JP2009049106A - Cleaning device and cleaning method - Google Patents

Cleaning device and cleaning method Download PDF

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JP2009049106A
JP2009049106A JP2007212343A JP2007212343A JP2009049106A JP 2009049106 A JP2009049106 A JP 2009049106A JP 2007212343 A JP2007212343 A JP 2007212343A JP 2007212343 A JP2007212343 A JP 2007212343A JP 2009049106 A JP2009049106 A JP 2009049106A
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desiccant
cleaning
drying
holding
wafer
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JP4907468B2 (en
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Hiromi Otsuka
博実 大塚
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To excellently dry an object to be cleaned. <P>SOLUTION: A cleaning device includes: a drying means for drying the object to be cleaned by jetting a drying agent to the object to be cleaned subjected to cleaning by the cleaning device; a moving means for moving the drying means along the object to be cleaned; a first drying agent injection port provided in the drying means; and a second drying agent injection port provided below the first drying agent injection port and on a rear side in the moving direction during drying process. Further, a third drying agent injection port is formed between the first drying agent injection port and second drying agent injection port in the vertical direction and in the front-rear direction. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、洗浄装置及び洗浄方法に関するものである。   The present invention relates to a cleaning apparatus and a cleaning method.

従来より、たとえば半導体ウエハの洗浄処理を行う基板処理装置においては、複数枚の半導体ウエハを保持体で保持して装置内部を搬送するための搬送機構を設けるとともに、保持体に付着した汚染物を洗浄するための洗浄機構を設けていた。   2. Description of the Related Art Conventionally, for example, in a substrate processing apparatus that performs a cleaning process on a semiconductor wafer, a transport mechanism for transporting the inside of the apparatus by holding a plurality of semiconductor wafers by a holder is provided, and contaminants attached to the holder are removed. A cleaning mechanism for cleaning was provided.

この洗浄機構は、被洗浄体としての保持体に向けて洗浄液を噴射する洗浄手段と保持体に向けて乾燥剤を噴射する乾燥手段とを一体化した洗浄乾燥手段を保持体に沿って往復移動可能に構成しており、乾燥手段には、保持体の側部に向けて乾燥剤を噴射する複数の乾燥剤噴射口を上下に縦一列に並べて形成していた。   This cleaning mechanism reciprocates a cleaning / drying unit that integrates a cleaning unit that sprays a cleaning liquid toward a holder as a body to be cleaned and a drying unit that sprays a desiccant toward the holder along the holder. In the drying means, a plurality of desiccant injection ports for injecting the desiccant toward the side portion of the holding body are vertically arranged in a vertical row.

そして、洗浄機構は、洗浄乾燥手段の往動時に洗浄液噴射口から保持体に向けて洗浄液を噴射して保持体の洗浄動作を行い、その後、洗浄乾燥手段の復動時に乾燥剤噴射口から保持体に向けて乾燥剤を噴射して保持体の乾燥動作を行い、洗浄乾燥手段の往復移動で保持体の洗浄を完結するようにしていた。   The cleaning mechanism sprays the cleaning liquid from the cleaning liquid spray port toward the holding body when the cleaning / drying means moves forward, and then performs the cleaning operation of the holding body, and then holds it from the desiccant spray port when the cleaning / drying means returns. The desiccant was sprayed toward the body to perform the drying operation of the holding body, and the cleaning of the holding body was completed by the reciprocating movement of the washing and drying means.

特開2006−26609号公報JP 2006-26609 A

ところが、上記従来の洗浄機構では、乾燥手段の乾燥剤噴射口を上下に縦一列に並べて形成していたために、乾燥手段が保持体の上部側から下部側まで同時に乾燥剤を噴き付けながら保持体に沿って移動することになり、保持体の上部側に噴き付けられた乾燥剤によって流下した洗浄液が保持体の下部側に付着してしまい、保持体の乾燥を良好に行えないおそれがあった。   However, in the conventional cleaning mechanism, since the drying agent spray ports of the drying means are vertically arranged in a vertical line, the drying means simultaneously sprays the desiccant from the upper side to the lower side of the holding body while holding the holding body. The cleaning liquid that has flowed down by the desiccant sprayed on the upper side of the holding body adheres to the lower side of the holding body, and the holding body may not be dried well. .

そこで、請求項1に係る本発明では、洗浄装置において、洗浄後の被洗浄体に向けて乾燥剤を噴射して被洗浄体を乾燥させる乾燥手段と、前記乾燥手段を被洗浄体に沿って移動させる移動手段と、前記乾燥手段に設けた第1の乾燥剤噴射口と、前記第1の乾燥剤噴射口よりも下方側で、かつ、乾燥時の移動方向に対して後方側に設けた第2の乾燥剤噴射口とを有することにした。   Accordingly, in the present invention according to claim 1, in the cleaning apparatus, a drying unit that sprays a desiccant toward the cleaned object to be cleaned to dry the cleaned object, and the drying unit is disposed along the cleaned object. A moving means for moving, a first desiccant injection port provided in the drying means, a lower side than the first desiccant injection port, and a rear side with respect to the moving direction during drying. And having a second desiccant jet.

また、請求項2に係る本発明では、前記請求項1に係る本発明において、前記第1の乾燥剤噴射口と第2の乾燥剤噴射口の上下方向及び前後方向の間に第3の乾燥剤噴射口を形成することにした。   Moreover, in this invention which concerns on Claim 2, in this invention which concerns on the said Claim 1, 3rd drying is carried out between the up-down direction and the front-back direction of a said 1st desiccant injection port and a 2nd desiccant injection port. It was decided to form an agent injection port.

また、請求項3に係る本発明では、被洗浄体を洗浄した後に、被洗浄体に向けて乾燥剤を噴射する乾燥手段を被洗浄体に沿って移動させて被洗浄体の乾燥を行う洗浄方法において、前記乾燥手段に設けた第1の乾燥剤噴射口と、前記第1の乾燥剤噴射口よりも下方側で、かつ、乾燥時の移動方向に対して後方側に設けた第2の乾燥剤噴射口から被洗浄体に向けて乾燥剤を噴射することにした。   Moreover, in this invention which concerns on Claim 3, after wash | cleaning a to-be-cleaned body, the drying means which sprays a desiccant toward a to-be-cleaned body is moved along a to-be-cleaned body, and the to-be-cleaned body is dried. In the method, a first desiccant injection port provided in the drying means, and a second side provided below the first desiccant injection port and on the rear side with respect to the moving direction during drying. It was decided to spray the desiccant from the desiccant spray port toward the object to be cleaned.

また、請求項4に係る本発明では、前記請求項3に係る本発明において、前記第1の乾燥剤噴射口と第2の乾燥剤噴射口の上下方向及び前後方向の間に形成した第3の乾燥剤噴射口から被洗浄体に向けて乾燥剤を噴射することにした。   Moreover, in this invention which concerns on Claim 4, in this invention which concerns on the said Claim 3, it formed in the up-down direction and the front-back direction of the said 1st desiccant injection port and the 2nd desiccant injection port. It was decided to spray the desiccant from the desiccant spraying port toward the object to be cleaned.

そして、本発明では、以下に記載する効果を奏する。   And in this invention, there exists an effect described below.

すなわち、本発明では、第1の乾燥剤噴射口よりも下方側で、かつ、乾燥時の移動方向に対して後方側に第2の乾燥剤噴射口を設けているために、第1の乾燥剤噴射口から被洗浄体に乾燥剤が吹き付けられた後に、第2の乾燥剤噴射口から被洗浄体に乾燥剤が吹き付けられることになり、被洗浄体の洗浄後の乾燥時において第1の乾燥剤噴射口から被洗浄体の上部側に噴き付けられた乾燥剤によって流下した洗浄液をその後に第2の乾燥剤噴射口から被洗浄体の下部側に噴き付けられる乾燥剤で乾燥させることができ、被洗浄体の乾燥を良好に行うことができる。   That is, in the present invention, since the second desiccant spray port is provided below the first desiccant spray port and on the rear side with respect to the moving direction during drying, the first drying agent is provided. After the desiccant is sprayed from the agent spray port to the object to be cleaned, the desiccant is sprayed from the second desiccant spray port to the object to be cleaned. The cleaning liquid that has flowed down by the desiccant sprayed from the desiccant spray port to the upper side of the object to be cleaned is then dried by the desiccant sprayed from the second desiccant spray port to the lower side of the object to be cleaned. And the object to be cleaned can be satisfactorily dried.

