JP4314582B2 - Work cutting method using wire saw - Google Patents

Description

The present invention relates to a work cutting method using a wire saw , and more particularly to an improvement in a work cutting method using a wire saw that uses a wire to cut a large number of semiconductor wafers from a semiconductor ingot.

In the wire saw, a wire for cutting a single crystal silicon ingot (work) derived from a wire feeding bobbin is wound around a plurality of groove rollers in a coil shape, and this is wound on a wire winding bobbin. It is configured.
In the groove roller, the outer peripheral surface of a cylindrical base metal is covered with a lining material (urethane rubber) having a predetermined thickness, and a large number of wire grooves are formed on the outer peripheral surface of the lining material. The groove roller is rotatably supported by a pair of bearings arranged at both ends in the axial direction.
At the time of ingot cutting, while supplying a slurry-like abrasive liquid containing loose abrasive grains in wrapping oil, the upper end of the carbon steel work plate against the wire train that is reciprocating at high speed between the groove rollers Press the work to which is fixed from above. As a result, the ingot is cut into a number of silicon wafers by the grinding action of the loose abrasive grains.

  By the way, at the time of ingot cutting, free abrasive grains in the abrasive liquid are pressed against the ingot by the wire train reciprocating at a high speed, and frictional heat (processing heat) is generated. The frictional heat is transmitted to a work plate made of carbon steel having a high linear expansion coefficient through an ingot made of single crystal silicon having a low linear expansion coefficient. As a result, during the ingot cutting, the temperature of the work plate was increased by about 16 ° C. at maximum (from room temperature (24 ° C.) to about 40 ° C., which is the maximum temperature). As a result, the displacement of the thermal deformation due to the thermal expansion of the work plate was also large.

  Due to the influence of this thermal deformation, the ingot held on the work plate was also deformed, and the cutting accuracy of the ingot was lowered. That is, in the axial direction of the ingot, the relative position between the ingot and the wire row changed, and the warp (warpage) of the obtained silicon wafer was large. In particular, in the case of multi-cutting (simultaneous cutting of a plurality of lots) in which two short ingots are fixed to one work plate and both ingots are cut simultaneously, this has been manifested as a unique phenomenon (FIG. 5). That is, for example, in the case of an 8-inch wafer, the warp becomes maximum at an ingot portion having a cutting distance of 50 to 60 mm from the start of cutting. In addition, the warpage of each silicon wafer becomes larger toward the end of the abutting side in both ingots, and the direction of the warpage is reversed at the end of the ingot on the abutting side, and is reversed in both ingots.

Therefore, Patent Document 1 has been known as a technique for solving these problems.
In Patent Document 1, a flow path for temperature adjustment fluid is formed in a frame support (work holder) on which a work plate is mounted, and the temperature adjustment fluid stored in a tank is pumped into the flow path by a pump. It is configured as follows. In addition, the temperature of the temperature adjusting fluid is adjusted by a heater or a cooler in the middle of pumping. Thereby, during the ingot cutting, the temperature adjusting fluid whose temperature is adjusted by the heater or the cooler is supplied to the flow path of the frame support, and the thermal deformation of the work plate due to the frictional heat is suppressed. As a result, the ingot cutting accuracy is increased, and the warp of the wafer can be improved.
JP-A-5-337901

  However, in Patent Document 1, in order to form an elongated flow path through which the temperature adjusting fluid flows in the frame support body, complicated drilling or the like is required. In addition, an expensive fluid supply device such as a pressure pump has to be provided in order to pressure-feed the temperature adjusting fluid to the flow path. This complicates the wire saw apparatus configuration and increases equipment costs. In addition, maintenance of the work support and the pump is also necessary, and the maintenance cost has increased.

  Therefore, as a result of earnest research, the inventor has focused attention on the abrasive liquid that is always supplied to the cutting position between the wire row and the ingot during the cutting of the ingot. The supply temperature of the polishing liquid is 23 ° C. For this reason, it has been found that it can be sufficiently used as a cooling medium for a work plate having a maximum temperature of around 40 ° C., and the present invention has been completed.

