JP2014022461A - Cleaning apparatus, cleaning method and storage medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning apparatus in which a cleaning solution on a holding body can be prevented from scattering from the opening of cleaning/drying means to the outside.SOLUTION: A cleaning apparatus 50 includes cleaning/drying means 60 movable for a holding body 40. The cleaning/drying means 60 includes a cleaning mechanism 63 discharging a cleaning solution to the holding body 40, a first gas jet mechanism 70 provided between the cleaning mechanism 63 and an opening 61b in a cover 62, and jetting a first gas to the holding body 40, and a second gas jet mechanism 80 provided between the first gas jet mechanism 70 and the opening 61b in the cover 62, and jetting a second gas to the holding body 40. The second gas jet mechanism 80 is provided at a position facing a holding groove 41 of the holding body 40, and has a slit 83 for jetting the second gas to the holding groove 41. The second gas is jetted from the slit 83 toward the opposite side of the opening 61b.

Description

  The present invention relates to a cleaning apparatus, a cleaning method, and a storage medium.

  2. Description of the Related Art Conventionally, for example, in a substrate processing apparatus that performs a semiconductor wafer cleaning process, a transfer mechanism for transferring a plurality of semiconductor wafers is provided. This transport mechanism has a holding body having a holding groove for holding a plurality of semiconductor wafers. The substrate processing apparatus is provided with a cleaning device for cleaning contaminants attached to the holder.

  This cleaning apparatus includes a cleaning / drying unit in which a cleaning unit that ejects a cleaning liquid toward a holder as a body to be cleaned and a drying unit that ejects a dry gas toward the holder are integrated. The washing / drying means is configured to be capable of reciprocating along the holding body.

  In such a cleaning apparatus, the cleaning liquid is ejected from the cleaning liquid jet port of the cleaning means toward the holding body when the cleaning and drying means is moved forward, and then the holding body is cleaned. The drying operation of the holding body is performed by ejecting a drying gas from the drying gas jet port of the means toward the holding body (Patent Document 1).

Japanese Patent No. 4497407

  However, in the conventional cleaning mechanism, since the cleaning liquid ejected from the cleaning liquid ejection port remains as a droplet in the holding body (for example, in the holding groove), the cleaning liquid on the holding body is dried gas ejected from the drying gas ejection port. In this case, the cleaning liquid may be scattered to the outside from the opening of the cleaning mechanism. In particular, when the scattered cleaning liquid adheres to the drive unit of the holding body, when the transport mechanism moves, there is a possibility that the droplets of the cleaning liquid fall into the transport area.

  The present invention has been made in consideration of such points, and a cleaning device, a cleaning method, and a memory capable of preventing the cleaning liquid on the holding body from splashing outside through the opening of the cleaning / drying means. Provide media.

  A cleaning apparatus according to an embodiment of the present invention is a cleaning apparatus that is attached to a movable body, holds a wafer, and cleans a holding body in which a plurality of holding grooves are formed along a longitudinal direction. A cleaning / drying unit movable relative to the holding body along a direction, the cleaning / drying unit being provided in the cover, including a cover including an opening through which the holding body passes from the moving body side; A cleaning mechanism that discharges cleaning liquid to the holding body; and a first mechanism that is provided in the cover and between the cleaning mechanism and the opening, and ejects a first gas to the holding body. A gas ejection mechanism, and a second gas ejection mechanism that is provided in the cover and between the first gas ejection mechanism and the opening, and that ejects a second gas to the holding body. And the second gas ejection mechanism A slit portion, which is a slit-shaped outlet, is provided at least in a position facing the holding groove of the holding body, and jets the second gas to the holding groove of the holding body, The direction in which the second gas is ejected from the slit portion is directed to the opposite side of the opening.

  A cleaning method according to an embodiment of the present invention is a cleaning method for cleaning a holding body that is attached to a movable body and holds a wafer and has a plurality of holding grooves formed along a longitudinal direction. A step of moving the cleaning and drying means having a cover including an opening through which the body passes from the moving body side relative to the holding body along the longitudinal direction; and the cover while moving the cleaning and drying means And a first gas jetting between the cleaning mechanism and the opening in the cover while moving the cleaning / drying means while discharging the cleaning liquid from the cleaning mechanism to the holder. A step of ejecting a first gas from the mechanism to the holder, and a second gas ejection mechanism to the holder within the cover and between the first gas ejection mechanism and the opening. for A step of ejecting the second gas, and in the step of ejecting the second gas, the slit is a slit-shaped ejection port provided at least at a position facing the holding groove of the holding body, The second gas is ejected to the holding groove of the holding body, and the direction in which the second gas is jetted from the slit portion is directed to the opposite side of the opening.