以下に、本発明の具体的な実施例について、半導体ウエハ(基板)の洗浄処理や乾燥処理を施す基板処理装置を例に挙げて図面を参照しながら説明する。   In the following, specific embodiments of the present invention will be described with reference to the drawings, taking as an example a substrate processing apparatus for performing a cleaning process and a drying process on a semiconductor wafer (substrate).

図1に示すように、基板処理装置1は、複数枚の半導体ウエハ(以下、「ウエハ2」という。)を収容したキャリア3の搬入及び搬出を行うキャリア搬入出部4と、キャリア3に収容されたウエハ2の搬入及び搬出を行うウエハ搬入出部5と、ウエハ2の洗浄処理及び乾燥処理を行うウエハ処理部6とで構成している。   As shown in FIG. 1, the substrate processing apparatus 1 includes a carrier loading / unloading unit 4 that loads and unloads a carrier 3 that houses a plurality of semiconductor wafers (hereinafter referred to as “wafer 2”), and a carrier 3. A wafer carry-in / out unit 5 for carrying in and out the wafer 2 and a wafer processing unit 6 for carrying out a cleaning process and a drying process for the wafer 2.

キャリア搬入出部4は、キャリア3を載置するキャリアステージ7に密閉状の開閉扉8を形成し、この開閉扉8の内側にキャリア搬送機構9とキャリアストック10とキャリア載置台11を配設している。   The carrier loading / unloading unit 4 forms a sealed opening / closing door 8 on a carrier stage 7 on which the carrier 3 is placed, and a carrier transport mechanism 9, a carrier stock 10, and a carrier mounting table 11 are arranged inside the opening / closing door 8. is doing.

そして、キャリア搬入出部4では、キャリア搬送機構9によってキャリアステージ7に載置されたキャリア3を必要に応じてキャリアストック10に一時的に保管するとともに、キャリア載置台11に搬入するようにしている。また、キャリア搬入出部4では、ウエハ処理部6で処理が完了したウエハ2が収容されたキャリア3に対し、搬入時とは逆に、キャリア載置台11に載置されたキャリア3を必要に応じてキャリア搬送機構9によってキャリアストック10に一時的に保管するとともに、キャリアステージ7に搬出するようにしている。   The carrier loading / unloading unit 4 temporarily stores the carrier 3 placed on the carrier stage 7 by the carrier carrying mechanism 9 in the carrier stock 10 as necessary, and carries the carrier 3 on the carrier placing table 11. Yes. The carrier loading / unloading unit 4 requires the carrier 3 mounted on the carrier mounting table 11, contrary to the time of loading, for the carrier 3 containing the wafer 2 that has been processed by the wafer processing unit 6. Accordingly, the carrier is temporarily stored in the carrier stock 10 by the carrier transport mechanism 9 and is transported to the carrier stage 7.

ウエハ搬入出部5は、キャリア搬入出部4との間に密閉状の開閉扉12を形成するとともに、この開閉扉12の内側にウエハ搬入出機構13とウエハ搬送機構14の始端部とを配設している。   The wafer loading / unloading section 5 forms a sealed opening / closing door 12 between the carrier loading / unloading section 4, and a wafer loading / unloading mechanism 13 and a start end of the wafer transfer mechanism 14 are arranged inside the opening / closing door 12. Has been established.

そして、ウエハ搬入出部5では、キャリア搬入出部4のキャリア載置台11に載置したキャリア3に収容されたウエハ2をウエハ搬入出機構13によってウエハ搬送機構14に搬入するとともに、ウエハ搬送機構14によってウエハ処理部6にウエハ2を搬送し、一方、ウエハ処理部6で処理が完了したウエハ2をウエハ搬送機構14によってウエハ処理部6からウエハ搬入出機構13に搬送するとともに、ウエハ搬入出機構13によってウエハ搬送機構14からキャリア搬入出部4のキャリア載置台11に載置したキャリア3に搬出するようにしている。 In the wafer loading / unloading section 5, the wafer 2 accommodated in the carrier 3 placed on the carrier mounting table 11 of the carrier loading / unloading section 4 is loaded into the wafer conveyance mechanism 14 by the wafer loading / unloading mechanism 13, and the wafer conveyance mechanism The wafer 2 is transferred to the wafer processing unit 6 by 14, while the wafer 2 that has been processed by the wafer processing unit 6 is transferred from the wafer processing unit 6 to the wafer loading / unloading mechanism 13 by the wafer transfer mechanism 14, and the wafer is loaded / unloaded. The mechanism 13 is adapted to carry out the wafer transfer mechanism 14 from the wafer transfer mechanism 14 to the carrier 3 mounted on the carrier mounting table 11 of the carrier loading / unloading unit 4.

ウエハ処理部6は、ウエハ2の洗浄処理を行う第1〜第3のウエハ洗浄装置15,16,17と、ウエハ2の洗浄処理及び乾燥処理を行うウエハ洗浄乾燥装置18と、ウエハ搬送機構14に設けたウエハ2を保持する保持体19の洗浄を行う洗浄装置20とを並べて配設するとともに、これら各装置15,16,17,18,20に沿ってウエハ搬送機構14を配設している。   The wafer processing unit 6 includes first to third wafer cleaning devices 15, 16, and 17 that perform cleaning processing on the wafer 2, a wafer cleaning and drying device 18 that performs cleaning processing and drying processing on the wafer 2, and a wafer transfer mechanism 14. A cleaning device 20 for cleaning the holding body 19 that holds the wafer 2 provided on the wafer 2 is disposed side by side, and a wafer transfer mechanism 14 is disposed along each of the devices 15, 16, 17, 18, 20. Yes.

そして、ウエハ処理部6では、ウエハ搬送機構14によってウエハ搬入出部5からウエハ2を第1〜第3のウエハ洗浄装置15,16,17やウエハ洗浄乾燥装置18に搬送して、ウエハ2の洗浄処理や乾燥処理を行い、その後、処理後のウエハ2をウエハ搬送機構14によってウエハ搬入出部5へ再び搬送するようにしている。   In the wafer processing unit 6, the wafer transfer mechanism 14 transfers the wafer 2 from the wafer carry-in / out unit 5 to the first to third wafer cleaning devices 15, 16, 17 and the wafer cleaning / drying device 18. A cleaning process and a drying process are performed, and then the processed wafer 2 is transferred again to the wafer loading / unloading section 5 by the wafer transfer mechanism 14.

また、ウエハ処理部6では、ウエハ搬送機構14の保持体19を洗浄装置20で洗浄して、保持体19に付着した汚染物がウエハ2に転写しないようにしている。   In the wafer processing unit 6, the holder 19 of the wafer transport mechanism 14 is cleaned by the cleaning device 20 so that the contaminants attached to the holder 19 are not transferred to the wafer 2.

この洗浄装置20は、図2に示すように、ウエハ搬送機構14の前方にケーシング21を配設するとともに、ケーシング21の側面及び前面にウエハ搬送機構14の保持体19を挿通する開口22を形成し、この開口22からケーシング21の内部に保持体19を収容するようにしている。   As shown in FIG. 2, the cleaning device 20 has a casing 21 disposed in front of the wafer transfer mechanism 14, and an opening 22 through which the holding body 19 of the wafer transfer mechanism 14 is inserted on the side surface and the front surface of the casing 21. The holding body 19 is accommodated in the casing 21 through the opening 22.