This invention is a simple and inexpensive facility and does not require running costs, can suppress thermal deformation of the work plate due to frictional heat at the time of cutting the workpiece, can improve the workpiece cutting accuracy, and improve the warping of the wafer. The object is to provide a workpiece cutting method using a wire saw .
It is an object of the present invention to provide a workpiece cutting method using a wire saw that can prevent a specific warp in a plurality of workpieces that has occurred during conventional multi-cutting.
The present invention relates to a workpiece cutting method using a wire saw that can eliminate an increase in TTV (Total Thickness Variation) in a workpiece cutting intermediate portion caused by the joining of a part of the abrasive fluid and the abrasive fluid during workpiece cutting. The purpose is to provide.

According to the first aspect of the present invention, a work having an upper end fixed to a work plate is supplied while supplying a polishing liquid containing loose abrasive grains while reciprocating a wire spanned between a plurality of groove rollers. , In a work cutting method using a wire saw that cuts the work by relatively pressing against a wire arranged below the work, by supplying a part of the abrasive liquid to the outer surface of the work plate, While cooling the workpiece plate, the workpiece is cut by the wire, and a part of the abrasive fluid that has flowed down from the outer surface of the workpiece plate is received by the abrasive fluid receiving member, bypassing the workpiece and below the workpiece. This is a workpiece cutting method using a wire saw to be dropped .

According to the first aspect of the present invention , a part of the abrasive liquid is supplied to the outer surface of the work plate from the coolant supply nozzle provided above the work plate to cool the work plate. As a result, compared to the case where the temperature adjusting fluid in the tank is pumped to the flow path in the frame support body as in the conventional device, simpler and less expensive equipment is used and no running cost is required. It is possible to suppress thermal deformation of the work plate due to frictional heat. Thereby, the cutting accuracy of a workpiece | work can improve and the warp of the wafer obtained by cutting | disconnection can be improved.

According to this invention, the abrasive liquid (a part of the abrasive liquid) that has flowed down from the outer surface of the work plate is received by the abrasive liquid receiving member at the lower part of the work plate. Therefore, the used abrasive fluid is not supplied to the wire and the workpiece disposed below the workpiece plate. Therefore, the used abrasive liquid does not merge with the main abrasive liquid used for cutting the workpiece, and the supply flow of the main abrasive liquid at the time of cutting the workpiece is not disturbed. As a result, the TTV of the wafer increases at the cutting intermediate portion of the workpiece (the portion at the intermediate position between the cutting start position and the cutting end position) due to the fact that a part of the polishing liquid merges with the main polishing liquid. The phenomenon can be eliminated.

As the workpiece, for example, a semiconductor ingot, a low thermal expansion material, or the like can be used. As a material of the semiconductor ingot, for example, single crystal silicon, polycrystalline silicon, gallium arsenide, or the like can be employed. As the low thermal expansion material, for example, Invar alloy (Fe-36Ni), Super Invar alloy (Fe-36Ni-5Co), Kovar alloy (Fe-29Ni-17Co), ceramics, or the like can be used.
The wafer obtained by cutting the workpiece varies depending on the material of the workpiece to be cut. For example, when the work is a semiconductor ingot, it becomes a semiconductor wafer.
The shape of the workpiece is not limited. For example, a cylinder or a prism can be employed. Any other shape may be used.
The diameter of the workpiece is not limited. For example, a diameter of 200 mm, a diameter of 300 mm, or the like may be used.
For cutting the workpiece with a wire, for example, a method of lowering the workpiece and pressing the workpiece against the wire may be adopted. In addition, a method may be employed in which the workpiece is lifted and pressed against the wire and then cut.

As the groove roller, for example, a cylindrical base metal whose outer peripheral surface is covered with a lining material (urethane rubber, etc.) having a predetermined thickness and a plurality of wire grooves are engraved on the outer peripheral surface of the lining material is used. Can do. The groove roller is rotatably supported by a pair of bearings disposed at both ends in the axial direction.
The number of groove rollers used is not limited as long as it is two or more. For example, three or four or more may be used.