  A storage medium according to an embodiment of the present invention is attached to a movable body to hold a wafer and to perform a cleaning method for cleaning a holder formed with a plurality of holding grooves along the longitudinal direction. In the storage medium storing the computer program, the cleaning method may include cleaning and drying means having a cover including an opening through which the holding body passes from the movable body side relative to the holding body along the longitudinal direction. Moving the cleaning and drying means while discharging the cleaning liquid from the cleaning mechanism to the holder, and moving the cleaning and drying means within the cover. A step of ejecting a first gas from the first gas ejection mechanism to the holding body between the cleaning mechanism and the opening; and in the cover, the first gas A step of ejecting a second gas from the second gas ejection mechanism to the holding body between the gas ejection mechanism and the opening, and in the step of ejecting the second gas, at least the holding The second gas is ejected from the slit portion to the holding groove of the holding body by a slit portion which is provided at a position facing the holding groove of the body and is a slit-shaped outlet. The gas is ejected in a direction directed to the opposite side of the opening.

  According to the present invention, it is possible to prevent the cleaning liquid on the holding body from splashing outside through the opening of the cleaning and drying means.

FIG. 1 is a plan view showing a substrate processing apparatus. FIG. 2 is a schematic side view showing a cleaning apparatus according to an embodiment of the present invention. 3A and 3B are a partially enlarged side view and a front view, respectively, showing a wafer transfer mechanism. FIG. 4 is a sectional view showing a cleaning / drying unit of the cleaning apparatus according to the embodiment of the present invention. FIG. 5 is a partially enlarged cross-sectional view of FIG. FIG. 6 is a perspective view showing a second gas ejection mechanism. FIG. 7 is a sectional view showing a second gas ejection mechanism (sectional view taken along line VII-VII in FIG. 6). FIG. 8 is a front view showing the second gas ejection mechanism (viewed in the direction of arrow VIII in FIG. 6). 9A to 9C are plan views showing various modifications of the slit portion.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  First, the overall configuration of the substrate processing apparatus including the cleaning apparatus according to the present embodiment will be described. Specifically, a substrate processing apparatus that performs a cleaning process and a drying process on a semiconductor wafer (substrate) will be described as an example.

  As shown in FIG. 1, the substrate processing apparatus 10 includes a carrier loading / unloading unit 12 that loads and unloads a carrier 11 that houses a plurality of semiconductor wafers (hereinafter referred to as “wafer W”), and a carrier 11 that houses the carrier 11. A wafer loading / unloading unit 13 for loading and unloading the wafer W, and a wafer processing unit 14 for cleaning and drying the wafer W are provided.

  Among these, the carrier loading / unloading section 12 is provided with a carrier stage 15 on which the carrier 11 is placed. The carrier stage 15 is formed with a hermetic door 16. A carrier transport mechanism 17, a carrier stock 18, and a carrier mounting table 19 are disposed inside the opening / closing door 16.

  In the carrier carry-in / out unit 12, the carrier 11 placed on the carrier stage 15 by the carrier carrying mechanism 17 is carried into the carrier placing table 19. The carrier 11 is temporarily stored in the carrier stock 18 by the carrier transport mechanism 17 as necessary.

  Further, in the carrier loading / unloading unit 12, the carrier 11 containing the wafer W that has been processed by the wafer processing unit 14 is mounted on the carrier mounting table 19, contrary to the time of loading. The carrier 11 is transported to the carrier stage 15 by the carrier transport mechanism 17. Also in this case, the carrier 11 is temporarily stored in the carrier stock 18 by the carrier transport mechanism 17 as necessary.

  The wafer carry-in / carry-out unit 13 has a sealed opening / closing door 20 formed on the carrier carry-in / carry-out unit 12 side. Inside this open / close door 20, a wafer loading / unloading mechanism 21 and a starting end portion of the wafer transfer mechanism 30 are disposed.

  In the wafer loading / unloading unit 13, the wafer W accommodated in the carrier 11 on the carrier mounting table 19 of the carrier loading / unloading unit 12 is loaded into the wafer conveyance mechanism 30 by the wafer loading / unloading mechanism 21. Further, the wafer W is transferred to the wafer processing unit 14 by the wafer transfer mechanism 30. The wafer transfer mechanism 30 includes a holding body 40 that holds the wafer W and is linearly movable along the rail 31.

  On the other hand, the wafer W that has been processed by the wafer processing unit 14 is transferred from the wafer processing unit 14 to the wafer loading / unloading mechanism 21 by the wafer transfer mechanism 30. Further, the wafer W is unloaded from the wafer transfer mechanism 30 to the carrier 11 on the carrier mounting table 19 of the carrier load / unload unit 12 by the wafer load / unload mechanism 21.

  The wafer processing unit 14 includes first to third wafer cleaning devices 22, 23, and 24 that perform cleaning processing on the wafer W, a wafer cleaning and drying device 25 that performs cleaning processing and drying processing on the wafer W, and a wafer transfer mechanism 30. A cleaning apparatus 50 for cleaning the holding body 40 is disposed side by side, and a wafer transfer mechanism 30 is disposed along these apparatuses 22, 23, 24, 25, 50.

