafer manufacturing technology field, more particularly to a kind of method of multi-wire saw chip.Also relate to
A kind of and cutter device based on this method.
Background technology
Existing method for cutting chip is to drive to adhere to superincumbent carborundum powder by the steel wire of a high-speed motion
Grain is ground to crystal bar, so as to reach cutting effect.In whole process, cutting steel wire is drawn by tens directive wheels
Lead, processed at three and a cutting of steel gauze is formed on roller, and the motion of crystal bar to be processed by workbench from the bottom up
Realize the feeding of crystal bar.Carborundum powder even particulate dispersion is in mortar, by mortar spray on the steel wire of high-speed motion, carbonization
Silicon powder particle is wrapped on cutting steel wire by the suspension effect of suspension, and the high-speed motion of cutting steel wire makes to be attached to cutting of steel
Carborundum powder particle on line is with the cutting force field of continued smooth in crystal bar surface to be cut, and crystal bar is with certain speed
The pressure that continuation is produced to cutting steel wire is moved from below to up, and under the effect of the pressure, carborundum powder particle is pressed into crystalline substance
The surface of rod, it is set to carry out ploughshare, cutting after producing plastic deformation.Because cutting steel wire is during crystal bar is cut, can because
Friction generates heat for both, produces high temperature, and the mortar containing carborundum powder particle plays cooling effect to cutting process again.
Can be because cutting of steel gauze be dithered as producing chip cutting thickness during chip cutting using the above method
Thin uneven phenomenon, generally on the direction fed parallel to crystal bar, chip enters knife-edge part thickness and is less than knife-edge part thickness；And
On the direction vertical with crystal bar direction of feed, chip enters line side thickness and is less than outgoing line side thickness.Wafer thickness has certain deviation
Scope, for the chip of 450 μ m thicks, its deviation range is ± 10 μm, then turns into defective products-thin and thick piece more than this scope, from
And influence the processing of yield rate and subsequent handling, and cause cutting of steel gauze shake the reason for mainly have：Equipment precision, work
The reasons such as platform, guide wheel, guide bar viscose.
In summary, how to solve the problems, such as that chip cutting became uneven is even, become those skilled in the art and urgently solve
Certainly the problem of.
The content of the invention
In view of this, it is thin to improve chip cutting it is an object of the invention to provide a kind of method of multi-wire saw chip
The thick uniformity.
It is another object of the present invention to provide a kind of cutter device based on the multi-wire saw chip method, to improve
Chip cuts the thin and thick uniformity.
To reach above-mentioned purpose, the present invention provides following technical scheme：
A kind of method of multi-wire saw chip, to the cutting steel wire above crystal bar on spray the sand containing Cutting Medium
Slurry, the mortar vertically and/or favour vertical direction and sprayed in entering edge of a knife both sides outside area positioned at the crystal bar
On the cutting steel wire in domain.
Preferably, in the method for above-mentioned multi-wire saw chip, in the spray direction of the mortar is generally aligned in the same plane,
And relative center vertical face is symmetrical in the plane.
Preferably, in the method for above-mentioned multi-wire saw chip, before the mortar is sprayed, in addition to step
Suddenly：Mortar is filtered.
Preferably, in the method for above-mentioned multi-wire saw chip, the time of the filtering is 20~50min.
Preferably, in the method for above-mentioned multi-wire saw chip, the Cutting Medium is carborundum powder particle.
Present invention also offers a kind of cutter device, based on the method for the multi-wire saw chip described in any of the above item, its
If including some rollers, cutting steel wire, crystal bar fixation kit and dry mortar shower；The cutting steel wire twines on the roller
The cutting netting twine being parallel to each other around formation；The crystal fixation kit is used to fix crystal bar；The spray nozzle of the mortar shower
Spray direction vertically and/or to favour vertical direction and spray in entering edge of a knife both sides outside area positioned at the crystal bar
On the cutting steel wire in domain.
Preferably, in above-mentioned cutter device, the crystal bar fixation kit includes：
Crystal bar locating piece, for being fixed on workbench；
Crystal bar bonding plate, it is fixed on the top of the crystal bar locating piece；
Graphite bar is bonded, the crystal bar bonding plate is fixed on, for the crystal bar that is adhesively fixed；
Press strip is bonded, for being bonded and fixed to the top of the crystal bar.
Preferably, in above-mentioned cutter device, the quantity of the spray nozzle is at least 5, and wherein at least two institute
The spray direction for stating nozzle tilts.