また、洗浄装置20は、ケーシング21の内部に収容した保持体19に沿って洗浄乾燥手段23を移動手段24によって移動可能に設けるとともに、ケーシング21の内部にエアー噴出手段25を配設している。   Further, the cleaning device 20 is provided with a cleaning / drying means 23 movably by the moving means 24 along the holding body 19 accommodated in the casing 21, and an air ejection means 25 is provided inside the casing 21. .

以下に、ウエハ搬送機構14、洗浄乾燥手段23、エアー噴出手段25の構成について説明する。   The configuration of the wafer transfer mechanism 14, the cleaning / drying means 23, and the air ejection means 25 will be described below.

まず、ウエハ搬送機構14の構成について説明すると、ウエハ搬送機構14は、図2及び図3に示すように、第1〜第3のウエハ洗浄装置15,16,17やウエハ洗浄乾燥装置18に沿って移動可能に形成した移動体26に保持体19を形成している。この保持体19は、ウエハ2の下部を保持する下部保持体27とウエハ2の左右側部を保持する左右一対の左右保持体28,29とで構成しており、各保持体27,28,29の上部にウエハ2を1枚ずつ保持する保持溝30を前後に並べて形成している。   First, the configuration of the wafer transfer mechanism 14 will be described. The wafer transfer mechanism 14 is arranged along the first to third wafer cleaning apparatuses 15, 16, 17 and the wafer cleaning / drying apparatus 18, as shown in FIGS. The holding body 19 is formed on the movable body 26 formed so as to be movable. The holder 19 includes a lower holder 27 that holds the lower portion of the wafer 2 and a pair of left and right holders 28 and 29 that hold the left and right sides of the wafer 2. A holding groove 30 for holding the wafers 2 one by one is formed on the top of 29 in a line.

下部保持体27は、移動体26の中央部に突出させた固定軸31に固定アーム32を介して取付けている。また、左右保持体28,29は、移動体26の左右側部に突出させた回動軸33,34に回動アーム35,36を介して取付けている。これにより、下部保持体27は、移動体26に固定されており、左右保持体28,29は、移動体26に対して回動可能に取付けられている。そして、左右保持体28,29は、回動軸33,34を回転駆動することによって、図3に示すように、ウエハ2を保持する時には、回動アーム35,36を左右外側に跳ね上げ保持溝30を内側に向けてウエハ2の左右端部を保持する保持姿勢(図3中、一点鎖線で示す状態。)とし、一方、洗浄時には、回動アーム35,36を下方に垂下させ保持溝30を外側に傾斜状に向けた洗浄姿勢(図3中、実線で示す状態。)とすることができ、保持姿勢と洗浄姿勢とに姿勢変更可能としている。ここで、左右保持体28,29は、保持姿勢では外側に移動して左右の間隔が拡大し、一方、洗浄姿勢では内側に移動して左右の間隔が縮小するようにして、洗浄姿勢のほうが保持姿勢よりも小型化させるようにしている。このように、左右保持体28,29の洗浄姿勢を保持姿勢よりも小型化させることによって、洗浄装置20の小型化を図ることができる。   The lower holding body 27 is attached via a fixed arm 32 to a fixed shaft 31 protruding from the center of the moving body 26. The left and right holding bodies 28 and 29 are attached to the rotation shafts 33 and 34 projecting from the left and right side portions of the moving body 26 via the rotation arms 35 and 36, respectively. Thus, the lower holding body 27 is fixed to the moving body 26, and the left and right holding bodies 28 and 29 are attached to the moving body 26 so as to be rotatable. The left and right holding bodies 28 and 29 rotate and rotate the rotation shafts 33 and 34 to hold the rotation arms 35 and 36 to the left and right outside when holding the wafer 2 as shown in FIG. The holding posture is set to hold the left and right end portions of the wafer 2 with the groove 30 facing inward (the state indicated by the one-dot chain line in FIG. 3). On the other hand, during cleaning, the rotating arms 35 and 36 are suspended downward to hold the holding groove. The cleaning posture 30 can be changed to a holding posture and a cleaning posture (indicated by a solid line in FIG. 3). Here, the left and right holders 28 and 29 move outward in the holding posture and the left and right intervals are increased, while in the cleaning posture, the left and right holders 28 and 29 move inward and the left and right intervals are reduced. The size is smaller than the holding posture. Thus, the size of the cleaning device 20 can be reduced by making the cleaning posture of the left and right holding bodies 28 and 29 smaller than the holding posture.

次に、洗浄乾燥手段23の構成について説明すると、洗浄乾燥手段23は、図2及び図4〜図8に示すように、洗浄ユニット37と洗浄乾燥ユニット38と乾燥ユニット39とカバー板40とを順に一体的に取付けており、移動手段24によって保持体19に沿って一体的に往復移動し、往動時(図2において、保持体19の先端側(左側)から基端側(右側)に移動する時)に洗浄ユニット37と洗浄乾燥ユニット38から保持体19に向けて洗浄液を噴射して保持体19の洗浄を行い、復動時(図2において、保持体19の基端側(右側)から先端側(左側)に移動する時)に洗浄乾燥ユニット38と乾燥ユニット39から保持体19に向けて乾燥剤を噴射して洗浄後の乾燥を行って、一連の洗浄動作を完結するようにしている。   Next, the configuration of the cleaning / drying means 23 will be described. The cleaning / drying means 23 includes a cleaning unit 37, a cleaning / drying unit 38, a drying unit 39, and a cover plate 40 as shown in FIGS. 2 and 4-8. They are integrally attached in order, and are reciprocated integrally along the holding body 19 by the moving means 24, and when moving forward (in FIG. 2, from the front end side (left side) to the base end side (right side) of the holding body 19 When moving, the cleaning liquid is sprayed from the cleaning unit 37 and the cleaning / drying unit 38 toward the holding body 19 to clean the holding body 19, and when returning (in FIG. 2, the base end side of the holding body 19 (right side) ) From the cleaning / drying unit 38 and the drying unit 39 toward the holding body 19 to dry the post-cleaning to complete a series of cleaning operations. I have to.

洗浄ユニット37は、矩形板状のユニット本体41に各保持体27,28,29を挿通する3個の開口42,43,44を左右に並べて形成するとともに、各開口42,43,44の左右側部に3個の洗浄液噴射口45a,45b,45cを上下に間隔をあけて縦一列に形成し、さらには、ユニット本体41に各洗浄液噴射口45a,45b,45cに連通する連通路46を形成しており、この連通路46に純水を供給する純水供給源47を開閉バルブ48を介して連通連結している。これにより、洗浄ユニット37は、開閉バルブ48を開放状態とすることで、純水供給源47から供給される純水を洗浄液として各開口42,43,44の洗浄液噴射口45a,45b,45cから各保持体27,28,29の側部に向けて噴射するようにしている。   The cleaning unit 37 is formed by arranging three openings 42, 43, and 44 through which the holding bodies 27, 28, and 29 are inserted side by side in a rectangular plate unit body 41, and the left and right sides of the openings 42, 43, and 44. Three cleaning liquid injection ports 45a, 45b, and 45c are formed in the vertical direction at intervals on the side, and a communication passage 46 that communicates with each of the cleaning liquid injection ports 45a, 45b, and 45c is formed in the unit body 41. A pure water supply source 47 that supplies pure water to the communication passage 46 is connected to the communication passage 46 via an open / close valve 48. Thus, the cleaning unit 37 opens the open / close valve 48, so that the pure water supplied from the pure water supply source 47 is used as the cleaning liquid from the cleaning liquid injection ports 45a, 45b, 45c of the openings 42, 43, 44. It is made to inject toward the side part of each holding body 27,28,29.

