JP2023173451A - Workpiece cutting method, slice device, and slice base - Google Patents

Abstract

To provide a cutting method of a workpiece capable of cooling an ingot efficiently, a slice device, and a slice base.SOLUTION: According to a cutting method of a workpiece for cutting a workpiece into a wafer shape, a wire column is formed by winding a wire around a plurality of rollers with grooves, and the workpiece held by workpiece holding means is relatively abutted to the wire column and cut in and fed via a slice base to which an upper part of the workpiece is adhered while reciprocally traveling the wire in an axial direction. A space is provided between the workpiece and the slice base, and the workpiece is cut while supplying the space with coolant.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for cutting a work such as a semiconductor ingot, a slicing device, and a slicing base.

Conventionally, a semiconductor ingot such as silicon is formed, and this semiconductor ingot is adhered to a slice base made of glass, carbon material, or resin using an adhesive such as epoxy, and then cut into multiple pieces to a predetermined thickness. It forms a semiconductor substrate.

A common method for cutting in this manner is a cutting method using a wire saw. In a commonly used wire saw device, a semiconductor ingot bonded to a slicing base is installed, and wires are wound around a number of grooves at regular intervals and arranged parallel to each other. Then, while moving a plurality of wires stretched between two main rollers at high speed, the semiconductor ingot is gradually lowered toward the wire and pressed against the semiconductor ingot, thereby cutting the semiconductor ingot and cutting the semiconductor substrate. Create.

In the cutting method using a wire saw, the wire is pressed against the semiconductor ingot while running at high speed, but when the semiconductor ingot is cut, frictional heat is generated at the cut part, and if the cut part of the semiconductor ingot becomes hot due to frictional heat, cutting accuracy deteriorates. In addition, there are problems in that microcracks and the like occur in the formed semiconductor substrate.

Therefore, Patent Document 1 describes a semiconductor substrate manufacturing method that can absorb the frictional heat generated when cutting a semiconductor ingot and suppress deterioration of cutting accuracy, surface roughness, and generation of microcracks. A technique is described in which cutting is performed while supplying coolant liquid to the top side, and the inlet and outlet sides where the wire cuts into the semiconductor ingot.

Furthermore, in Patent Document 2, a work plate that holds a workpiece through a slicing base is devised as a wire saw that can cut wafers of uniform thickness by suppressing warpage, waviness, and thickness variation of cut wafers. is being done. In other words, there is a machining fluid supply section that supplies machining fluid to the upper surface of the work plate, a machining fluid supply port provided on the upper surface, and a machining fluid supply port that communicates with the machining fluid supply port and passes through the work plate to supply the machining fluid to the workpiece. A technique has been disclosed that includes a through-flow path for supplying the workpiece to the workpiece and a rectifying plate for evenly supplying the machining liquid supplied from the through-flow path to the workpiece.

Japanese Patent Application Publication No. 2006-239795 Japanese Patent Application Publication No. 2005-276851

In the inventions described in these patent documents, a workpiece is bonded to a slice base (also called a joining member, beam, caul plate, resin part, etc.) made of resin, ceramic, etc. A workpiece is held by the workpiece holding section via this slice base.

In the conventional technology, coolant or machining fluid is supplied to the top side or side surface of the workpiece, so although the heat generated near the cutting position can be efficiently cooled, the cooling effect was insufficient at the slice base. It has been found that conventional methods of supplying and cooling coolants and processing fluids are affected by heat accumulation at the slice base. In particular, the thermal behavior tends to vary, such as the temperature difference between the area where the slice base is attached and the area where it is not attached, which causes problems such as deterioration of the shape near the end of the cut and a tendency for cracks to occur.

In particular, when slicing with fixed abrasive grains, the warp of the cut workpiece (wafer) deteriorates due to thermal expansion of the workpiece (ingot) during cutting, and the slice base that is attached to the workpiece (ingot) may ) and the resin, cracks are likely to occur in the cut workpiece (wafer).

The present invention has been made to solve the above problem, and aims to strengthen the cooling capacity of the ingot in order to suppress the thermal expansion of the ingot. The purpose is to provide a cutting method, a slicing device, and a slicing base to maintain a stable wafer shape and prevent cracks.

