JP2013236018A5 - - Google Patents
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- JP2013236018A5 JP2013236018A5 JP2012108759A JP2012108759A JP2013236018A5 JP 2013236018 A5 JP2013236018 A5 JP 2013236018A5 JP 2012108759 A JP2012108759 A JP 2012108759A JP 2012108759 A JP2012108759 A JP 2012108759A JP 2013236018 A5 JP2013236018 A5 JP 2013236018A5
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- JP
- Japan
- Prior art keywords
- sides
- workpiece
- line
- work
- dicing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003754 machining Methods 0.000 claims description 5
- 239000000498 cooling water Substances 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 210000003284 Horns Anatomy 0.000 claims 2
Description
請求項4に係る発明は、請求項3に係る発明において、前記流体供給手段は、加工点近傍へ研削水を噴射する研削水ノズルであることを特徴とする。 The invention according to claim 4 is the invention according to claim 3 , wherein the fluid supply means is a grinding water nozzle for injecting grinding water to the vicinity of the machining point.
請求項5に係る発明は、請求項3又は4に係る発明において、前記一対の水平部は、前記ブレードへ冷却水を噴射する冷却水ノズルを備えていることを特徴とする。
The invention according to claim 5 is the invention according to claim 3 or 4 , wherein the pair of horizontal portions includes a cooling water nozzle that injects cooling water to the blade.
Claims (7)
前記加工ラインの両側に位置するワーク部分を局所的に縦方向に超音波振動させるワーク振動手段を備えることを特徴とするダイシング装置。 In a dicing apparatus that cuts a work placed on a work table via an elastic body along a processing line by a blade rotated by a spindle,
A dicing apparatus comprising: a workpiece vibration means for locally ultrasonically vibrating a workpiece portion located on both sides of the processing line in a vertical direction.
前記スピンドルに固定された超音波振動子と、
前記超音波振動子に固定された固定部と、前記ブレードを間に挟んで前記ブレードの両側に配置され、前記ワーク部分との間に隙間を形成する一対の水平部と、前記固定部と前記一対の水平部とを連結する連結部と、を含み、前記超音波振動子が発生する超音波により共振するホーンと、
前記隙間へ、前記超音波振動子が発生する超音波振動により共振する前記ホーンの振動を前記ワーク部分へ伝達する媒体として機能する流体を供給する流体供給手段と、
を備えていることを特徴とする請求項1又は2に記載のダイシング装置。 The work vibration means is
An ultrasonic transducer fixed to the spindle;
A fixed portion fixed to the ultrasonic transducer, a pair of horizontal portions disposed on both sides of the blade with the blade interposed therebetween, and forming a gap between the workpiece portion, the fixed portion, and the A horn that resonates with ultrasonic waves generated by the ultrasonic vibrator, and a connecting portion that connects a pair of horizontal portions;
Fluid supply means for supplying a fluid that functions as a medium for transmitting the vibration of the horn resonated by the ultrasonic vibration generated by the ultrasonic vibrator to the work portion, to the gap;
The dicing apparatus according to claim 1 or 2, further comprising:
前記加工ラインの両側に位置するワーク部分を局所的に縦方向に超音波振動させながら前記加工ラインを切削することを特徴とするダイシング方法。 In a dicing method of cutting a work placed on a work table via an elastic body along a processing line by a blade rotated by a spindle,
A dicing method characterized by cutting the processing line while locally oscillating the work parts located on both sides of the processing line in the longitudinal direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012108759A JP6010827B2 (en) | 2012-05-10 | 2012-05-10 | Dicing apparatus and dicing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012108759A JP6010827B2 (en) | 2012-05-10 | 2012-05-10 | Dicing apparatus and dicing method |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016181281A Division JP6218052B2 (en) | 2016-09-16 | 2016-09-16 | Dicing apparatus and dicing method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013236018A JP2013236018A (en) | 2013-11-21 |
JP2013236018A5 true JP2013236018A5 (en) | 2015-05-28 |
JP6010827B2 JP6010827B2 (en) | 2016-10-19 |
Family
ID=49761884
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012108759A Active JP6010827B2 (en) | 2012-05-10 | 2012-05-10 | Dicing apparatus and dicing method |
Country Status (1)
Country | Link |
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JP (1) | JP6010827B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6257360B2 (en) * | 2014-02-04 | 2018-01-10 | 株式会社ディスコ | Blade cover device |
JP7135352B2 (en) | 2018-03-14 | 2022-09-13 | 富士電機株式会社 | Semiconductor device manufacturing method |
US11615979B2 (en) * | 2019-12-18 | 2023-03-28 | Disco Corporation | Method of processing wafer |
CN117283730A (en) * | 2023-11-27 | 2023-12-26 | 苏州特斯特半导体设备有限公司 | Ultrasonic scribing process |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59223282A (en) * | 1983-05-30 | 1984-12-15 | 株式会社井上ジャパックス研究所 | Ceramic working method |
JPH02113907A (en) * | 1988-10-24 | 1990-04-26 | Tokyo Seimitsu Co Ltd | Dicing method and apparatus |
JPH09320994A (en) * | 1996-05-28 | 1997-12-12 | Sony Corp | Dicing equipment |
JP2003068677A (en) * | 2001-08-21 | 2003-03-07 | Sony Corp | Device and method for dicing |
JP2005053203A (en) * | 2003-08-06 | 2005-03-03 | Kazumasa Onishi | Cutting device |
-
2012
- 2012-05-10 JP JP2012108759A patent/JP6010827B2/en active Active
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