Preferably, in above-mentioned cutter device, the overall relatively described cutting dress in spray direction of all spray nozzles
That puts is symmetrical perpendicular to the center vertical face of the cutting steel wire.
Preferably, in above-mentioned cutter device, in addition to mortar filter, for being carried out before being sprayed to mortar
Filtering.
Compared with prior art, the beneficial effects of the invention are as follows：
In the method for multi-wire saw chip provided by the invention, mortar vertically and/or favour vertical direction spray
Drench on the cutting steel wire for entering edge of a knife both sides perimeter positioned at crystal bar.What mortar will not be directly injected into crystal bar enters knife-edge part,
Impulsive force of the mortar to the chip in cutting is reduced, and tilts to spray and is offset in active force on cutting steel wire or so, from
And shake when chip is cut is reduced, reduce chip and saw line, the situation of uneven thickness occur.
Method of the cutter device provided by the invention based on the multi-wire saw chip in the present invention, therefore chip can be improved
The thin and thick uniformity.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
The embodiment of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing of offer obtains other accompanying drawings.
Fig. 1 is a kind of structural representation when being in cut state of cutter device provided in an embodiment of the present invention；
Fig. 2 is a kind of structural representation before cutting of cutter device provided in an embodiment of the present invention；
Fig. 3 is the TTV for the chip not obtained using the cutter device in the present invention and using the cutter device in the present invention
Numerical value comparison diagram.
Embodiment
The core of the present invention there is provided a kind of method of multi-wire saw chip, improve the chip cutting thin and thick uniformity.
Present invention also offers a kind of cutter device based on the multi-wire saw chip method, improves chip cutting thin and thick
The uniformity.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Fig. 1 is refer to, the embodiments of the invention provide a kind of method of multi-wire saw chip, to above crystal bar 7
Cutting steel wire 3 sprays the mortar containing Cutting Medium, and mortar vertically and/or favours vertical direction and sprayed in cutting
On steel wire 3, and spray and enter edge of a knife both sides perimeter in what the position of cutting steel wire 3 was located at crystal bar 7.That is the spray direction of mortar
Vertically spray on the cutting steel wire 3 for entering edge of a knife both sides perimeter positioned at crystal bar 7, or the spray direction of mortar
Sprayed along vertical direction is favoured on the cutting steel wire 3 for entering edge of a knife both sides perimeter positioned at crystal bar 7, or the spray of mortar
Leaching direction vertically and favours vertical direction and sprayed in the cutting steel wire entered outside edge of a knife both sides positioned at crystal bar 7 simultaneously
On 3.In a word, mortar is not sprayed directly on the cutting steel wire 3 for entering knife-edge part of crystal bar 7.
In the method for above-mentioned multi-wire saw chip, what mortar will not be directly injected into crystal bar 7 enters knife-edge part, reduces mortar
To the impulsive force of the chip in cutting, and tilt to spray and offset in active force on cutting steel wire 3 or so, so as to reduce crystalline substance
Shake when piece is cut, reduce chip and saw line, the situation of uneven thickness occur, improve the chip cutting thin and thick uniformity.
As shown in figure 1, the sandblasting direction of mortar is multiple, and in being generally aligned in the same plane, and these sandblasting directions are at this
Symmetrical in plane, then slurry actions are symmetrical in the active force on cutting steel wire 3, can balance counteracting, further subtract
The shake of small cutting steel wire 3, improve the chip thin and thick uniformity.
As shown in Fig. 2 the method for multi-wire saw chip is optimized, before mortar spray is carried out, in addition to step：
Mortar is filtered, for other for removing the bulky grain Cutting Medium reunion inside mortar and being introduced in operational procedure
Impurity, Cutting Medium mortar of uniform size is obtained after filtering, be beneficial to make the cutting output of chip each position consistent；Further subtract
Locally the situation of saw line and broken string few chip occurs.
As optimization, in the present embodiment, the time filtered to mortar is 20~50min, and filtration time is according to need
It is determined, more preferably 30min, it is, of course, also possible to be other number ranges.
In the present embodiment, Cutting Medium is carborundum powder particle, can also be other Cutting Mediums certainly, as long as can be real
Now cut, it is not limited to the embodiment cited by the present embodiment.