The present invention has been made to achieve the above object, and a wire row is formed by winding a wire around a plurality of grooved rollers, and while the wire is reciprocated in the axial direction, the upper part of the workpiece is A method for cutting a workpiece, the workpiece being held by a workpiece holding means via a bonded slicing base, and cutting the workpiece into a wafer shape by relatively pressing the workpiece against the wire row and feeding the workpiece into a wafer shape, the method comprising: A workpiece cutting method is provided in which a space is provided between the workpiece and the slicing base, and the workpiece is cut while supplying coolant to the space.

According to this workpiece cutting method, in addition to the normal supply of processing fluid (slurry) and coolant to the side surface of the ingot, coolant is supplied to the top of the workpiece to cool the slice base in particular, thereby improving efficiency. The workpiece can be cut while cooling the workpiece. This stabilizes the shape of the workpiece and prevents problems such as cracking.

At this time, the workpiece cutting method may use, as the wire, a fixed abrasive wire with abrasive grains fixed to the surface of the wire.

The present invention is particularly effective in a workpiece cutting method using such a fixed abrasive wire.

The present invention also provides a wire row formed by winding a wire around a plurality of grooved rollers, a slicing base to which an upper part of a work is adhered, and a work holder that holds the work through the slicing base. means for moving the workpiece axially by relatively pressing the workpiece held by the workpiece holding means against the wire row and feeding the workpiece while reciprocating the wire in the axial direction. A slicing device that simultaneously cuts at a plurality of locations lined up in a direction, wherein the slicing base is provided with a recessed portion on a surface to be bonded to the workpiece that forms a space between the workpiece and the workpiece when the workpiece is bonded; A slicing device is provided that includes a coolant supply section that supplies coolant to the space.

According to such a slicing device, coolant is supplied to the top of the workpiece in addition to the normal supply of processing liquid (slurry) and coolant to the side surface of the ingot to cool the slicing base in particular. This allows the workpiece to be cut while cooling the workpiece. Then, the shape of the workpiece becomes stable, and problems such as cracking can be prevented.

At this time, the slicing device may be such that the wire is a fixed abrasive wire with abrasive grains fixed to the surface of the wire.

The present invention is particularly effective in devices using such fixed abrasive wires.

The present invention also provides a workpiece holding means in which a wire row is formed by winding a wire around a plurality of grooved rollers, and while the wire is reciprocated in the axial direction, a workpiece holding means is passed through a slice base to which an upper part of the workpiece is bonded. A slicing base used in a slicing device that cuts the workpiece held in a wafer shape by relatively pressing the workpiece against the wire row to cut and feed the workpiece into a wafer shape, the slicing base comprising: A slice base is provided, which has a concave portion on a surface to be bonded to the workpiece, which forms a space for flowing coolant between the workpiece and the workpiece when the workpiece is bonded.

According to such a slice base, coolant can be supplied to the top of the workpiece in addition to the normal supply of processing fluid (slurry) and coolant to the side surface of the ingot to efficiently cool the workpiece. Become. Then, the shape of the workpiece becomes stable, and problems such as cracking can be prevented.

As described above, according to the workpiece cutting method of the present invention, by supplying coolant to the upper part of the workpiece and cooling the slice base in particular, the workpiece can be cut while efficiently cooling the workpiece. becomes possible. Further, according to the slicing device of the present invention, the work can be cut while efficiently cooling the work. According to the slice base of the present invention, a workpiece can be efficiently cooled. As a result, the shape of the cut workpiece (wafer) is stabilized, and problems such as cracks can be suppressed.

An example of application (cross-sectional view) of the slice base according to the present invention is shown. FIG. 2 shows a perspective view of a slice base according to the present invention. Another example (cross-sectional view) of the recessed portion of the slice base according to the present invention is shown. FIG. 7 shows another application example (cross-sectional view) of the slice base according to the present invention. An application example (cross-sectional view) of the slice base and coolant supply unit according to the present invention is shown. The evaluation results of Examples, Reference Examples, and Comparative Examples in Experimental Example 1 are shown. The evaluation results of Examples and Comparative Examples in Experimental Example 2 are shown. The slice base (cross-sectional view) evaluated in Experimental Example 3 is shown. It is a drawing explaining a slicing device. It is a drawing explaining a work holding means. 1 shows an application example (cross-sectional view) of a slice base according to a conventional example.

Hereinafter, the present invention will be explained in detail, but the present invention is not limited thereto.

As described above, there is a need for a workpiece cutting method, a slicing device, and a slicing base that enable efficient cooling of an ingot.