洗浄乾燥ユニット38は、矩形板状のユニット本体49に3個の2流体混合ノズル50,51,52を取付けるとともに、各2流体混合ノズル50,51,52に純水供給源47と窒素ガスを供給する窒素ガス供給源53とをそれぞれ開閉バルブ54,55を介して連通連結しており、各2流体混合ノズル50,51,52の噴射口56,57,58を各保持体27,28,29の直上方に位置させている。これにより、洗浄乾燥ユニット38は、両開閉バルブ54,55を開放状態とすることで、純水供給源47から供給される純水と窒素ガス供給源53から供給される窒素ガスとを各2流体混合ノズル50,51,52で混合し、混合流体を洗浄液として各2流体混合ノズル50,51,52の噴射口56,57,58から各保持体27,28,29の上部に向けて噴射するようにしている。また、洗浄乾燥ユニット38は、純水側の開閉バルブ54を閉塞状態とするとともに窒素ガス側の開閉バルブ55だけを開放状態とすることで、窒素ガス供給源53から供給される窒素ガスを乾燥剤として各2流体混合ノズル50,51,52の噴射口56,57,58から各保持体27,28,29の上部に向けて噴射するようにしている。   The washing / drying unit 38 has three two-fluid mixing nozzles 50, 51, 52 attached to a rectangular plate-shaped unit main body 49, and a pure water supply source 47 and nitrogen gas to each of the two-fluid mixing nozzles 50, 51, 52. A nitrogen gas supply source 53 to be supplied is connected to each other through open / close valves 54 and 55, and the injection ports 56, 57 and 58 of the two-fluid mixing nozzles 50, 51 and 52 are connected to the holding bodies 27, 28, It is located just above 29. Thus, the cleaning / drying unit 38 opens the both open / close valves 54 and 55 to open the pure water supplied from the pure water supply source 47 and the nitrogen gas supplied from the nitrogen gas supply source 53, respectively. Mixing with the fluid mixing nozzles 50, 51, 52, and spraying the mixed fluid as cleaning liquid from the injection ports 56, 57, 58 of each of the two fluid mixing nozzles 50, 51, 52 toward the upper portions of the holding bodies 27, 28, 29 Like to do. The cleaning / drying unit 38 dries the nitrogen gas supplied from the nitrogen gas supply source 53 by closing the pure water side opening / closing valve 54 and opening only the nitrogen gas side opening / closing valve 55. As an agent, the two-fluid mixing nozzles 50, 51, and 52 are jetted from the jet ports 56, 57, and 58 toward the upper portions of the holding bodies 27, 28, and 29, respectively.

ここで、洗浄乾燥ユニット38では、左右の2流体混合ノズル50,52の噴射口56,58を左右保持体28,29の直上方に配置しており、洗浄時には左右保持体28,29が保持溝30を外側に傾斜状に向けた洗浄姿勢となっているため、左右保持体28,29の保持溝30に対して相対的に外側に傾斜した状態で洗浄液を噴射するようにしている。   Here, in the cleaning / drying unit 38, the injection ports 56 and 58 of the left and right two-fluid mixing nozzles 50 and 52 are disposed directly above the left and right holding bodies 28 and 29, and the left and right holding bodies 28 and 29 are held during cleaning. Since the cleaning posture is such that the groove 30 is inclined outward, the cleaning liquid is jetted in a state of being inclined outward relative to the holding grooves 30 of the left and right holding bodies 28 and 29.

乾燥ユニット39は、矩形板状のユニット本体59に各保持体27,28,29を挿通する3個の開口60,61,62を左右に並べて形成するとともに、各開口60,61,62の左右側部に4個の乾燥剤噴射口63a,63b,63c,63dを上下に間隔をあけて形成し、さらには、ユニット本体59に各乾燥剤噴射口63a,63b,63c,63dに連通する連通路64を形成しており、この連通路64に窒素ガス供給源53を開閉バルブ65を介して連通連結している。これにより、乾燥ユニット39は、開閉バルブ65を開放状態とすることで、窒素ガス供給源53から供給される窒素ガスを乾燥剤として各開口60,61,62の乾燥剤噴射口63a,63b,63c,63dから各保持体27,28,29の側部に向けて噴射するようにしている。   The drying unit 39 includes three openings 60, 61, and 62 that are inserted through the holding bodies 27, 28, and 29 in a rectangular plate-shaped unit body 59, and are arranged on the left and right sides of the openings 60, 61, and 62. Four desiccant spray ports 63a, 63b, 63c, and 63d are formed on the side with a space therebetween, and the unit body 59 is connected to each desiccant spray port 63a, 63b, 63c, and 63d. A passage 64 is formed, and a nitrogen gas supply source 53 is connected to the communication passage 64 through an open / close valve 65. Thereby, the drying unit 39 opens the open / close valve 65, so that the nitrogen gas supplied from the nitrogen gas supply source 53 is used as the desiccant, and the desiccant injection ports 63a, 63b, The spray is made from 63c, 63d toward the side portions of the holding bodies 27, 28, 29.

この乾燥ユニット39では、図5に示すように、4個の乾燥剤噴射口63a,63b,63c,63dが上方側から順に乾燥時の移動方向(図2において、保持体19の基端側(右側)から先端側(左側)に移動する方向)に対して前方側に位置するように形成しており、最上部に形成した乾燥剤噴射口63aを他の乾燥剤噴射口63b,63c,63dよりも乾燥時の乾燥手段の移動方向に対して前方側に形成し、また、他の乾燥剤噴射口63b,63c,63dは、上方に形成した乾燥剤噴射口63b,63cを下方に形成した乾燥剤噴射口63c,63dよりも乾燥時の乾燥手段の移動方向に対して前方側に形成している。これにより、乾燥ユニット39は、乾燥剤噴射口63a,63b,63c,63dから各保持体27,28,29の側部に向けて上側から順に乾燥剤を噴射するようにしており、最上部に形成した乾燥剤噴射口63aから噴射する乾燥剤を他の乾燥剤噴射口63b,63c,63dから噴射する乾燥剤よりも先に各保持体27,28,29に噴射し、また、他の乾燥剤噴射口63b,63c,63dのうち上方に形成した乾燥剤噴射口63b,63cから噴射する乾燥剤を下方に形成した乾燥剤噴射口63c,63dから噴射する乾燥剤よりも先に各保持体27,28,29に噴射するようにしている。   In this drying unit 39, as shown in FIG. 5, the four desiccant injection ports 63a, 63b, 63c, 63d are moved in the direction of drying in order from the upper side (in FIG. 2, the base end side of the holder 19 ( It is formed so as to be located on the front side with respect to the direction (moving from the right side) to the tip side (left side), and the desiccant injection port 63a formed at the uppermost part is formed with the other desiccant injection ports 63b, 63c, 63d. The other desiccant spray ports 63b, 63c, 63d are formed below the desiccant spray ports 63b, 63c formed above, with respect to the moving direction of the drying means during drying. It is formed in front of the desiccant injection ports 63c and 63d with respect to the moving direction of the drying means during drying. As a result, the drying unit 39 is configured to inject the desiccant from the desiccant injection ports 63a, 63b, 63c, and 63d toward the side portions of the holding bodies 27, 28, and 29 in order from the upper side. The desiccant sprayed from the formed desiccant spray port 63a is sprayed to each holding body 27, 28, 29 before the desiccant sprayed from the other desiccant spray ports 63b, 63c, 63d, and other drying Each holding body prior to the desiccant sprayed from the desiccant spray ports 63c, 63d formed below the desiccant spray ports 63b, 63c formed above the desiccant spray ports 63b, 63c, 63d. 27, 28, 29 is injected.