As a material of the wire, for example, a high-tensile steel wire can be adopted.
The diameter of the wire is, for example, 120 to 160 μm.
The abrasive liquid (including a part of the abrasive liquid) is a slurry-like liquid in which free abrasive grains are included in wrapping oil.
The supply amount of the abrasive liquid (main abrasive liquid) to the cut portion of the workpiece is 80 to 120 liters / minute. If it is less than 80 liters / minute, the supply of slurry becomes non-uniform. Moreover, when it exceeds 120 liters / minute, the slurry discharged | emitted from a slurry tank will increase, and the liquid amount of a slurry will generate | occur | produce.

As the free abrasive grains, for example, silicon carbide abrasive grains (GC abrasive grains), silica abrasive grains, alumina abrasive grains, or diamond abrasive grains can be employed.
The average grain size of the free abrasive grains is, for example, 5 to 14 μm.
The addition amount of the free abrasive grains in the polishing liquid is 80 to 150 parts by weight with respect to 100 parts by weight of the wrapping oil. If the amount of the free abrasive grains added is less than 80 parts by weight, the machinability of the free abrasive grains with respect to the workpiece is lowered. Moreover, when it exceeds 150 weight part, the viscosity of a slurry will increase and the fluidity | liquidity of a slurry will be reduced.

The supply amount of a part of the abrasive liquid to the work plate is 5 to 15 liters / minute. If it is less than 5 liters / minute, the cooling property of the slurry is lowered and the temperature of the work plate is raised. Moreover, when it exceeds 15 liters / minute, the flow of the main abrasive fluid supplied to the wire saw for cutting the workpiece is hindered.
The supply temperature of some abrasive liquids is 20-30 ° C. If it is less than 20 ° C., the temperature difference between the abrasive liquid and the work plate becomes large, and the work plate is overcooled. Moreover, when it exceeds 30 degreeC, the temperature difference of an abrasive fluid and a work plate will become small, and a work plate will be insufficiently cooled. A preferable supply temperature of the abrasive liquid is the same temperature as the main abrasive liquid. If it is this range, a temperature change will become small.
The part of the work plate to which a part of the abrasive fluid is supplied is not limited. For example, the whole work plate or a part of the work plate (for example, one side) may be used.
A part of the abrasive liquid may be an abrasive liquid supplied from a dedicated abrasive liquid tank (abrasive liquid tank) supplied to the work plate.

The material of the coolant supply nozzle is not limited as long as it has corrosion resistance against the wrapping oil. For example, polyvinyl chloride, Teflon (registered trademark), stainless steel, carbon steel, aluminum or the like can be used.
The length of the coolant supply nozzle is preferably such a length that the abrasive liquid can be supplied to the entire outer surface of the work plate.
The position above the work plate where the coolant supply nozzle is disposed may be a position where a part of the abrasive liquid can be supplied to the outer surface of the work plate. For example, it may be directly above the work plate, or may be a position unevenly distributed from directly above the work plate. However, the direction directly above the work plate is preferable because the abrasive liquid from the coolant supply nozzle can be easily supplied to the entire work plate.
The number of refrigerant supply nozzles used may be one, or two or three or more.

The same material as the coolant supply nozzle can be adopted as the material for the abrasive liquid receiving member.
  The abrasive liquid receiving member may be provided on a part of the side surface of the work plate, or may be provided on the entire side surface of the work plate.
  There may be one abrasive fluid receiving member or a plurality of abrasive fluid receiving members.

The invention described in claim 2 is the workpiece cutting method using the wire saw according to claim 1, wherein a plurality of the workpieces are fixed to the workpiece plate.

