JP6005144B2 - 無電解メッキのための方法 - Google Patents
無電解メッキのための方法 Download PDFInfo
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- JP6005144B2 JP6005144B2 JP2014510709A JP2014510709A JP6005144B2 JP 6005144 B2 JP6005144 B2 JP 6005144B2 JP 2014510709 A JP2014510709 A JP 2014510709A JP 2014510709 A JP2014510709 A JP 2014510709A JP 6005144 B2 JP6005144 B2 JP 6005144B2
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/40—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
- C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12597—Noncrystalline silica or noncrystalline plural-oxide component [e.g., glass, etc.]
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
種々の特徴、例えば薄膜トランジスタ(TFT)を基礎とする平面パネルディスプレイについてのゲート構造及び回路の金属化は、金属、例えばアルミニウム、モリブデン、クロム及びチタンを、気相堆積法によって堆積することによって得られる。パネル寸法の増加は、非常に短いピクセル応答時間を維持し、かつ高速画像列におけるモーションブラー効果を避けるために、TFTラインのより高い導電性を要求する。
従って、本発明の第一の課題は、高い導電性を有する表面層を提供することである。
前記課題は、本発明による一般のプロセス順序によって解決され、その際一般のプロセス順序は、
(i)モリブデン、チタン、ジルコニウム、アルミニウム、クロム、タングステン、ニオブ、タンタル及びそれらの合金からなる群から選択される金属構造物又は金属合金構造物からなる表面を少なくとも一方の側面で有する非導電性基材を提供する工程、
(ii)前記基材と貴金属を含む活性剤とを接触する工程、
(iii)前記基材と少なくとも1つの窒素含有物質及びヒドロキシカルボン酸を含む水溶液とを接触する工程、及び
(iv)活性化された表面上に無電解メッキによって金属又は金属合金を堆積する工程
を、この順序で含む。
平面パネルディスプレイ及び関連するデバイスのための基材は、ガラス又はポリマー箔、例えばPET箔から製造される。かかる非導電性基材は、通常化学蒸着又は物理蒸着によって堆積された前記金属構造物又は金属合金構造物を少なくとも一方の側面で含む。前記金属構造物又は金属合金構造物は、モリブデン、チタン、ジルコニウム、アルミニウム、クロム、タングステン、ニオブ、タンタル、及びそれらの合金の1つ以上からなる。
a)非導電性基材の一方又は双方の側面で全体表面が、薄い金属層又は金属合金層によって覆われている(あまり好ましくない)か、又は
b)"金属構造物又は金属合金構造物"が、非導電性基材の一方又は双方の側面で金属パターンを含む(好ましい)
ことを意味するものとする。
(i)モリブデン、チタン、ジルコニウム、アルミニウム、クロム、タングステン、ニオブ、タンタル及びそれらの合金からなる群から選択される金属構造物又は金属合金構造物からなる表面を少なくとも一方の側面で有する非導電性基材を提供する工程、
(ii)前記基材と貴金属イオンとして貴金属を含む活性剤とを接触し、これによって金属構造物又は金属合金構造物のみを活性化する工程、
(iii)前記基材と少なくとも1つの窒素含有物質及びヒドロキシカルボン酸を含む水溶液とを接触する工程、及び
(iv)活性化された金属構造物又は金属合金構造物上に無電解メッキによって金属又は金属合金を堆積する工程
を、この順序で含む。
本発明を、次の限定的ではない実施例に関連して説明する。
一方の側面に付着させたモリブデンの層を有するガラス基材を、第四級アンモニウムポリマーを含むコンディショナーで、そしてパラジウムの液浸タイプメッキによって活性化した。次に、銅層を、銅イオン、ホルムアルデヒド、EDTA及び安定剤を含むメッキ浴から堆積した。従って、一般のプロセス順序による工程(iii)を適用しなかった。
一方の側面に付着させたモリブデンの層を有するガラス基材を、パラジウムの液浸タイプメッキによって活性化した。そして活性化した基材を、pH値12〜12.5を有し、かつポリアミドアミン3.1g/lを含む水溶液中に20秒間浸漬した。次に、銅層を、銅イオン、ホルムアルデヒド、EDTA及び安定剤を含むメッキ浴から堆積した。従って、工程(iii)を、一般のプロセス順序に従ってこの時点で適用した。
Claims (5)