このように、乾燥ユニット39では、上部側に設けた第1の乾燥剤噴射口63aの下方側で、かつ、乾燥時の乾燥手段の移動方向に対して後方側に第2の乾燥剤噴射口63dを形成するとともに、第1の乾燥剤噴射口63aと第2の乾燥剤噴射口63dの上下方向及び前後方向(乾燥時の乾燥手段の移動方向)の間に第3の乾燥剤噴射口63b,63cを形成して、第1の乾燥剤噴射口63aから各保持体27,28,29の側部に向けて乾燥剤を噴射し、その後、第3の乾燥剤噴射口63b,63cから各保持体27,28,29の側部に向けて乾燥剤を噴射し、さらにその後、第2の乾燥剤噴射口63dから各保持体27,28,29の側部に向けて乾燥剤を噴射するようにしている。これにより、乾燥ユニット39では、上部側の乾燥剤噴射口63a,63b,63cから各保持体27,28,29の上部側に噴き付けられた乾燥剤によって流下した洗浄液を、その後に下部側の乾燥剤噴射口63b,63c,63dから各保持体27,28,29の下部側に噴き付けられる乾燥剤で乾燥させることができ、各保持体27,28,29の乾燥を良好に行うことができる。   As described above, in the drying unit 39, the second desiccant spray port is provided on the lower side of the first desiccant spray port 63a provided on the upper side and on the rear side with respect to the moving direction of the drying means during drying. The third desiccant spray port 63b is formed between the first desiccant spray port 63a and the second desiccant spray port 63d in the vertical direction and the front-rear direction (the moving direction of the drying means during drying). , 63c is formed, and the desiccant is sprayed from the first desiccant spray port 63a toward the side portions of the holding bodies 27, 28, 29, and then the third desiccant spray ports 63b, 63c The desiccant is sprayed toward the side portions of the holding bodies 27, 28, and 29, and then the desiccant is sprayed toward the side portions of the holding bodies 27, 28, and 29 from the second desiccant spray port 63d. I am doing so. Thus, in the drying unit 39, the cleaning liquid that has flowed down by the desiccant sprayed from the upper desiccant injection ports 63a, 63b, 63c onto the upper sides of the holding bodies 27, 28, 29 is subsequently transferred to the lower side. It is possible to dry with the desiccant sprayed from the desiccant spray outlets 63b, 63c, 63d to the lower side of each holding body 27, 28, 29, and it is possible to dry each holding body 27, 28, 29 well it can.

カバー板40は、各保持体27,28,29を挿通する3個の開口66,67,68を形成しており、洗浄液が散乱するのを防止している。   The cover plate 40 is formed with three openings 66, 67, 68 through which the holding bodies 27, 28, 29 are inserted, and prevents the cleaning liquid from scattering.

次に、エアー噴出手段25の構成について説明すると、エアー噴出手段25は、ケーシング21の上部に配設した上部エアー噴出ユニット69と、ケーシング21の側面側の開口22の上部に配設した側部エアー噴出ユニット70と、ケーシング21の前面側の開口22の上部に配設した前部エアー噴出ユニット71とで構成し、各ユニット69,70,71にエアーを供給するエアー供給源72を開閉バルブ73を介して連通連結している。   Next, the structure of the air jetting means 25 will be described. The air jetting means 25 includes an upper air jetting unit 69 arranged at the upper part of the casing 21 and a side part arranged at the upper part of the opening 22 on the side surface side of the casing 21. An air jet unit 70 and a front air jet unit 71 disposed above the opening 22 on the front side of the casing 21, and an air supply source 72 that supplies air to each unit 69, 70, 71 is opened and closed It is connected through 73.

そして、上部エアー噴出ユニット69では、ケーシング21の内部全体に下方に向けてエアーを噴出し、ケーシング21の内部が全体的に下方に流動する雰囲気を形成して、洗浄液の散乱を防止し、また、側部エアー噴出ユニット70及び前部エアー噴出ユニット71では、ケーシング21の開口22の上部から下方に向けてエアーを噴出し、開口22にエアーカーテンを形成して、洗浄液が開口22から漏れ出るのを防止している。   In the upper air ejection unit 69, air is ejected downward to the entire interior of the casing 21, thereby forming an atmosphere in which the interior of the casing 21 generally flows downward to prevent scattering of the cleaning liquid. In the side air ejection unit 70 and the front air ejection unit 71, air is ejected downward from the upper part of the opening 22 of the casing 21, and an air curtain is formed in the opening 22 so that the cleaning liquid leaks from the opening 22. Is preventing.

洗浄装置20は、以上のように構成しており、以下のようにして保持体19の洗浄を行う。   The cleaning device 20 is configured as described above, and cleans the holding body 19 as follows.

まず、洗浄装置20は、移動手段24によって洗浄乾燥手段23をケーシング21の後端部側(図2中、左側)に移動させておき、ウエハ搬送機構14の保持体19を保持姿勢から洗浄姿勢に姿勢変更した後に、ウエハ搬送機構14の移動体26を移動させ、保持体19をケーシング21の内部に収容する。   First, the cleaning device 20 moves the cleaning / drying means 23 to the rear end side (left side in FIG. 2) of the casing 21 by the moving means 24, and the holding body 19 of the wafer transfer mechanism 14 is cleaned from the holding position. After the posture is changed, the moving body 26 of the wafer transfer mechanism 14 is moved, and the holding body 19 is accommodated in the casing 21.

次に、洗浄装置20は、エアー噴出手段25によって上部エアー噴出ユニット69、側部エアー噴出ユニット70、前部エアー噴出ユニット71からエアーを噴出し、移動手段24によって洗浄乾燥手段23をケーシング21の後端部側から前端部側(図2において、保持体19の先端側(左側)から基端側(右側))に移動させるとともに、開閉バルブ48を開放状態とすることで、純水供給源47から供給される純水を洗浄液として洗浄ユニット37の各開口42,43,44の洗浄液噴射口45a,45b,45cから各保持体27,28,29の側部に向けて噴射し、開閉バルブ54,55を開放状態とすることで、純水供給源47から供給される純水と窒素ガス供給源53から供給される窒素ガスとを洗浄乾燥ユニット38の各2流体混合ノズル50,51,52で混合し、混合流体を洗浄液として各2流体混合ノズル50,51,52の噴射口56,57,58から各保持体27,28,29の上部に向けて噴射する。   Next, the cleaning device 20 ejects air from the upper air ejection unit 69, the side air ejection unit 70, and the front air ejection unit 71 by the air ejection means 25, and the cleaning and drying means 23 is removed from the casing 21 by the moving means 24. By moving from the rear end side to the front end side (in FIG. 2, from the front end side (left side) to the base end side (right side) of the holding body 19, the open / close valve 48 is opened, thereby providing a pure water supply source. The pure water supplied from 47 is sprayed from the cleaning liquid injection ports 45a, 45b, 45c of the openings 42, 43, 44 of the cleaning unit 37 toward the side portions of the holding bodies 27, 28, 29 as a cleaning liquid, and the open / close valve By opening 54 and 55, the pure water supplied from the pure water supply source 47 and the nitrogen gas supplied from the nitrogen gas supply source 53 are mixed into the two-fluid mixing nozzles 50, 51, 52 is mixed, and the mixed fluid is used as a cleaning liquid. Injected from 6,57,58 toward the upper portions of the holding bodies 27,28,29.

このときに、洗浄乾燥ユニット38では、左右の2流体混合ノズル50,52の噴射口56,58から洗浄液を左右保持体28,29の保持溝30に対して相対的に外側に傾斜した状態で噴射するようにしている。そのため、洗浄液が傾斜した保持溝30に沿って円滑に流下することになり、洗浄液とともに汚染物を良好に流下させることができ、左右保持体28,29の洗浄を良好に行うことができる。   At this time, in the cleaning / drying unit 38, the cleaning liquid is inclined relative to the holding grooves 30 of the left and right holders 28 and 29 from the ejection ports 56 and 58 of the left and right two-fluid mixing nozzles 50 and 52. I try to spray. Therefore, the cleaning liquid flows down smoothly along the inclined holding grooves 30, the contaminants can flow down together with the cleaning liquid, and the left and right holding bodies 28, 29 can be cleaned well.