As shown in figure 1, the embodiment of the present invention additionally provides a kind of cutter device, based on described by all of the above embodiment
The method of multi-wire saw chip, if it includes some rollers 1, cutting steel wire 3, crystal bar fixation kit and dry mortar shower 2；Cut
Cut steel wire 3 and the cutting netting twine being parallel to each other is wound on roller 1, with the rolling of roller 1, drive cutting netting twine to transport at a high speed
It is dynamic.Preferably, the quantity of roller 1 is three, arranged in parallel, forms three-legged structure, and cutting steel wire 3 surrounds three rollers 1
It is wrapped in thereon；Crystal fixation kit is used to fix crystal bar 7, and install on the table, with workbench from bottom to top
The mobile feeding for realizing crystal bar 7；The spray direction of the spray nozzle of mortar shower 2 is vertically and/or favoured vertically
Direction is sprayed on the cutting steel wire 3 for entering edge of a knife both sides perimeter positioned at crystal bar 7.
In above-mentioned cutter device, the spray direction of the spray nozzle of mortar shower 2 vertically and/or favours perpendicular
Nogata is to spraying in cutting steel wire 3 on the line segment for entering edge of a knife both sides of crystal bar, so as to avoid mortar from being directly sprayed to crystalline substance
Rod 7 enters knife-edge part, reduces impulsive force of the mortar to the chip in cutting, and tilt and spray in the work on cutting steel wire 3
Firmly left and right is offset, and so as to reduce shake during chip cutting, reduces chip and saw line, the situation of uneven thickness occurs, carry
The high chip cutting thin and thick uniformity.
As depicted in figs. 1 and 2, in the present embodiment, crystal bar fixation kit include crystal bar locating piece 5, crystal bar bonding plate 6,
It is bonded graphite bar 4 and bonding press strip 8；Wherein, crystal bar locating piece 5 is used to be fixed on workbench；Crystal bar bonding plate 6 is fixed on crystalline substance
The top of rod locating piece 5；Bonding graphite bar 4 is fixed on crystal bar bonding plate 6, for the crystal bar 7 that is adhesively fixed；Bonding press strip 8 is used for
It is bonded and fixed to the top of crystal bar 7.Crystal bar fixation kit as an integral installation on workbench, with the movement of workbench
It is mobile, drive crystal bar 7 to move up and down.
In the present embodiment, the quantity of spray nozzle is at least 5, and the spray direction of wherein at least two nozzle favours
Vertical direction.The quantity of mortar shower 2 depending on the quantity of the crystal bar 7 cut side by side, as shown in Fig. 2 the present embodiment with
Illustrated simultaneously exemplified by two crystal bars 7 of cutting, the quantity of mortar shower 2 is three, and three mortar showers 2 are simultaneously arranged
Put, the quantity of spray nozzle is seven, and on two mortar showers 2 of both sides, two are provided with each mortar shower 2
Spray nozzle, and the spray direction of one of spray nozzle is vertical direction, points to cutting steel wire of the crystal bar 7 in exterior lateral area
On 3, the spray direction of another spray nozzle is pointed on the cutting steel wire 3 between two crystal bars 7 to favour vertical direction；
Three spray nozzles are provided with a mortar shower 2 of centre, the spray direction of two of which spray nozzle tilts respectively
Point on the cutting steel wire 3 in the close exterior lateral area of two crystal bars 7, the spray direction of another spray nozzle vertically refers to
To on the cutting steel wire 3 between two crystal bars 7.What the mortar spray direction of whole mortar shower 2 avoided crystal bar 7 enters knife
Mouthful, and spray direction is symmetrical with respect to the center vertical face of cutter device, center vertical face, can perpendicular to cutting steel wire 3
Left and right eliminates the active force of spray, further reduces the shake of cutting steel wire 3 and chip.Certainly, the quantity of mortar shower 2 is also
Can be two, four, five etc., the quantity of spray nozzle is four, five, six, eight etc. more, arrangement and spray side
To setting principle and three mortar showers it is similar, will not be repeated here.
As shown in Fig. 2 in the present embodiment, cutter device also includes mortar filter 9, mortar filter 9 is used to install
Between spray nozzle and crystal bar 7, for being filtered before being sprayed to mortar.During specific works, carried out in cutter device
In the time of warming-up, mortar filter 9 is loaded onto, mortar is sprayed in mortar filter 9, filtered, complete before warming-up terminates
Into filtering, afterwards, mortar filter 9 is pulled down, carry out normal cutting operation.Under normal circumstances, warm-up period is 60 minutes, is warmed up
Workbench is not fed during machine, and filtration time is preferably 30 minutes.