  In the wafer processing unit 14, the wafer transfer mechanism 30 transfers the wafer W from the wafer loading / unloading unit 13 to the first to third wafer cleaning devices 22, 23, 24 and the wafer cleaning / drying device 25. A cleaning process and a drying process are performed, and then the processed wafer W is transferred again to the wafer loading / unloading unit 13 by the wafer transfer mechanism 30.

  In the wafer processing unit 14, the holder 40 of the wafer transport mechanism 30 is cleaned by the cleaning device 50 so that contaminants attached to the holder 40 are not transferred to the wafer W.

  As shown in FIG. 2, the cleaning device 50 is formed on the front side (left side of FIG. 2) of the wafer transfer mechanism 30, and on the side and front surfaces of the casing 51. It has a casing opening 52 through which the holding body 40 is inserted. The holding body 40 is accommodated in the casing 51 through the casing opening 52.

  The cleaning device 50 also has a cleaning / drying means 60 movable along the holding body 40 accommodated in the casing 51, a moving means 53 for moving the cleaning / drying means 60, and air is jetted into the casing 51. And air jetting means 54.

  Below, the structure of the wafer conveyance mechanism 30, the washing | cleaning drying means 60, and the air ejection means 54 is demonstrated.

  First, the configuration of the wafer transfer mechanism 30 will be described. As shown in FIGS. 2 and 3A and 3B, the wafer transfer mechanism 30 is a movable body that can move along the first to third wafer cleaning devices 22, 23, and 24 and the wafer cleaning and drying device 25. (Driver) 32 is provided. The moving body 32 is connected to the holding body 40 described above.

  As shown in FIG. 3B, the holding body 40 includes a lower holding body 40A that holds the lower part of the wafer W, and a pair of left and right holding bodies 40B and 40C that hold the left and right side parts of the wafer W. Yes. On one surface (upper surface) of each of the holding bodies 40A, 40B, 40C, a plurality of holding grooves 41 for holding the wafers W one by one are formed side by side along the longitudinal direction (Y-axis direction). In addition, the side shape of each holding groove 41 may be V-shaped, or may be Y-shaped, U-shaped, or recessed (U-shaped).

  The lower holding body 40A is attached to a fixed shaft 42A protruding from the center of the moving body 32 via a fixed arm 43A. Furthermore, the left and right holding bodies 40B and 40C are attached to the rotation shafts 42B and 42C protruding from the left and right sides of the moving body 32 via the rotation arms 43B and 43C.

  In this case, the lower holding body 40A is fixed to the moving body 32, and the left and right holding bodies 40B and 40C are rotatably attached to the moving body 32. Then, when holding the wafer W, the left and right holders 40B and 40C are driven to rotate left and right by rotating arms 43B and 43C as shown in FIG. 3B by rotationally driving the rotating shafts 42B and 42C. You can jump up. As a result, the holding grooves 41 of the left and right holding bodies 40B and 40C are directed inward to hold the wafer W in the holding posture (in the state shown by the two-dot chain line in FIG. 3B). On the other hand, at the time of cleaning, the rotating shafts 42B and 42C are rotationally driven to suspend the rotating arms 43B and 43C downward and the holding groove 41 is inclined outward (in FIG. 3B). , A state indicated by a solid line). Thus, the left and right holding bodies 40B and 40C can be changed in posture between the holding posture and the cleaning posture.

  Here, the left and right holding bodies 40B and 40C move outward in the holding posture and the left and right intervals are enlarged, and in the cleaning posture, move to the inside and the left and right intervals are reduced. It is smaller than the holding posture. Thus, the cleaning device 50 can be downsized by reducing the cleaning posture of the left and right holding bodies 40B and 40C from the holding posture.

  The cover 62 of the cleaning / drying means 60 is formed with a plurality of openings 61a and 61b, and the holding bodies 40A, 40B and 40C pass through the corresponding openings 61a and 61b, respectively. In addition, in this specification and drawing, each holding body 40A-40C is also only called the holding body 40. FIG.

  Next, the structure of the cleaning / drying means 60 will be described with reference to FIGS. 2 and 4 to 8.

  As shown in FIG. 2, the cleaning / drying means 60 is configured to reciprocate with respect to the holding body 40 along the longitudinal direction of the holding body 40 by the moving means 53.

  As shown in FIG. 4, the cleaning / drying means 60 includes a cover 62 and a cleaning mechanism 63 that is provided in the cover 62 and discharges the cleaning liquid to the holding body 40.

  Of these, the cover 62 has a top surface 62a, a distal end side (Y axis plus side) side surface 62b, and a proximal end side (Y axis minus side) side surface 62c. Among these, the distal end side surface 62b and the proximal end side surface 62c are respectively formed with a distal end side opening 61a and a proximal end side opening 61b through which the holding body 40 passes. Among these, the base end side opening 61b is an opening through which the holding body 40 passes from the moving body 32 side. The bottom surface 62d of the cover 62 is open, and the cleaning liquid from the cleaning mechanism 63 is discharged outward from the bottom surface 62d of the cover 62.