このように、洗浄乾燥ユニット38では、保持体19を洗浄する保持体洗浄機構としての洗浄装置20において、ウエハ2を左右保持体28,29で保持する保持姿勢(左右保持体28,29の使用時における使用姿勢)と、ウエハ2を保持する左右保持体28,29の保持面(保持溝30)を洗浄液噴射口(噴射口56,58)に対して傾斜させた洗浄姿勢(左右保持体28,29の使用時での使用面(保持溝30)を洗浄液噴射口(噴射口56,58)に対して傾斜させた洗浄姿勢)とに姿勢変更できるようにしているため、左右の2流体混合ノズル50,52の噴射口56,58から洗浄液を左右保持体28,29の保持溝30に対して相対的に外側に傾斜した状態で噴射することになり、洗浄液が傾斜した保持溝30に沿って円滑に流下することになるので、洗浄液とともに汚染物を良好に流下させることができ、左右保持体28,29の洗浄を良好に行うことができる。特に、洗浄乾燥ユニット38では、保持姿勢(使用姿勢)における左右保持体28,29の間隔よりも洗浄姿勢における左右保持体28,29の間隔のほうが狭くなるように姿勢変更するようにして、洗浄姿勢が保持姿勢(使用姿勢)よりも小型化するようにしているため、洗浄装置20を小型化することができる。   As described above, in the cleaning / drying unit 38, in the cleaning device 20 as the holder cleaning mechanism for cleaning the holder 19, the holding posture for holding the wafer 2 by the left and right holders 28 and 29 (use of the left and right holders 28 and 29). Use posture) and a cleaning posture (left and right holding body 28) in which the holding surfaces (holding grooves 30) of the left and right holding bodies 28 and 29 holding the wafer 2 are inclined with respect to the cleaning liquid injection ports (injection ports 56 and 58). , 29, the use surface (holding groove 30) can be changed to the cleaning liquid injection port (cleaning posture inclined with respect to the cleaning liquid injection port 56, 58), so that the left and right two fluids can be mixed. The cleaning liquid is sprayed from the injection ports 56 and 58 of the nozzles 50 and 52 in a state inclined relative to the holding grooves 30 of the left and right holding bodies 28 and 29, and the cleaning liquid is along the inclined holding grooves 30. Therefore, the contaminants can flow well together with the cleaning liquid. The cleaning of the bearing member 28, 29 can be performed well. In particular, in the cleaning / drying unit 38, the posture is changed so that the interval between the left and right holding bodies 28 and 29 in the cleaning posture is narrower than the interval between the left and right holding bodies 28 and 29 in the holding posture (use posture). Since the posture is made smaller than the holding posture (use posture), the cleaning device 20 can be miniaturized.

その後、洗浄装置20は、移動手段24によって洗浄乾燥手段23をケーシング21の前端部側(図2において、保持体19の基端側(右側))まで移動させた後に停止させ、開閉バルブ48,54,55を閉塞状態とすることで、洗浄液の噴射を停止する。   After that, the cleaning device 20 moves the cleaning / drying means 23 to the front end side of the casing 21 (in FIG. 2, the base end side (right side) in FIG. 2) by the moving means 24, and then stops the cleaning / drying means 23. By bringing 54 and 55 into a closed state, the spraying of the cleaning liquid is stopped.

次に、洗浄装置20は、移動手段24によって洗浄乾燥手段23をケーシング21の前端部側から後端部側(図2において、保持体19の基端側(右側)から先端側(左側))に移動させるとともに、純水側の開閉バルブ54を閉塞状態とするとともに窒素ガス側の開閉バルブ55だけを開放状態とすることで、窒素ガス供給源53から供給される窒素ガスを乾燥剤として洗浄乾燥ユニット38の各2流体混合ノズル50,51,52の噴射口56,57,58から各保持体27,28,29の上部に向けて噴射し、開閉バルブ65を開放状態とすることで、窒素ガス供給源53から供給される窒素ガスを乾燥剤として乾燥ユニット39の各開口60,61,62の乾燥剤噴射口63a,63b,63c,63dから各保持体27,28,29の側部に向けて噴射する。   Next, the cleaning device 20 moves the cleaning / drying means 23 from the front end side to the rear end side of the casing 21 by the moving means 24 (from the base end side (right side) to the front end side (left side) in FIG. 2). The pure water side open / close valve 54 is closed and only the nitrogen gas side open / close valve 55 is opened, so that the nitrogen gas supplied from the nitrogen gas supply source 53 is washed as a desiccant. By spraying from the spray ports 56, 57, 58 of the two-fluid mixing nozzles 50, 51, 52 of the drying unit 38 toward the upper portions of the holding bodies 27, 28, 29, and opening the open / close valve 65, Using the nitrogen gas supplied from the nitrogen gas supply source 53 as a desiccant, the side portions of the holding bodies 27, 28, 29 from the desiccant injection ports 63a, 63b, 63c, 63d of the openings 60, 61, 62 of the drying unit 39 Inject toward

このときに、乾燥ユニット39では、4個の乾燥剤噴射口63a,63b,63c,63dが上方側から順に乾燥時の移動方向(図2において、保持体19の基端側(右側)から先端側(左側)に移動する方向)に対して前方側に位置するように形成しており、乾燥剤噴射口63a,63b,63c,63dから各保持体27,28,29の側部に向けて上側から順に乾燥剤を噴射するようにしている。そのため、各保持体27,28,29の上部側に噴き付けられた乾燥剤によって流下した洗浄液をその後に各保持体27,28,29の下部側に噴き付けられる乾燥剤で乾燥させることができ、各保持体27,28,29の乾燥を良好に行うことができる。   At this time, in the drying unit 39, the four desiccant injection ports 63a, 63b, 63c, 63d are sequentially moved from the upper side in the direction of movement during drying (in FIG. 2, from the proximal end side (right side) of the holder 19 to the distal end. It is formed so as to be located on the front side with respect to the side (the direction of movement to the left side), from the desiccant injection ports 63a, 63b, 63c, 63d toward the side portions of the respective holding bodies 27, 28, 29 The desiccant is sprayed in order from the upper side. Therefore, the cleaning liquid that has flowed down by the desiccant sprayed on the upper side of each holding body 27, 28, 29 can be dried with the desiccant sprayed on the lower side of each holding body 27, 28, 29. In addition, the holders 27, 28, and 29 can be satisfactorily dried.