  According to the second aspect of the present invention, when multi-cutting is performed while the work plate is cooled by the abrasive liquid, it is possible to prevent a specific warp (FIG. 5) in a plurality of works that has been generated conventionally. . As a result, when the two short workpieces are regarded as one long workpiece in the same manner as when one workpiece is cut (single cutting) while being multi-cut, the one workpiece Warps that are slightly larger on both sides in the length direction of the workpiece and gradually decrease toward the inside in the length direction of the workpiece can appear on the wafers for two lots (FIG. 6).

  At the time of multi-cutting, the number of workpieces fixed to one workpiece plate may be two or more. Three or four may be sufficient. Each work is fixed to one work plate by aligning the axes of each other.

According to the work cutting method using the wire saw according to claim 1, a part of the abrasive liquid is supplied to the outer surface of the work plate from the coolant supply nozzle above the work plate to cool the work plate. As a result, it is possible to suppress the thermal deformation of the work plate due to the frictional heat at the time of cutting the workpiece, using simple and inexpensive equipment, with low equipment cost and no running cost. As a result, the workpiece cutting accuracy is increased, and the warp of the wafer can be improved.

According to the work cutting method using the wire saw according to the present invention, the abrasive liquid that has flowed down from the outer surface of the work plate is received by the abrasive liquid receiving member at the lower part of the work plate. As a result, it is possible to avoid a situation in which the abrasive liquid (a part of the abrasive liquid) that has cooled the work plate flows down as it is, and the cooled abrasive liquid merges with the main abrasive liquid during workpiece cutting. As a result, it is possible to eliminate the phenomenon that the TTV of the wafer increases in the intermediate cutting part of the workpiece due to this merging.

  In particular, according to the second aspect of the present invention, when the work plate is cooled by the abrasive liquid at the time of multi-cutting, it is possible to prevent a specific warp of each work that has occurred at the time of multi-cutting by a conventional apparatus that is not cooled. .

Examples of the present invention will be specifically described below. First, a reference example will be described with reference to FIGS.

In FIG. 1, 10 is a wire saw, and this wire saw 10 is an apparatus for cutting a single crystal silicon ingot (work) I made by a CZ method into a large number of silicon wafers (wafers). is there.
The wire saw 10 has three groove rollers 12A, 12B, and 12C arranged in an inverted triangle shape when viewed from the front in FIG. Between these groove rollers 12A, 12B, and 12C, one wire 11a is wound in parallel with each other at a constant pitch. As a result, the wire row 11 appears between the groove rollers 12A, 12B, and 12C. The wire row 11 is reciprocated by a drive motor between the three groove rollers 12A, 12B, and 12C. The middle of the two groove rollers 12A and 12B arranged on the upper side is the ingot cutting position a of the wire row 11 that cuts the ingot I.

  The ingot I is fixed to the lower surface of a work plate 19 made of carbon steel via a carbon bed 19a. The work plate 19 is provided in the lower part of the work holder fixed to the raising / lowering table (work feed table) raised / lowered by the raising / lowering mechanism which is not shown in figure. The ingot I is moved up and down integrally with the work plate 19 by driving a lifting motor incorporated in the lifting mechanism and lifting the lifting table. Above one side of the ingot cutting position a, a polishing liquid supply nozzle 14 that continuously supplies the polishing liquid (slurry) S onto the wire row 11 is disposed. The abrasive liquid supply nozzle 14 is communicated with the abrasive liquid discharge portion of the abrasive liquid supply device 25 via the abrasive liquid supply pipe 24. The abrasive liquid S pumped at 100 liters / minute from the abrasive liquid supply device 25 flows out to the vicinity of the ingot cutting position a of the wire row 11 through the abrasive liquid supply pipe 24 and the abrasive liquid supply nozzle 14.

  Each of the groove rollers 12A, 12B, and 12C has a cylindrical shape, and the outer peripheral surfaces thereof are respectively covered with lining materials 12a, 12b, and 12c having a predetermined thickness made of urethane rubber. Wire grooves are formed on the outer peripheral surfaces of the lining materials 12a, 12b, and 12c.