As a result of intensive study on the above-mentioned problem, the present inventors formed a wire row by winding the wire around a plurality of grooved rollers, and while the wire was reciprocated in the axial direction, the upper part of the workpiece was bonded. A method for cutting a workpiece, the workpiece being cut into wafers by relatively pressing the workpiece held by a workpiece holding means against the wire row through a slicing base and cutting the workpiece into a wafer shape. A space is provided between the workpiece and the slicing base, and the workpiece cutting method involves supplying coolant to the space while cutting the workpiece. This method separates the supply of machining liquid (slurry) and coolant to the side surface of the ingot. The inventors have discovered that by supplying coolant to the upper part of the workpiece to cool the slicing base in particular, the workpiece can be cut while efficiently cooling the workpiece, and the present invention has been completed.

The present inventors also proposed a wire row formed by winding a wire around a plurality of grooved rollers, a slicing base to which an upper part of a workpiece is adhered, and a method for holding the workpiece via the slicing base. a workpiece holding means, and the workpiece held by the workpiece holding means is relatively pressed against the wire row to cut and feed the wire while reciprocating in the axial direction. A slicing device that simultaneously cuts a material at a plurality of locations lined up in the axial direction, wherein the slicing base has a recessed portion on a surface to be bonded to the workpiece that forms a space between the workpiece and the workpiece when the workpiece is bonded to the workpiece. The slicing device is equipped with a coolant supply unit that supplies coolant to the space, and supplies coolant to the top of the workpiece in addition to the normal supply of processing fluid (slurry) and coolant to the side surface of the ingot. The inventors have discovered that by cooling the slicing base portion, the workpiece can be cut while efficiently cooling the workpiece, and the present invention has been completed.

The present inventors also formed a wire row by winding the wire around a plurality of grooved rollers, and while the wire was reciprocated in the axial direction, the wire was passed through a slice base to which the upper part of the work was glued. A slicing base used in a slicing device for cutting a workpiece held by a holding means by relatively pressing the workpiece against the wire row to cut and feed the workpiece to cut the workpiece into a wafer shape, the slicing base The slicing base is equipped with a concave part on the adhesive surface to the workpiece to form a space for coolant to flow between the workpiece and the workpiece when the workpiece is bonded to the workpiece. The present invention was completed based on the discovery that the work can be efficiently cooled by supplying coolant to the upper part of the work in addition to supplying liquid (slurry) and coolant.

This will be explained below with reference to the drawings.

[Slicing device]
First, the slicing device will be explained. FIG. 9 shows an example of a general slicing device (wire saw). As shown in FIG. 9, this slicing device (wire saw) 201 includes a wire 202 (high-tensile steel wire) for cutting an ingot-shaped workpiece W, a grooved roller 103 around which the wire 202 is wound, and a tension of the wire 202. 104, 104', a mechanism 105 for sending the workpiece W to be cut downward, and a mechanism 206 for supplying slurry during cutting.

The wire 202 is unwound from one wire reel 107, passes through a traverser 108, a tension adjustment mechanism 104, and a pulley 109, and is wound around a grooved roller 103 about 300 to 500 times to form a wire row. The wire is wound onto a wire reel 107' via a pulley 109', a tension adjustment mechanism 104', and a traverser 108'.

The grooved roller 103 is, for example, a roller made by press-fitting a polyurethane resin around a steel cylinder and cutting grooves at a substantially constant pitch on its surface. , can be reciprocated in one direction or in the axial direction at a predetermined period.

The wire reels 107 and 107' are rotationally driven by wire reel drive motors 111 and 111', and the tension applied to the wire 202 is controlled by controlling the speeds of the grooved roller drive motor 110 and the wire reel drive motors 111 and 111', respectively. Can be adjusted.

Further, the mechanism 105 shown in FIG. 9 for sending the workpiece W downward has a workpiece holding means 114 composed of a workpiece holding part 112 and a workpiece plate 113, as shown in FIG. , the work W is held via a slice base 120 attached to the work W. The slice base 120 is a member made of, for example, resin, carbon, glass, ceramics, or the like. FIG. 11 shows an application example (cross-sectional view) of a conventional slice base in which the conventional slice base 120, work plate 113, and work W are enlarged.

When cutting the workpiece W, the workpiece W held by the workpiece holding means 114 is pressed against the wire rows relatively and fed to cut, thereby cutting the ingot-like workpiece into wafer-like workpieces. For example, the workpiece W is held and pushed down by the mechanism 105 that sends the workpiece W downward, and is sent out to a wire row consisting of the wire 202 wound around the grooved roller 103 .