  The cleaning mechanism 63 includes a cleaning liquid supply unit 65 that supplies a cleaning liquid, and a cleaning liquid discharge unit 64 that is provided above the holding body 40 and discharges the cleaning liquid from the cleaning liquid supply unit 65 to the holding body 40. Among these, a cleaning liquid supply source 66 is connected to the cleaning liquid discharge section 64 through an open / close valve 67 (FIG. 2). As a result, when the opening / closing valve 67 is opened, the cleaning liquid supplied from the cleaning liquid supply source 66 is ejected from the cleaning liquid supply section 64 toward the holding body 40 via the cleaning liquid supply section 65. . An example of the cleaning liquid used in the cleaning mechanism 63 is pure water.

  As shown in FIGS. 4 and 5, a first gas ejection mechanism 70 is provided in the cover 62 and between the cleaning mechanism 63 and the proximal end opening 61b. Further, a second gas ejection mechanism 80 that ejects the second gas to the holding body 40 is provided in the cover 62 and between the first gas ejection mechanism 70 and the proximal end side opening 61b. ing.

  Among these, the 1st gas ejection mechanism 70 dries and removes the washing | cleaning liquid adhering to the holding body 40 by injecting the 1st gas (dry gas) with respect to the holding body 40. FIG.

  That is, as shown in FIG. 5, the first gas ejection mechanism 70 is provided on the main body 72 having the opening 71 through which the holding body 40 passes and the inner peripheral surface 71a of the opening 71, and each ejects the first gas. And a plurality of outlets (dry gas outlets) 73. Among these, the opening 71 has a ring shape surrounding the periphery of the holding body 40, and can be, for example, circular or elliptical when viewed from the longitudinal direction side of the holding body 40.

  The plurality of jets 73 are arranged at predetermined intervals over the entire circumferential direction of the inner peripheral surface 71 a of the opening 71, whereby the first gas can be jetted over the entire circumference of the holding body 40. it can. Each jet port 73 has a substantially circular plane shape. The direction in which the first gas is ejected from each ejection port 73 is preferably perpendicular to the longitudinal direction (Y-axis direction) of the holding body 40. Thereby, the 1st gas from the jet nozzle 73 can be reliably reached with respect to the center part (Y-axis direction) of the holding groove 41, and the cleaning liquid remaining in the holding groove 41 is effectively removed. Can do.

  In addition, a first gas supply source 74 is connected to each jet port 73 through an open / close valve 75 (FIG. 2). Thereby, when the on-off valve 75 is opened, the first gas supplied from the first gas supply source 74 is ejected from the ejection port 73 toward the holding groove 41 of the holding body 40. ing. For example, nitrogen gas or air can be used as the first gas. Further, the first gas may be a heated gas.

  On the other hand, the second gas ejection mechanism 80 forms the air curtain A (FIGS. 6 and 7) around the holding body 40 by ejecting the second gas to the holding body 40, thereby holding it. The cleaning liquid adhering to the body 40 is prevented from splashing outside the cover 62.

  As shown in FIGS. 4 to 8, the second gas ejection mechanism 80 is provided on the main body portion 82 having the opening 81 through which the holding body 40 passes and the inner peripheral surface 81 a of the opening 81 of the main body portion 82. And a slit portion 83 which is a slit-shaped jet port for jetting the second gas, and a jet port 84 for jetting the second gas.

  Among these, the opening 81 has a ring shape surrounding the periphery of the holding body 40, and can be, for example, circular or elliptical when viewed from the longitudinal direction side of the holding body 40. In the present embodiment, the opening 81 of the second gas ejection mechanism 80 is configured to be larger than the opening 71 of the first gas ejection mechanism 70. The relationship between the size of the opening 81 of the second gas ejection mechanism 80 and the size of the opening 71 of the first gas ejection mechanism 70 is not limited to this. The opening 81 and the opening 71 may be configured with the same size. The opening 81 may be configured to be smaller than the opening 71.

  The slit portion 83 is provided at least at a position facing the holding groove 41 of the holding body 40 (in this case, above the opening 81), and extends in a band shape with a uniform width (length in the Y-axis direction). Yes. The slit portion 83 ejects the second gas to the holding groove 41 of the holding body 40, so that the cleaning liquid remaining in the holding groove 41 of the holding body 40 is particularly disturbed and scattered to the outside of the cover 62. Play a role to prevent.

  Further, the direction in which the second gas is ejected from the slit portion 83 is directed to the side opposite to the opening 81 and to the first gas ejection mechanism 70, and as shown in FIG. It is inclined by a predetermined angle α with respect to an axis along the longitudinal direction (Y-axis direction). The slit portion 83 is connected to a communication passage 83a for supplying a second gas. The communication passage 83a is connected to an axis along the longitudinal direction (Y-axis direction) of the holding body 40 in the cross section. It is inclined by a predetermined angle α.

  Specifically, the angle α is preferably 30 ° to 75 ° (meaning 30 ° to 75 °, the same applies hereinafter), and more preferably 55 ° to 65 °. By setting the angle α to the above range, it becomes easy to prevent the cleaning liquid adhering to the holding body 40 from splashing outside the cover 62, and the second gas ejected from the slit portion 83 causes the first gas to flow. The flow can be prevented from being disturbed.