The wire 11a is a high-tensile steel wire having a diameter of 140 μm. The wire 11a is led out from the bobbin 20 of the feeding device 13, and is then laid over the groove rollers 12A, 12B, and 12C in a predetermined order via the supply-side guide roller, and then through the guide-side guide roller. Then, it is wound around the bobbin 21 of the winding device 15. The rotating shafts of the bobbins 20 and 21 are connected to the corresponding output shafts of the drive motors 16 and 17, respectively.
When the drive motors 16 and 17 are driven in synchronization, the bobbins 20 and 21 pivotally supported by the pair of bearings 18 are rotated in the clockwise direction or the counterclockwise direction in FIG. The wire 11a reciprocates.

As shown in FIGS. 1 to 3, the feature of the invention according to the reference example is that a cooling abrasive liquid (part of the abrasive liquid) S <b> 1 is supplied to the outer surface of the work plate 19 above the work plate 19. The coolant supply nozzle 30 for cooling the work plate 10 is provided.
Only one refrigerant supply nozzle 30 is arranged on the intermediate position in the width direction of the work plate 19 so that the axial direction matches the length direction of the work plate 19.
The refrigerant supply nozzle 30 is made of polyvinyl chloride and has a diameter of about 30 mm. The length of the coolant supply nozzle 30 is slightly longer than that of the work plate 19. A large number of nozzle holes 31 having a diameter of 2.5 mm are formed in the lower part of the refrigerant supply nozzle 30 at a pitch of 25 mm toward the axial direction of the refrigerant supply nozzle 30. In addition, the tip of a branch pipe 26 whose original part is communicated with the middle part of the abrasive liquid supply pipe 24 is communicated with the upper part of the intermediate position in the length direction of the refrigerant supply nozzle 30. An opening / closing valve 27 is provided in the middle of the branch pipe 26.

Next, a method for cutting the ingot I by the wire saw 10 according to the reference example of the present invention will be described.
As shown in FIG. 1, in the wire saw 10, the feeding liquid is supplied from the abrasive liquid supply device 25 to the abrasive liquid supply nozzle 14 by the drive motor 16 while supplying the abrasive liquid S to the wire row 11 at 100 liters / minute. The 13 bobbins 20 are rotated to supply the wire 11a to the groove rollers 12A, 12B, and 12C. At the same time, the bobbin 21 of the winding device 15 is rotated by the drive motor 17 to wind the wire 11a via the groove rollers 12A, 12B, and 12C. In that case, the rotation direction of each bobbin 20 and 21 is changed with a fixed period, and the wire 11a is reciprocated.

  As shown in FIGS. 2 and 3, during reciprocation of the wire row 11, the ingot I is pressed against the wire row 11 from above. As a result, the ingot I is cut into a large number of silicon wafers W. That is, when the wire row 11 reciprocates, the loose abrasive grains in the abrasive liquid S are rubbed against the bottom of the cutting groove by the wire 11a of the wire row 11, and the bottom is gradually scraped off by the grinding action. Finally, the wafer is cut into a large number of silicon wafers W.

  When the ingot is cut, the on-off valve 27 is opened. Thereby, a part of the abrasive fluid flowing through the abrasive fluid supply pipe 24 becomes the cooling abrasive liquid S1 and is pumped to the refrigerant supply nozzle 30 through the branch pipe 26 (FIGS. 2 and 3). The cooling abrasive liquid S1 that has reached the coolant supply nozzle 30 is discharged directly from the nozzle holes 31 at a rate of 10 liters / minute. Thereafter, the discharged cooling abrasive liquid S <b> 1 falls in a row in the length direction of the work plate 19 on the intermediate portion of the upper surface of the work plate 19 in the width direction. Then, the cooling abrasive liquid S <b> 1 is divided into two on the upper surface of the work plate 19, mainly on both sides in the width direction of the work plate 19. Then, it flows down along the entire outer surface (especially both side surfaces) of the work plate 19, and at this time, the work plate 19 is cooled by the cooling abrasive liquid S1.