このように、乾燥ユニット39では、最上部に形成した乾燥剤噴射口63aを他の乾燥剤噴射口63b,63c,63dよりも乾燥時の乾燥手段の移動方向に対して前方側に形成して、最上部に形成した乾燥剤噴射口63aから噴射する乾燥剤を他の乾燥剤噴射口63b,63c,63dから噴射する乾燥剤よりも先に保持体19に噴射するようにしているため、最上部の乾燥剤噴射口63aから保持体19の上部側に噴き付けられた乾燥剤によって流下した洗浄液をその後に他の乾燥剤噴射口63b,63c,63dから保持体19の下部側に噴き付けられる乾燥剤で乾燥させることができ、保持体19の乾燥を良好に行うことができる。特に、乾燥ユニット39では、他の乾燥剤噴射口63b,63c,63dも、上方に形成した乾燥剤噴射口63b,63cを下方に形成した乾燥剤噴射口63c,63dよりも乾燥時の乾燥手段の移動方向に対して前方側に形成して、他の乾燥剤噴射口63b,63c,63dのうち上方に形成した乾燥剤噴射口63b,63cから噴射する乾燥剤を下方に形成した乾燥剤噴射口63c,63dから噴射する乾燥剤よりも先に保持体19に噴射するようにしているため、これによっても、上部側の乾燥剤噴射口63b,63cから保持体19の上部側に噴き付けられた乾燥剤によって流下した洗浄液をその後に下部側の乾燥剤噴射口63c,63dから保持体19の下部側に噴き付けられる乾燥剤で乾燥させることができ、保持体19の乾燥を良好に行うことができる。   Thus, in the drying unit 39, the desiccant injection port 63a formed at the top is formed on the front side with respect to the moving direction of the drying means at the time of drying than the other desiccant injection ports 63b, 63c, 63d. The desiccant sprayed from the desiccant spray port 63a formed at the top is sprayed onto the holding body 19 before the desiccant sprayed from the other desiccant spray ports 63b, 63c, 63d. The cleaning liquid flown down by the desiccant sprayed from the upper desiccant spray port 63a to the upper side of the holding body 19 is then sprayed from the other desiccant spray ports 63b, 63c, 63d to the lower side of the holding body 19 It can be dried with a desiccant, and the holder 19 can be satisfactorily dried. In particular, in the drying unit 39, the other desiccant spray ports 63b, 63c, 63d are also drying means at the time of drying than the desiccant spray ports 63c, 63d formed below the desiccant spray ports 63b, 63c formed above. The desiccant spray formed below the desiccant spray port 63b, 63c formed above the other desiccant spray ports 63b, 63c, 63d. Since the desiccant sprayed from the ports 63c and 63d is sprayed to the holding body 19 before this, it is sprayed from the desiccant spray ports 63b and 63c on the upper side to the upper side of the holding body 19 as well. The cleaning liquid flowing down by the desiccant can be dried with the desiccant sprayed from the lower desiccant spray ports 63c, 63d to the lower side of the holding body 19, and the holding body 19 can be dried well. Can do.

その後、洗浄装置20は、移動手段24によって洗浄乾燥手段23をケーシング21の後端部側(図2において、保持体19の先端側(左側))まで移動させた後に停止させ、開閉バルブ55,65を閉塞状態とすることで、乾燥剤の噴射を停止し、また、エアー噴出手段25によって上部エアー噴出ユニット69、側部エアー噴出ユニット70、前部エアー噴出ユニット71からエアーの噴出を停止する。   Thereafter, the cleaning device 20 moves the cleaning / drying means 23 to the rear end side of the casing 21 (in FIG. 2, the front end side (left side) of the holding body 19 in FIG. By making 65 a closed state, the spray of the desiccant is stopped, and the air jetting means 25 stops the jet of air from the upper air jet unit 69, the side air jet unit 70, and the front air jet unit 71. .

以上に説明したように、洗浄装置20は、洗浄乾燥手段23を移動手段24によって保持体19に沿って往復移動し、往動時(図2において、保持体19の先端側(左側)から基端側(右側)に移動する時)に洗浄ユニット37と洗浄乾燥ユニット38から保持体19に向けて洗浄液を噴射して保持体19の洗浄を行い、復動時(図2において、保持体19の基端側(右側)から先端側(左側)に移動する時)に洗浄乾燥ユニット38と乾燥ユニット39から保持体19に向けて乾燥剤を噴射して洗浄後の乾燥を行って、一連の洗浄動作を完結するようにしている。これにより、洗浄装置20では、洗浄ユニット37と洗浄乾燥ユニット38とが協働して洗浄手段として機能し、また、洗浄乾燥ユニット38と乾燥ユニット39とが協働して乾燥手段として機能する。   As described above, the cleaning device 20 moves the cleaning / drying means 23 back and forth along the holding body 19 by the moving means 24 and moves forward (from the front end side (left side) of the holding body 19 in FIG. The cleaning liquid is sprayed from the cleaning unit 37 and the cleaning / drying unit 38 toward the holding body 19 when moving to the end side (right side), and the holding body 19 is cleaned. A series of a drying agent is sprayed from the cleaning / drying unit 38 and the drying unit 39 toward the holding body 19 when the base end side (right side) is moved from the base end side (right side) to the support body 19 to perform drying after cleaning. The cleaning operation is completed. Thus, in the cleaning apparatus 20, the cleaning unit 37 and the cleaning / drying unit 38 cooperate to function as a cleaning unit, and the cleaning / drying unit 38 and the drying unit 39 cooperate to function as a drying unit.

そして、上記基板処理装置1では、第1の乾燥剤噴射口63aの下方側で、かつ、乾燥時の乾燥手段の移動方向に対して後方側に第2の乾燥剤噴射口63dを形成している。   In the substrate processing apparatus 1, a second desiccant spray port 63d is formed below the first desiccant spray port 63a and on the rear side with respect to the moving direction of the drying means during drying. Yes.

そのため、上記構成の基板処理装置1では、第1の乾燥剤噴射口63aから各保持体27,28,29の側部に向けて乾燥剤を噴射し、その後、第2の乾燥剤噴射口63dから各保持体27,28,29の側部に向けて乾燥剤を噴射することになり、上部側の第1の乾燥剤噴射口63aから各保持体27,28,29の上部側に噴き付けられた乾燥剤によって流下した洗浄液を、その後に下部側の第2の乾燥剤噴射口63dから各保持体27,28,29の下部側に噴き付けられる乾燥剤で乾燥させることができ、各保持体27,28,29の乾燥を良好に行うことができる。   Therefore, in the substrate processing apparatus 1 configured as described above, the desiccant is sprayed from the first desiccant spray port 63a toward the side portions of the holding bodies 27, 28, 29, and then the second desiccant spray port 63d. From the first desiccant jet port 63a on the upper side and sprayed on the upper side of each holding body 27, 28, 29. The cleaning liquid flowing down by the desiccant thus dried can be dried with the desiccant sprayed from the lower second desiccant spray port 63d to the lower side of each holding body 27, 28, 29, and each holding The bodies 27, 28 and 29 can be satisfactorily dried.

特に、上記基板処理装置1では、上部側に設けた第1の乾燥剤噴射口63aの下方側で、かつ、乾燥時の乾燥手段の移動方向に対して後方側に第2の乾燥剤噴射口63dを形成するとともに、第1の乾燥剤噴射口63aと第2の乾燥剤噴射口63dの上下方向及び前後方向(乾燥時の乾燥手段の移動方向)の間に第3の乾燥剤噴射口63b,63cを形成しているために、第1の乾燥剤噴射口63aから各保持体27,28,29の側部に向けて乾燥剤を噴射し、その後、第3の乾燥剤噴射口63b,63cから各保持体27,28,29の側部に向けて乾燥剤を噴射し、さらにその後、第2の乾燥剤噴射口63dから各保持体27,28,29の側部に向けて乾燥剤を噴射することになり、上部側の乾燥剤噴射口63a,63b,63cから各保持体27,28,29の上部側に噴き付けられた乾燥剤によって流下した洗浄液を、その後に下部側の乾燥剤噴射口63b,63c,63dから各保持体27,28,29の下部側に噴き付けられる乾燥剤で乾燥させることができ、各保持体27,28,29の乾燥を良好に行うことができる。   In particular, in the substrate processing apparatus 1, the second desiccant spray port is provided on the lower side of the first desiccant spray port 63 a provided on the upper side and on the rear side with respect to the moving direction of the drying means during drying. The third desiccant spray port 63b is formed between the first desiccant spray port 63a and the second desiccant spray port 63d in the vertical direction and the front-rear direction (the moving direction of the drying means during drying). 63c, the desiccant is jetted from the first desiccant jet port 63a toward the sides of the holding bodies 27, 28, 29, and then the third desiccant jet port 63b, The desiccant is sprayed from 63c toward the side portions of the holding bodies 27, 28, 29, and then the desiccant is directed from the second desiccant spray port 63d toward the side portions of the holding bodies 27, 28, 29. The cleaning liquid that has flowed down by the desiccant sprayed from the upper desiccant spray ports 63a, 63b, and 63c onto the upper sides of the holding bodies 27, 28, and 29, and then the lower desiccant Can be dried with a desiccant sprayed to the lower side of each holding body 27, 28, 29 from the agent injection port 63b, 63c, 63d, and each holding body 27, 28, 29 can be satisfactorily dried. .