  As shown in FIG. 8, the slit portion 83 is provided so as to extend within a range of a predetermined angle β on a plane perpendicular to the axis (Y axis) along the longitudinal direction. Specifically, the angle β is preferably 90 ° to 180 °, and more preferably 120 ° to 150 °. By setting the angle β to the above range, it is possible to effectively prevent the cleaning liquid remaining in the holding groove 41 of the holding body 40 from splashing outside the cover 62 and is necessary for the entire cleaning device 50. Energy (utility) can be saved.

  Further, as shown in FIGS. 4 to 8, the inner peripheral surface 81 a of the opening 81 of the main body 82 faces the region where the holding groove 41 is not provided (that is, both side surfaces and the lower surface of the holding body 40). A jet outlet 84 is provided at a position for jetting the second gas toward the region. A plurality of (in this case, nine) nozzles 84 are provided at predetermined intervals along the inner peripheral surface 81 a of the opening 81. Moreover, each jet nozzle 84 has a planar substantially circular shape, respectively. However, the present invention is not limited to this, and each ejection port 84 may have, for example, a small slit shape.

  Further, the direction in which the second gas is ejected from the ejection port 84 is directed to the side opposite to the opening 81 and to the first gas ejection mechanism 70 side, and the longitudinal direction of the holding body 40 (Y-axis direction). Is inclined by a predetermined angle γ with respect to the axis along (FIG. 7). A communication passage 84a for supplying a second gas is connected to each jet outlet 84, and each communication passage 84a has an axial line along the longitudinal direction (Y-axis direction) of the holding body 40 in its cross section. It is inclined with respect to the predetermined angle γ.

  In this case, the angle γ is preferably 30 ° to 75 °, and more preferably 55 ° to 65 °. In the present embodiment, the angle γ is the same as the angle α at which the second gas is ejected from the slit portion 83 (that is, α = γ), but is not limited thereto. The angle α and the angle γ may be different from each other.

  In addition, the slit part 83 should just be provided in the position facing the holding groove 41 of the holding body 40 at least. Therefore, the slit portion 83 may be formed over the entire circumference of the inner peripheral surface 81a of the opening 81 (that is, the angle β may be 360 °). Thereby, since the air curtain A is also formed on the side of the holding body 40 where the holding groove 41 is not provided (for example, the side surface and the lower surface of the holding body 40), the cleaning liquid is more likely to be scattered outside the cover 62. It can be surely prevented. In this case, the ejection port 84 may not be provided, or the slit portion 83 may be formed on the entire circumference of the inner peripheral surface 81a in addition to the ejection port 84.

  Further, a second gas supply source 85 is connected to the slit portion 83 and each jet port 84 through an open / close valve 86 (FIG. 2). Thereby, when the on-off valve 86 is opened, the second gas supplied from the second gas supply source 85 is ejected from the slit portion 83 and the ejection port 84 toward the holding body 40, respectively. It has become.

  For example, nitrogen gas or air can be used as the second gas. The second gas may be the same type of gas as the first gas or a different type of gas.

  The amount of the second gas ejected per unit time from the slit portion 83 and the plurality of ejection ports 84 of the second gas ejection mechanism 80 is the unit from the plurality of ejection ports 73 of the first gas ejection mechanism 70. It is preferable that the amount is larger than the amount of the first gas ejected per hour. For example, the amount of the second gas ejected from the slit portion 83 and the plurality of ejection ports 84 may be 1.5 to 10 times the amount of the first gas ejected from the plurality of ejection ports 73. Thereby, it can prevent more reliably that the washing | cleaning liquid on the holding body 40 is scattered outside the cover 62. FIG.

  Next, the structure of the air ejection means 54 is demonstrated using FIG. The air ejecting means 54 includes an upper air ejecting unit 55 disposed on the upper portion of the casing 51 and a side air ejecting unit 56 disposed on the upper portion of the casing opening 52 on the side surface side of the casing 51. An air supply source 58 that supplies air is connected to each unit 55 and 56 through an open / close valve 59.

  Among these, the upper air ejection unit 55 ejects air downward to the entire interior of the casing 51, forms an atmosphere that flows downward in the interior of the casing 51, and prevents scattering of the cleaning liquid. Further, the side air ejection unit 56 ejects air downward from the upper part of the casing opening 52 of the casing 51 and forms an air curtain in the casing opening 52 so that the cleaning liquid leaks from the casing opening 52. It is preventing. The means for preventing the cleaning liquid from leaking from the casing opening 52 of the casing 51 is not limited to the air curtain, and for example, a shutter mechanism that opens and closes the casing opening 52 by a plate-like member may be provided. .