  In this way, by supplying a part of the abrasive liquid S from the coolant supply nozzle 30 disposed above the work plate 19 to the outer surface of the work plate 19 as the cooling abrasive liquid S1, the work plate 19 is provided on the outer surface. And the cooling abrasive liquid S1 (supply temperature around 23 ° C.), and is not heated by frictional heat at the time of ingot cutting, so that the temperature of the work plate 19 can be kept at the same temperature as the abrasive liquid. . As a result, compared to the conventional device that pumps the temperature adjusting fluid in the tank to the flow path in the work plate 19, simpler and less expensive equipment is used and no running cost is required. The thermal deformation of the work plate 19 due to can be suppressed. Therefore, the cutting accuracy of the ingot I is increased and the warp of the silicon wafer W can be improved.

In addition, as shown in FIG. 4, the wire saw 10 has two short ingots IL and IR fixed to the work plate 19 via a short carbon bed 19a, and simultaneously cuts both ingots IL and IR. Cutting can also be performed. At this time, both ingots IL and IR are fixed to the work plate 19 so that their axial directions coincide with each other.
That is, when multi-cutting using a conventional wire saw that does not cool the work plate, both end portions in the length direction are fixed to the work holder at the time of ingot cutting, so the work plate is positioned at an intermediate position in the length direction due to thermal expansion. Bend slightly around the center. As a result, for example, in the case of an 8-inch wafer, the warp is maximized at the ingots IL and IR at a cutting distance of 50 to 60 mm from the start of cutting (FIG. 5). In addition, the warpage of each silicon wafer W becomes larger in the ingots IL and IR toward the end of the abutting side, and the direction of warpage is reversed at the end of the ingot IL and IR at the abutting side. It was reversed in IR.

On the other hand, in the wire saw 10 according to the reference example, the multi-cutting of both ingots IL and IR is performed while the work plate 19 is cooled by the cooling abrasive liquid S1. Thereby, the thermal deformation of the work plate 19 is suppressed, and a specific warp of each silicon wafer W in the above-described conventional ingots IL and IR can be prevented. As a result, both ends of the ingots IL and IR opposite to the abutting side are slightly larger and the abutting sides of both ingots IL and IR are substantially the same as when one ingot is cut while being multi-cut. Warp that gradually decreases toward the edge of the wafer can appear on the silicon wafers W for two lots (FIG. 6).

Next, with reference to FIGS. 7 to 13, a wire saw according to an embodiment of the present invention and a work cutting method using the same will be described.
As shown in FIGS. 7 and 8, the wire saw 10 </ b> A according to the embodiment is characterized in that a polishing liquid receiving member 32 that receives the cooling polishing liquid S <b> 1 that has flowed down from the outer surface of the work plate 19 is provided in the lower part of the work plate 19. Is a point.
The abrasive liquid receiving members 32 are stainless steel horizontally arranged scissors, and are fixed one by one on both sides in the width direction of the work plate 19 with the length direction facing the length direction of the work plate 19. Both end portions in the length direction of each abrasive liquid receiving member 32 protrude slightly outward from both ends in the length direction of the work plate 19.

According to the wire saw 10 </ b> A according to the embodiment, the cooling abrasive liquid S <b> 1 that has flowed down from both side surfaces (outer surfaces) in the width direction of the work plate 19 is received by the corresponding abrasive liquid receiving member 32 at the lower part of the work plate 19. Then, outside the both ends in the length direction of the ingot I, the ingot I is bypassed from the both ends in the length direction in which the abrasive liquid receiving member 32 is opened, and is dropped below the ingot I. Therefore, the used cooling abrasive liquid S1 is not supplied to the wire row 11 and the ingot I arranged below the work plate 19. Therefore, as shown in FIG. 9, the used cooling abrasive liquid S1 does not merge with the main abrasive liquid S used for cutting the ingot I. As a result, the supply flow of the abrasive liquid S during ingot cutting is not disturbed. As a result, as shown in FIG. 10, the TTV of the silicon wafer W increases at the cutting intermediate portion (intermediate portion in the wafer diameter direction) of the ingot I due to the merging of the cooling abrasive fluid S1 and the abrasive fluid S. This phenomenon can be eliminated.