Using such a wire saw 201, an appropriate tension is applied to the wire 202 using the tension applying mechanisms 104, 104', and the wire 202 is caused to reciprocate in the axial direction of the wire 202 by the wire reel drive motors 111, 111'. At the same time, the slurry supplied from the slurry supplying mechanism 206 is supplied, and the workpiece W is cut and fed by the mechanism 105 that sends out the workpiece W downward, so that the ingot-shaped workpiece W is placed at a plurality of locations lined up in the axial direction of the workpiece W. Cut at the same time.

A method and apparatus for cutting a workpiece are also known, as shown in FIG. 9, using a fixed abrasive wire with diamond abrasive grains or the like fixed to the surface of the wire as the wire 202, without using a slurry containing abrasive grains. . In this cutting using a fixed abrasive wire, a fixed abrasive wire is attached in place of the wire 202 in the general wire saw 201 shown in FIG. Further, a wire saw including a coolant supply mechanism is used in which the slurry supplied in the general wire saw 201 shown in FIG. 9 is replaced with a coolant such as cooling water that does not contain abrasive grains. In this way, a general wire saw can be used as is for cutting with this fixed abrasive wire.

(slice base)
The present inventor paid attention to the shape of this slice base and came up with the idea of newly providing a coolant supply mechanism that supplies coolant between this slice base and the workpiece (ingot).

To this end, the slice base of the present invention has a structure in which a space is provided between the upper part of the ingot and the slice base by changing the conventional shape. The slicing base of the present invention is provided with a recess (groove) on the surface to be bonded to the workpiece, which forms a space for flowing coolant between the base and the workpiece when the workpiece is bonded. We have discovered that by supplying coolant to this space, it is possible to efficiently cool the ingot.

As an example of the shape of the slice base, as shown in FIGS. 1 and 2, a recess (groove) 300 is provided on the adhesive surface (contact surface) with the workpiece (ingot) to create a space between the workpiece (ingot) W and the slice base 120. The shape is such that it can be used. In the example of FIGS. 1 and 2, the shape of the recess (groove) 300 is a cross section perpendicular to the direction in which the recess extends (a cross section parallel to the cut surface of the workpiece. Hereinafter, when simply referred to as "cross section", this cross section is referred to. ), making it approximately rectangular.

The space width B is preferably 30 mm or more, more preferably 50 mm or more. The upper limit should be set appropriately, taking into consideration the diameter of the workpiece, the type of slice base, etc., although the larger the space, the greater the cooling effect. For example, the ratio of the space width B to the slice base width L may be set to a width of 20% or more and 70% or less. The slice base width L is not particularly limited, and can be appropriately set in consideration of the strength of the slice base, the adhesive strength between the workpiece and the slice base, and the like. For example, when cutting a 300 mm ingot, the slice base width L can be set to about 80 mm to 160 mm.

In the examples shown in FIGS. 1 and 2, the recess (groove) 300 forms a space having a substantially square cross-sectional shape, but the present invention is not particularly limited to this. As shown in FIG. 3(A), the cross-sectional shape of the recess may be a semi-ellipse, or as shown in FIG. 3(B), a plurality of (two) recesses as shown in FIG. 3(A) are formed. The same effect can be obtained even if The design is such that the concave portion 300 is easy to form, the strength of the slice base, and the contact area is such that sufficient adhesive strength can be obtained when the slice base and the workpiece are bonded. The adhesive surface of the slice base 120 with the workpiece (ingot) has a shape according to the outer shape of the workpiece (ingot). For example, if the workpiece (ingot) is cylindrical, it has an arc shape according to the diameter of the cross section of the workpiece. The cross-sectional shape is .

For example, as shown in FIG. 4, there may be a plurality of spaces each having a substantially rectangular cross-sectional shape. Although it depends on the strength of the slice base and the adhesive strength between the work and the slice base, each adhesive width (A1, A2, A3, A4, etc.) between the work and the slice base is preferably 10 mm or more. The upper limit of the bonding width is not particularly limited, but it is preferably set to a width of 20 mm or less in order to efficiently cool the vicinity of the slice base. The total of each bonding width depends on the diameter of the ingot and the type and width of the slice base, but the ratio of the total bonding width (bonding area) to the slice base width L should be set to 30% or more and 80% or less. is preferred. Further, the total width of the spaces (B1, B2, B3...) is preferably 30 mm or more. The larger the space, the greater the cooling effect, but it should be set appropriately, taking into account the diameter of the workpiece, the type and width of the slice base, etc. For example, the ratio of the space width to the slice base width L may be set to 20% or more and 70% or less.