基板処理装置を示す平面図。The top view which shows a substrate processing apparatus. 洗浄装置を示す側面模式図。The side surface schematic diagram which shows a washing | cleaning apparatus. ウエハ搬送機構を示す側面図(a)及び背面図(b)。The side view (a) and back view (b) which show a wafer conveyance mechanism. 洗浄乾燥手段を示す側面図(a)及び背面図(b)。The side view (a) and back view (b) which show a washing-drying means. 同断面図Sectional view 洗浄ユニットを示す側面断面図。Side surface sectional drawing which shows a washing | cleaning unit. 洗浄乾燥ユニットを示す側面断面図。Side surface sectional drawing which shows a washing-drying unit. 乾燥ユニットを示す側面断面図。Side surface sectional drawing which shows a drying unit.

符号の説明Explanation of symbols

1 基板処理装置 2 ウエハ
3 キャリア 4 キャリア搬入出部
5 ウエハ搬入出部 6 ウエハ処理部
7 キャリアステージ 8 開閉扉
9 キャリア搬送機構 10 キャリアストック
11 キャリア載置台 12 開閉扉
13 ウエハ搬入出機構 14 ウエハ搬送機構
15〜17 第1〜第3のウエハ洗浄装置 18 ウエハ洗浄乾燥装置
19 保持体 20 洗浄装置
21 ケーシング 22 開口
23 洗浄乾燥手段 24 移動手段
25 エアー噴出手段 26 移動体
27 下部保持体 28,29左右保持体
30 保持溝 31 固定軸
32 固定アーム 33,34 回動軸
35,36 回動アーム 37 洗浄ユニット
38 洗浄乾燥ユニット 39 乾燥ユニット
40 カバー板 41 ユニット本体
42,43,44 開口 45a,45b,45c 洗浄液噴射口
46 連通路 47 純水供給源
48 開閉バルブ 49 ユニット本体
50,51,52 2流体混合ノズル 53 窒素ガス供給源
54,55 開閉バルブ 56,57,58 噴射口
59 ユニット本体 60,61,62 開口
63a,63b,63c,63d 乾燥剤噴射口 64 連通路
65 開閉バルブ 66,67,68 開口
69 上部エアー噴出ユニット 70 側部エアー噴出ユニット
71 前部エアー噴出ユニット 72 エアー供給源
73 開閉バルブ
DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Wafer 3 Carrier 4 Carrier carrying in / out part 5 Wafer carrying in / out part 6 Wafer processing part 7 Carrier stage 8 Opening / closing door 9 Carrier transport mechanism 10 Carrier stock
11 Carrier mounting table 12 Open / close door
13 Wafer transfer mechanism 14 Wafer transfer mechanism
15 to 17 First to third wafer cleaning apparatuses 18 Wafer cleaning and drying apparatus
19 Holder 20 Cleaning device
21 Casing 22 Opening
23 Cleaning and drying means 24 Moving means
25 Air ejection means 26 Moving object
27 Lower holder 28, 29 Left and right holder
30 Holding groove 31 Fixed shaft
32 Fixed arm 33, 34 Rotating shaft
35, 36 Rotating arm 37 Cleaning unit
38 Cleaning and drying unit 39 Drying unit
40 Cover plate 41 Unit body
42,43,44 Opening 45a, 45b, 45c Cleaning liquid injection port
46 Communication passage 47 Pure water supply source
48 Open / close valve 49 Unit body
50,51,52 Two-fluid mixing nozzle 53 Nitrogen gas supply source
54,55 Open / close valve 56,57,58 Injection port
59 Unit body 60, 61, 62 Opening
63a, 63b, 63c, 63d Desiccant injection port 64 communication path
65 Opening / closing valve 66, 67, 68 Opening
69 Upper air ejection unit 70 Side air ejection unit
71 Front air jet unit 72 Air supply source
73 Open / close valve

Claims (4)

洗浄後の被洗浄体に向けて乾燥剤を噴射して被洗浄体を乾燥させる乾燥手段と、
前記乾燥手段を被洗浄体に沿って移動させる移動手段と、
前記乾燥手段に設けた第1の乾燥剤噴射口と、
前記第1の乾燥剤噴射口よりも下方側で、かつ、乾燥時の移動方向に対して後方側に設けた第2の乾燥剤噴射口と、
を有することを特徴とする洗浄装置。
Drying means for drying the object to be cleaned by spraying a desiccant toward the object to be cleaned after cleaning;
Moving means for moving the drying means along the object to be cleaned;
A first desiccant spray port provided in the drying means;
A second desiccant spray port provided below the first desiccant spray port and on the rear side with respect to the moving direction during drying;
A cleaning apparatus comprising:
前記第1の乾燥剤噴射口と第2の乾燥剤噴射口の上下方向及び前後方向の間に第3の乾燥剤噴射口を形成したことを特徴とする請求項1に記載の洗浄装置。   The cleaning device according to claim 1, wherein a third desiccant spray port is formed between the first desiccant spray port and the second desiccant spray port in the vertical direction and the front-rear direction. 被洗浄体を洗浄した後に、被洗浄体に向けて乾燥剤を噴射する乾燥手段を被洗浄体に沿って移動させて被洗浄体の乾燥を行う洗浄方法において、
前記乾燥手段に設けた第1の乾燥剤噴射口と、前記第1の乾燥剤噴射口よりも下方側で、かつ、乾燥時の移動方向に対して後方側に設けた第2の乾燥剤噴射口から被洗浄体に向けて乾燥剤を噴射することを特徴とする洗浄方法。
In the cleaning method for drying the object to be cleaned by moving the drying means for spraying the desiccant toward the object to be cleaned along the object to be cleaned after cleaning the object to be cleaned,
A first desiccant spray port provided in the drying means, and a second desiccant spray provided below the first desiccant spray port and on the rear side with respect to the moving direction during drying. A cleaning method, wherein a desiccant is sprayed from a mouth toward an object to be cleaned.
前記第1の乾燥剤噴射口と第2の乾燥剤噴射口の上下方向及び前後方向の間に形成した第3の乾燥剤噴射口から被洗浄体に向けて乾燥剤を噴射することを特徴とする請求項3に記載の洗浄方法。   A desiccant is sprayed from the third desiccant spray port formed between the first desiccant spray port and the second desiccant spray port in the vertical direction and the front-rear direction toward the object to be cleaned. The cleaning method according to claim 3.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014022461A (en) * 2012-07-13 2014-02-03 Tokyo Electron Ltd Cleaning apparatus, cleaning method and storage medium

Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH0244522Y2 (en) * 1986-12-29 1990-11-27
JP2002110591A (en) * 2000-09-27 2002-04-12 Takata Corp Apparatus and method of cleaning wafers after wire saw
JP2003161578A (en) * 2001-11-27 2003-06-06 Alps Electric Co Ltd Substrate dryer and substrate drying method using the same
JP2006026609A (en) * 2004-07-21 2006-02-02 Tokyo Electron Ltd Cleaning treatment method and apparatus therefor

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH0244522Y2 (en) * 1986-12-29 1990-11-27
JP2002110591A (en) * 2000-09-27 2002-04-12 Takata Corp Apparatus and method of cleaning wafers after wire saw
JP2003161578A (en) * 2001-11-27 2003-06-06 Alps Electric Co Ltd Substrate dryer and substrate drying method using the same
JP2006026609A (en) * 2004-07-21 2006-02-02 Tokyo Electron Ltd Cleaning treatment method and apparatus therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014022461A (en) * 2012-07-13 2014-02-03 Tokyo Electron Ltd Cleaning apparatus, cleaning method and storage medium

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