  The substrate processing apparatus 10 including the cleaning apparatus 50 configured as described above is driven and controlled by the control mechanism 90 in accordance with various computer programs recorded in the storage medium 91 provided in the control mechanism 90 (FIG. 1). Various processes are performed on the substrate W. Here, the storage medium 91 stores various programs such as various setting data and a cleaning program described later. As the storage medium 91, a known medium such as a computer-readable memory such as ROM or RAM, or a disk-shaped storage medium such as a hard disk, CD-ROM, DVD-ROM, or flexible disk can be used.

  Next, the operation of the present embodiment having such a configuration will be described. In the following, the cleaning device 50 is driven and controlled to clean the holding body 40 in accordance with the cleaning program recorded in the storage medium 91 of the control mechanism 90.

  First, the cleaning device 50 moves the cleaning / drying means 60 to the rear end side of the casing 51 (left side in FIG. 2) in advance by the moving means 53. Next, the holding body 40 of the wafer transfer mechanism 30 is changed from the holding position to the cleaning position (see FIG. 3B). Thereafter, the moving body 32 of the wafer transfer mechanism 30 is moved, and the holding body 40 of the wafer transfer mechanism 30 is accommodated in the casing 51.

  Next, the cleaning device 50 ejects air from the upper air ejection unit 55 and the side air ejection unit 56 by the air ejection means 54.

  Further, by opening the opening / closing valve 86, the second gas is supplied from the second gas supply source 85, and the second gas is supplied from the slit 83 and the outlet of the second gas ejection mechanism 80. 84 is ejected. In this case, the second gas is ejected from the slit portion 83 and the ejection port 84 toward the direction opposite to the opening 81 and inclined by a predetermined angle α with respect to the axis along the longitudinal direction of the holding body 40. .

  Note that at least the first gas ejection mechanism 70 causes the first gas to be discharged while the cleaning mechanism 63 ejects the cleaning liquid and while the first gas ejection mechanism 70 ejects the first gas. It is executed while erupting. In particular, after that, it is preferable that the second gas is continuously ejected from the second gas ejection mechanism 80 until the operation of drying the holding body 40 by the first gas ejection mechanism 70 is completed.

  Next, by opening the opening / closing valve 67, the cleaning liquid is supplied from the cleaning liquid supply source 66, and the cleaning liquid is discharged from the cleaning liquid discharge unit 64 of the cleaning mechanism 63. Subsequently, the cleaning / drying means 60 is moved by the moving means 53 from the rear end side of the casing 51 to the front end side (in FIG. 2, from the front end side (left side) to the base end side (right side) of the holder 40. .

  While the cleaning / drying means 60 moves in this way, the cleaning liquid is discharged from above toward the holding groove 41 of the holding body 40 by the cleaning liquid discharge section 64 of the cleaning mechanism 63. Thereby, the contaminant adhering to the holding groove 41 of the holding body 40 is washed. The cleaning liquid after cleaning is discharged outward from the bottom surface 62d of the cover 62.

  Thus, while discharging the cleaning liquid using the cleaning mechanism 63, the second gas is on the opposite side of the opening 81 from the slit portion 83 and the jet port 84, and with respect to the axis along the longitudinal direction of the holding body 40. It continues to be ejected in an inclined direction. This prevents the cleaning liquid discharged toward the holding body 40 from being scattered outside the cover 62.

  Thereafter, the cleaning / drying unit 60 stops after moving to the front end side of the casing 51 (in FIG. 2, the base end side (right side) of the holding body 40) by the moving unit 53. At this time, the discharge of the cleaning liquid from the cleaning mechanism 63 is stopped by closing the open / close valve 67.

  Next, the cleaning device 50 moves the cleaning and drying means 60 from the front end side to the rear end side of the casing 51 by the moving means 53 (in FIG. 2, from the base end side (right side) to the front end side (left side) of the holding body 40). Move to. Further, by opening the opening / closing valve 75, the first gas (dry gas) is supplied from the first gas supply source 74, and the first gas is ejected from each outlet 73 of the first gas ejection mechanism 70. It is discharged from. With this first gas, the cleaning liquid adhering to the holding groove 41 of the holding body 40 is dried and removed.

  In particular, since the direction in which the first gas is ejected from each ejection port 73 is perpendicular to the longitudinal direction (Y-axis direction) of the holding body 40, the first gas is placed in the central portion of the holding groove 41. Accordingly, the cleaning liquid remaining in the holding groove 41 can be effectively removed.

  Further, while the cleaning liquid is being dried using the first gas ejection mechanism 70, the second gas continues to be ejected from the slit portion 83 and the ejection port 84 toward the holding body 40. This prevents the liquid droplets of the cleaning liquid remaining on the holding body 40 from being scattered outside the cover 62.

  Thereafter, the cleaning / drying means 60 stops after moving to the rear end side of the casing 51 (in FIG. 2, the front end side (left side) of the holding body 40) by the moving means 53.

  Thereafter, if necessary, the cleaning / drying means 60 is further reciprocated one or more times along the longitudinal direction of the holding body 40, and the first gas is ejected from the first gas ejection mechanism 70 to the holding body 40. You may do it. Thereby, the cleaning liquid remaining in the holding groove 41 can be more reliably removed. During this time, the second gas continues to be ejected from the slit portion 83 and the ejection port 84 toward the holding body 40.