As shown in figure 3, the chip obtained using the method and cutter device of the multi-wire saw chip in the present invention, is entered to it
After row thickness measure, obtain chip TTV numerical value (TTV refers to the maximum of wafer thickness and the difference of minimum value, be weigh it is brilliant
The important indicator of piece surface quality, device technology and integrated circuit technology on postorder have vital influence；It is English complete
Title is Total Thickness Variation, and Chinese full name is total thickness variations), and with not using this method and cutting to fill
The TTV numerical value for putting to obtain chip is contrasted, it can be seen that the TTV mean values of chip substantially reduce after improvement, and standard
Difference also substantially improves, and illustrates, the thin and thick uniformity of the chip after improvement improves.
The method and cutter device of multi-wire saw chip in the present invention are applied to the cutting of various semiconductor wafers, such as arsenic
Change gallium chip etc..
Each embodiment is described by the way of progressive in this specification, what each embodiment stressed be and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (10)
1. a kind of method of multi-wire saw chip, to the cutting steel wire above crystal bar on spray the sand containing Cutting Medium
Slurry, it is characterised in that the mortar vertically and/or favours vertical direction and sprayed in entering the edge of a knife positioned at the crystal bar
On the cutting steel wire of both sides perimeter.
2. the method for multi-wire saw chip according to claim 1, it is characterised in that the spray direction of the mortar is located at
In same plane, and in the plane symmetry.
3. the method for multi-wire saw chip according to claim 1, it is characterised in that carry out spraying it in the mortar
Before, in addition to step：Mortar is filtered.
4. the method for multi-wire saw chip according to claim 3, it is characterised in that the time of the filtering be 20~
50min。
5. the method for multi-wire saw chip according to claim 1, it is characterised in that the Cutting Medium is carborundum powder
Particle.
A kind of 6. cutter device, it is characterised in that the method based on the multi-wire saw chip described in claim any one of 1-5,
If it includes some rollers, cutting steel wire, crystal bar fixation kit and dry mortar shower；The cutting steel wire is on the roller
It is wound the cutting netting twine being parallel to each other；The crystal fixation kit is used to fix crystal bar；The spray of the mortar shower
The spray direction of mouth is vertically and/or favours vertical direction and sprayed in entering outside edge of a knife both sides positioned at the crystal bar
On the cutting steel wire in region.
7. cutter device according to claim 6, it is characterised in that the crystal bar fixation kit includes：
Crystal bar locating piece, for being fixed on workbench；
Crystal bar bonding plate, it is fixed on the top of the crystal bar locating piece；
Graphite bar is bonded, the crystal bar bonding plate is fixed on, for the crystal bar that is adhesively fixed；
Press strip is bonded, for being bonded and fixed to the top of the crystal bar.
8. cutter device according to claim 6, it is characterised in that the quantity of the spray nozzle is at least 5, and wherein
The spray direction of at least two nozzles tilts.
9. cutter device according to claim 6, it is characterised in that the spray direction of all spray nozzles is integrally relative
The cutter device it is symmetrical perpendicular to the center vertical face of the cutting steel wire.
10. cutter device according to claim 6, it is characterised in that also including mortar filter, for being sprayed
It is preceding that mortar is filtered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610514877.1A CN107553763A (en) | 2016-06-30 | 2016-06-30 | A kind of method and cutter device of multi-wire saw chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610514877.1A CN107553763A (en) | 2016-06-30 | 2016-06-30 | A kind of method and cutter device of multi-wire saw chip |
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| CN107553763A true CN107553763A (en) | 2018-01-09 |
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| CN201610514877.1A Pending CN107553763A (en) | 2016-06-30 | 2016-06-30 | A kind of method and cutter device of multi-wire saw chip |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109760221A (en) * | 2018-12-29 | 2019-05-17 | 珠海鼎泰芯源晶体有限公司 | A kind of wire-electrode cutting and processing method of large scale thin slice inp wafer |
| CN111976043A (en) * | 2020-08-26 | 2020-11-24 | 西安奕斯伟硅片技术有限公司 | Crystal bar cutting device and crystal bar cutting method |
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| CN111976043A (en) * | 2020-08-26 | 2020-11-24 | 西安奕斯伟硅片技术有限公司 | Crystal bar cutting device and crystal bar cutting method |
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