In particular, the shape of the slice base can be designed to provide the optimum contact area, taking into account the weight of the ingot, the adhesive strength of the adhesive, etc.

(Coolant supply section)
Next, a mechanism for supplying coolant to the space between the slicing base and the workpiece in the slicing apparatus will be described. The slicing device itself may be a conventional slicing device. For example, as shown in FIG. 5, a conventional device is used to supply coolant to the space newly formed between the slicing base and the workpiece. A coolant supply section 301 is provided. A coolant supply section 301 is installed at the opening of the space on one side of the recess (space) of the slice base, and the coolant can be supplied from the coolant supply section 301 and discharged from the opening of the space on the other side. Note that FIG. 5(A) is a diagram of FIG. 5(B) viewed from the right. Note that the coolant is not particularly limited as long as it has a cooling effect, but for example, in slicing using a slurry containing abrasive grains, the slurry used for cutting may be used for slicing using a fixed abrasive wire. Now, let's supply cooling water that does not contain abrasive grains to this part (in other words, we can use the conventional slurry or coolant and supply it between the slice base and the workpiece via a separate pipe. good).

The present invention will be specifically explained below with reference to experimental examples and examples, but these are not intended to limit the present invention.

A slice base in which a groove having a substantially square cross section as shown in FIG. 1 was formed was prepared. The slice base is made of synthetic resin.

First, an ingot with a diameter of 300 mm was adhered to a slice base using an adhesive. Thereafter, the ingot was held on the work plate via the slice base. Then, the work plate holding this ingot was set in the slicing device of the present invention. After setting, a coolant supply section for supplying coolant to the slicing base was set, and cutting was performed in the same manner as before while flowing coolant into this section.

First, we investigated the effects of the present invention and preferred flow rates and groove widths.

[Experiment example 1]
The slice base width L is fixed at 90 mm, the space width B of the slice base is 50 mm, and the adhesive width is 40 mm (20 mm on both ends) (the ratio of the space width B to the slice base width L is about 56%, and the ratio of the adhesive area is about 44%). As an example, the coolant flowing into the recess (space) 300 was supplied at a flow rate of 20 L/min to 120 L/min, and the warp shape of the wafer-shaped workpiece after cutting was confirmed. As a reference example, cutting was also carried out under the condition that no coolant was allowed to flow (0 L/min). As a comparative example, cutting was performed using a conventional slicing base without grooves (see FIG. 11).

The shape of the wafer-like workpiece after cutting was evaluated relative to the Warp value of 1.0 when processed using a conventional slice base without grooves. The results are shown in FIG.

As shown in Fig. 6, there is a tendency for the Warp value to improve by flowing coolant into the recess (space) 300 of the slurry base, and in this confirmation, especially when coolant is supplied at a rate of 40 L/min or more The Warp value was reduced more stably.

[Experiment example 2]
The flow rate of coolant supplied to the recess (space) 300 of the slice base was fixed at 40 L/min, and the space width B was leveled and cut from 0 to 100 mm. Note that the space width B=0 mm refers to a conventional slice base without grooves (comparative example). Further, the slice base width L was 140 mm. That is, the cutting was performed with the ratio of the space width B to the slice base width L being 0 to 71%, and the adhesive width being 140 mm to 40 mm (the ratio of the contact area to the slice base width L being 100 to 29%).

The shape of the wafer-like workpiece after cutting was evaluated relative to the Warp value of 1.0 when processed using a conventional slice base without grooves. The results are shown in FIG.

As shown in Figure 7, there is a tendency for improvement by providing a space, and in the confirmation of this experimental example, especially when the space width B is 30 mm or more (ratio of space width B to slice base width L: about 20% or more). Warp was reduced more stably by forming a space (forming a cooling region), preferably 50 mm or more (ratio of space width B to slice base width L: 36% or more). Supplying coolant over a certain area in this way can further stabilize the cooling effect.