  After that, the cleaning / drying means 60 is moved to the rear end side of the casing 51 (the front end side of the holding body 40 (the left side in FIG. 2)), and the opening / closing valve 75 is closed, thereby causing the first gas ejection. The ejection of the first gas from the mechanism 70 is stopped. Further, by closing the on-off valve 86, the second gas ejection mechanism 80 stops the second gas ejection.

  Further, the ejection of air from the upper air ejection unit 55 and the side air ejection unit 56 of the air ejection means 54 is stopped.

  In this way, the cleaning of the holding body 40 by the cleaning device 50 is completed.

  As described above, according to the present embodiment, the second gas ejection mechanism 80 is provided at least at a position facing the holding groove 41 of the holding body 40, and the second gas is ejected from the holding groove 41. It has the slit part 83 which ejects. The direction in which the second gas is ejected from the slit portion 83 is directed to the opposite side of the opening 81. This prevents the cleaning liquid on the holding body 40 from being scattered outside the cover 62 (particularly on the moving body 32 side) by the first gas ejected from the ejection port 73 of the first gas ejection mechanism 70. be able to. In particular, since the air curtain A is formed by the second gas ejected from the slit portion 83, the cleaning liquid remaining in the holding groove 41 of the holding body 40 can be effectively removed. Thereby, when the holding body 40 is moved along the rail 31, it is possible to prevent a problem that the cleaning liquid falls from the holding body 40 to the wafer carry-in / out unit 13 and the wafer processing unit 14.

  Further, according to the present embodiment, the second gas ejection mechanism 80 is provided at a position facing the region (in this case, the side surface and the lower surface) where the holding groove 41 is not provided in the holding body 40, It has the jet outlet 84 which ejects 2nd gas toward an area | region. The direction in which the second gas is ejected from the ejection port 84 is directed to the opposite side of the opening 81. Accordingly, it is possible to prevent the cleaning liquid remaining in the region where the holding groove 41 is not provided in the holding body 40 from being scattered outside the cover 62.

Modifications Various modifications of the present embodiment will be described below.

  In the above embodiment, as shown in FIG. 4, the first gas ejection mechanism 70 and the second gas ejection mechanism 80 are provided on the base end side opening 61 b side in the cover 62, thereby allowing the cleaning liquid to flow. It is prevented from scattering to the moving body 32 side. However, the present invention is not limited to this, and the first gas ejection mechanism 70 and the second gas ejection mechanism 80 may be provided on the distal end side opening 61 a side in the cover 62. Further, the first gas ejection mechanism 70 and the second gas ejection mechanism 80 may be provided on both the distal end side opening 61 a side and the proximal end side opening 61 b side in the cover 62.

  In the above embodiment, the cleaning / drying means 60 moves while the holding body 40 is stationary. However, the present invention is not limited to this, and the holding body 40 is moved while the cleaning / drying means 60 is stationary. You may do it. Further, both the cleaning / drying means 60 and the holding body 40 may be moved.

  Moreover, in the said embodiment, although the slit part 83 which is one slit-shaped jet nozzle which has a uniform width | variety is extended in strip | belt shape on the internal peripheral surface 81a of the opening 81, it is not restricted to this. .

  For example, as shown in FIG. 9 (a), the width of the central portion of the slit portion 83 that faces the holding groove 41 may be maximized, and the width may gradually decrease as the distance from the central portion increases. In this case, the second gas can be ejected mainly with respect to the holding groove 41.

  Further, as shown in FIG. 9B, a plurality of (for example, two) slit portions 83 may be provided, and these slit portions 83 may be positioned on the same circumference. In FIG. 9B, a non-ejection portion 87 that does not eject the second gas is formed between the two slit portions 83 so as not to affect the scattering of the cleaning liquid. In this case, for example, the amount of gas ejected from each of the two slit portions may be the same, or the amount of each gas may be changed according to the state of scattering.

  Further, as shown in FIG. 9C, a plurality of slit portions 83 (for example, two) are provided, and these slit portions 83 are arranged so as to be shifted in the longitudinal direction (Y-axis direction) of the holding body 40. May be. In FIG. 9C, an overlapping portion 88 where two slit portions 83 partially overlap is provided above the holding groove 41. In this case, the second gas can be intensively ejected toward the central portion of the holding groove 41. Further, since the overlapping portion 88 is provided, it is possible to more reliably prevent the cleaning liquid from scattering even when the slit portion 83 is formed by a plurality of slit portions.