Here, the reason why the TTV of the silicon wafer W increases at the cutting intermediate portion of the ingot I will be described with reference to FIGS.
The abrasive liquid S rides on the moving wire row 11 and is supplied to the ingot I in parallel with the wire row 11. From immediately after the start of cutting the ingot I to when the intermediate portion of the ingot I is cut, the abrasive liquid S flows down below the ingot I along the outer peripheral surface of the lower portion of the ingot I (FIG. 11).
On the other hand, the abrasive liquid S passes over the ingot I along the outer peripheral surface of the upper part of the ingot I after cutting the intermediate part of the ingot I until the end of cutting of the ingot I (FIG. 13). That is, when the intermediate portion of the ingot I is cut, the abrasive liquid S supplied to the wire row 11 cannot be detoured to the lower side or the upper side of the ingot I, and the load on the ingot I is maximized ( FIG. 12). At this time, the cooling abrasive liquid S1 is further supplied to the cut portion of the ingot I from above. As a result, it is considered that an increase in TTV of the silicon wafer W occurs in the cutting middle part of the ingot I.

It is a perspective view which shows schematic structure of the wire saw which concerns on the reference example of this invention. It is a front view which shows schematic structure of the principal part of the wire saw which concerns on the reference example of this invention. It is a principal part longitudinal cross-sectional view of the wire saw which concerns on the reference example of this invention. It is a front view which shows schematic structure of the principal part which shows the multi-cutting of the workpiece | work by the wire saw which concerns on the reference example of this invention. It is an expanded sectional view which shows the state after multi-cutting of the workpiece | work by the wire saw which concerns on the conventional means. It is an expanded sectional view which shows the state after multi-cutting of the workpiece | work by the wire saw which concerns on the reference example of this invention. It is a front view which shows schematic structure of the principal part of the wire saw which concerns on the Example of this invention. It is a principal part longitudinal cross-sectional view of the wire saw which concerns on the Example of this invention. It is a principal part longitudinal cross-sectional view which shows the flow of the abrasive fluid during a workpiece | work cutting | disconnection when the abrasive fluid receiving member of the wire saw concerning the Example of this invention is abbreviate | omitted. It is the perspective view which showed the wafer obtained when the abrasive liquid receiving member of the wire saw which concerns on the Example of this invention was abbreviate | omitted with the contour line. It is a principal part longitudinal cross-sectional view which shows the state immediately after the cutting start of the workpiece | work by a wire saw. It is a principal part longitudinal cross-sectional view which shows the cutting state of the cutting | disconnection intermediate part of the workpiece | work by a wire saw. It is a principal part longitudinal cross-sectional view which shows the state just before completion | finish of the cutting | disconnection of the workpiece | work by a wire saw.

Explanation of symbols

10,10A wire saw,
11a wire,
12A-12C groove roller,
19 Work plate,
30 refrigerant supply nozzle,
32 abrasive receiving member,
I ingot (work),
S abrasive fluid,
S1 Cooling abrasive liquid (part of the abrasive liquid).

Claims (2)

A workpiece having an upper end fixed to a workpiece plate is disposed below the workpiece while supplying a polishing liquid containing loose abrasive grains while reciprocating a wire spanned between a plurality of groove rollers. In a workpiece cutting method using a wire saw that presses a wire relatively to cut the workpiece,
While supplying a part of the abrasive liquid to the outer surface of the work plate, while cooling the work plate, cutting the work with the wire ,
A workpiece cutting method using a wire saw that receives a part of the abrasive fluid that has flowed down from the outer surface of the workpiece plate by an abrasive fluid receiving member, and detours the workpiece and drops it below the workpiece. The work cutting method using the wire saw according to claim 1, wherein a plurality of the works are fixed to the work plate.

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