[Experiment example 3]
The slice base width L is 110 mm, the total space width B of the slice base is 70 mm (the ratio of the space width B to the slice base width L: about 64%), and the flow rate supplied to the recess (space) 300 of the slice base is 60 L/min, and as shown in FIG. 8, the number of recesses (spaces) 300 was varied from 1 to 3, that is,
When using one piece, each adhesive width (2 locations) is 20 mm, space width is 70 mm,
When using 2 pieces, each adhesive width (3 places) is 13mm, each space width is 35mm,
When there are 3 pieces, each bonding width (4 places) is 10mm, each space width is 23mm,
It was set and disconnected. The warp shape of the wafer-shaped workpiece after cutting was confirmed.

As a result, by being able to supply coolant to the recesses (spaces) 300 of the slice base regardless of the number of recesses (spaces) 300, almost the same improvement effect was achieved. In other words, it can be seen that cooling this part is an important factor.

In the present results, in the case of processing an ingot with a diameter of 300 mm, it was confirmed that cooling can be achieved more efficiently when the space width B is 30 mm or more and the flow rate of the coolant flowing into the recess (space) 300 is 40 L/min or more. Furthermore, it has been found that similar effects can be obtained even if the recess (space) 300 is divided into a plurality of parts. No wafer-shaped work pieces were observed after cutting.

As described above, according to the embodiment of the present invention, a recess (space) is installed in the slice base of the present invention, and coolant is supplied to the recessed part to enhance the cooling effect. Variations in thermal behavior such as temperature differences in areas where the material is not pasted have been improved, the stability of the shape near the end of the cut has been improved, and it has been possible to prevent the occurrence of cracks in wafer-shaped workpieces.

Note that the present invention is not limited to the above embodiments. The above-mentioned embodiments are illustrative, and any embodiment that has substantially the same configuration as the technical idea stated in the claims of the present invention and has similar effects is the present invention. covered within the technical scope of.

103...Grooved roller, 104, 104'...Mechanism for adjusting the tension of the wire,
105...Mechanism for sending the work downward, 107, 107'...Wire reel,
108, 108'...traverser, 109, 109'...pulley,
110... Grooved roller drive motor, 111, 111'... Wire reel drive motor,
112... Work holding part, 113... Work plate, 114... Work holding means,
120...Slice base (joining member, beam, caul plate, resin part),
201...Slicing device (wire saw), 202...Wire (high tensile steel wire),
206... Mechanism for supplying slurry, 300... Recess (space, groove),
301...Coolant supply section.
A1, A2, A3, A4...adhesive width, B, B1, B2, B3...space width,
L...Slice base width, W...Work.

Claims (5)

A wire row is formed by winding a wire around a plurality of grooved rollers, and while the wire is reciprocated in the axial direction, the workpiece is held by a workpiece holding means via a slice base to which an upper part of the workpiece is bonded. A workpiece cutting method in which the workpiece is cut into a wafer shape by relatively pressing the wire against the wire row and feeding the workpiece into a wafer shape,
A method for cutting a workpiece, characterized in that a space is provided between the workpiece and the slicing base, and the workpiece is cut while supplying coolant to the space. 2. The method for cutting a workpiece according to claim 1, wherein a fixed abrasive wire having abrasive grains fixed to the surface of the wire is used as the wire. A wire row formed by winding the wire around a plurality of grooved rollers;
a slice base to which the upper part of the workpiece is glued;
a workpiece holding means for holding the workpiece via the slice base,
While reciprocating the wire in the axial direction, the workpiece held by the workpiece holding means is relatively pressed against the wire row and fed so as to cut and feed the workpiece at a plurality of locations lined up in the axial direction. A slicing device that simultaneously cuts the
The slicing base includes a concave portion on a surface to be bonded to the workpiece, which forms a space between the slice base and the workpiece when the workpiece is bonded;
A slicing device comprising a coolant supply section that supplies coolant to the space. 4. The slicing device according to claim 3, wherein the wire is a fixed abrasive wire with abrasive grains fixed to the surface of the wire. A wire row is formed by winding a wire around a plurality of grooved rollers, and while the wire is reciprocated in the axial direction, the workpiece is held by a workpiece holding means via a slice base to which an upper part of the workpiece is bonded. A slicing base used in a slicing device that cuts a workpiece into a wafer shape by relatively pressing the wire against the wire row to cut and feed the workpiece, the workpiece being cut into a wafer shape.
The slicing base is characterized in that the slicing base is provided with a concave portion on a surface to be bonded to the workpiece, which forms a space for flowing coolant between the slicing base and the workpiece when the workpiece is bonded.

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