DESCRIPTION OF SYMBOLS 10 Substrate processing apparatus 40 Holding body 41 Holding groove 50 Cleaning apparatus 53 Moving means 60 Cleaning / drying means 61a Front end side opening 61b Base end side opening 62 Cover 63 Cleaning mechanism 70 First gas ejection mechanism 71 Opening 72 Main body part 73 Outlet 80 Second gas jetting mechanism 81 Opening 82 Main body 83 Slit 84 Jetting port 90 Control mechanism 91 Storage medium

Claims (13)

In a cleaning apparatus that is attached to a movable movable body and holds a wafer and cleans a holding body in which a plurality of holding grooves are formed along the longitudinal direction,
Cleaning and drying means movable relative to the holding body along the longitudinal direction;
The washing and drying means includes
A cover including an opening through which the holding body passes from the movable body side;
A cleaning mechanism provided in the cover and for discharging a cleaning liquid to the holding body;
A first gas ejection mechanism that is provided in the cover and provided between the cleaning mechanism and the opening, and ejects a first gas to the holding body;
A second gas ejection mechanism that is provided in the cover and provided between the first gas ejection mechanism and the opening, and ejects a second gas to the holding body;
The second gas ejection mechanism is a slit-shaped ejection port that is provided at least at a position facing the holding groove of the holding body and jets the second gas to the holding groove of the holding body. Having a slit part,
A cleaning apparatus, wherein a direction in which the second gas is ejected from the slit portion is directed to the opposite side of the opening.   The cleaning apparatus according to claim 1, wherein a direction in which the second gas is ejected from the slit portion is inclined by 30 ° to 75 ° with respect to an axis along the longitudinal direction of the holding body.   The second gas ejection mechanism is further provided at a position facing a region of the holding body where the holding groove is not provided, and further has a jet outlet for ejecting the second gas toward the region. The cleaning apparatus according to claim 1, wherein:   The cleaning apparatus according to claim 3, wherein a direction in which the second gas is ejected from the ejection port is directed toward the first gas ejection mechanism.   The said slit part is extended and provided in the range of 90 degrees-180 degrees on the plane perpendicular | vertical with respect to the axis line along the said longitudinal direction, The Claim 1 thru | or 4 characterized by the above-mentioned. Cleaning equipment.   6. The cleaning according to claim 1, wherein a direction in which the first gas is ejected from the first gas ejection mechanism is perpendicular to the longitudinal direction of the holding body. apparatus.   The amount of the second gas ejected from the second gas ejection mechanism per unit time is larger than the amount of the first gas ejected from the first gas ejection mechanism per unit time. The cleaning device according to any one of claims 1 to 6, wherein the cleaning device is characterized in that:   The cleaning apparatus according to claim 1, wherein a bottom surface of the cover is open, and cleaning liquid from the cleaning mechanism is discharged from the bottom surface of the cover.   The cleaning apparatus according to claim 1, wherein a plurality of the holding bodies are provided, and the opening through which each of the plurality of holding bodies passes is formed in the cover.   The cleaning device further includes a casing for housing the holding body and the cleaning and drying means, and a casing opening through which the holding body is inserted is formed on a side surface of the casing, and the cleaning liquid leaks from the casing opening. The cleaning apparatus according to claim 1, further comprising an air curtain or a shutter for preventing the air curtain. In a cleaning method for cleaning a holding body that is attached to a movable body and holds a wafer and has a plurality of holding grooves formed along the longitudinal direction,
A step of moving the cleaning and drying means having a cover including an opening through which the holding body passes from the moving body side relative to the holding body along the longitudinal direction;
Discharging the cleaning liquid from the cleaning mechanism to the holder in the cover while moving the cleaning and drying means;
A step of ejecting a first gas from the first gas ejection mechanism to the holding body in the cover and between the cleaning mechanism and the opening while moving the cleaning and drying means;
A step of ejecting a second gas from the second gas ejection mechanism to the holding body in the cover and between the first gas ejection mechanism and the opening,
In the step of ejecting the second gas, the slit is a slit portion that is provided at least in a position facing the holding groove of the holding body and is a slit portion that is a slit-shaped ejection port. 2 gas is ejected,
A cleaning method, wherein a direction in which the second gas is ejected from the slit portion is directed to the opposite side of the opening.   The step of ejecting the second gas is performed at least during the ejection of the first gas between the step of discharging the cleaning liquid and the step of ejecting the first gas. Item 12. A cleaning method according to Item 11. In a storage medium that stores a computer program that is attached to a movable body and that holds a wafer and executes a cleaning method for cleaning the holder in which a plurality of holding grooves are formed in the longitudinal direction.
The cleaning method includes:
A step of moving the cleaning and drying means having a cover including an opening through which the holding body passes from the moving body side relative to the holding body along the longitudinal direction;
Discharging the cleaning liquid from the cleaning mechanism to the holder in the cover while moving the cleaning and drying means;
A step of ejecting a first gas from the first gas ejection mechanism to the holding body in the cover and between the cleaning mechanism and the opening while moving the cleaning and drying means;
A step of ejecting a second gas from the second gas ejection mechanism to the holding body in the cover and between the first gas ejection mechanism and the opening,
In the step of ejecting the second gas, the slit is a slit portion that is provided at least in a position facing the holding groove of the holding body and is a slit portion that is a slit-shaped ejection port. 2 gas is ejected,
A storage medium comprising a method in which a direction in which the second gas is ejected from the slit portion is directed to the opposite side of the opening.

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