- 無電解メッキのための方法であって、
(i)少なくとも一方の側面で非導電性基材に付着させたモリブデン、チタン、ジルコニウム、アルミニウム、クロム、タングステン、ニオブ、タンタル及びそれらの合金からなる群から選択される金属構造物又は金属合金構造物を有する非導電性基材を提供する工程、
(ii)前記基材とパラジウムイオンを含む活性剤とを接触する工程、
(iii)前記基材と少なくとも1つの窒素含有物質を含む水溶液とを接触する工程、及び
(iv)活性化された表面上に無電解メッキによって金属又は金属合金を堆積する工程
をこの順序で含み、工程(iii)における少なくとも1つの窒素含有物質が、第四級アンモニウムポリマー、ポリアミドアミン、炭素原子2〜6個を有するアルキル基を有するテトラ−アンモニウムヒドロキシ化合物、アルカノールアミン、アミノカルボン酸、脂肪アミンを基礎とする第四級アンモニウム塩、及び四級化脂肪族アミンエトキシレート、及びそれらの混合物からなる群から選択される、前記方法。 - 工程(i)における金属構造物又は金属合金構造物が、モリブデン、チタン及びそれらの合金からなる群から選択される、請求項1に記載の方法。
- 工程(iii)における少なくとも1つの窒素含有物質の濃度が、0.1〜30g/lの範囲である、請求項1又は2に記載の方法。
- 工程(iv)において堆積された金属又は金属合金が、銅、銅合金、ニッケル及びニッケル合金からなる群から選択される、請求項1から3までのいずれか1項に記載の方法。
- モリブデン、チタン、ジルコニウム、アルミニウム、クロム、タングステン、ニオブ、タンタル及びそれらの合金から選択される金属構造物又は金属合金構造物を少なくとも一方の側面で有し、付着させた銅又は銅合金の層を該金属構造物又は金属合金構造物上で有するガラス基材であって、銅又は銅合金が、請求項1から4までのいずれか1項に記載の方法によって堆積されたものである、前記ガラス基材の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11166399.3 | 2011-05-17 | ||
EP11166399.3A EP2524976B1 (en) | 2011-05-17 | 2011-05-17 | Pretreatment for electroless plating |
PCT/EP2012/056960 WO2012156162A2 (en) | 2011-05-17 | 2012-04-17 | Method for electroless plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014513755A JP2014513755A (ja) | 2014-06-05 |
JP6005144B2 true JP6005144B2 (ja) | 2016-10-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014510709A Active JP6005144B2 (ja) | 2011-05-17 | 2012-04-17 | 無電解メッキのための方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9822034B2 (ja) |
EP (1) | EP2524976B1 (ja) |
JP (1) | JP6005144B2 (ja) |
KR (1) | KR101945555B1 (ja) |
CN (1) | CN103534384B (ja) |
TW (1) | TWI580816B (ja) |
WO (1) | WO2012156162A2 (ja) |
Families Citing this family (5)
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DE102013208395B3 (de) * | 2013-05-07 | 2014-08-28 | Helmholtz-Zentrum Dresden - Rossendorf E.V. | Bauteil mit metallhaltiger, selbstorganisierter Schicht, Verfahren zu deren Herstellung sowie Verwendung |
CN104250729B (zh) * | 2013-06-27 | 2018-01-23 | 比亚迪股份有限公司 | 一种离子钯活化液及其制备方法和一种非金属化学镀的方法 |
CN108476611B (zh) * | 2016-01-08 | 2021-02-19 | 利罗特瑞公司 | 印刷电路表面抛光、使用方法和由此制成的组件 |
EP3296428B1 (en) * | 2016-09-16 | 2019-05-15 | ATOTECH Deutschland GmbH | Method for depositing a metal or metal alloy on a surface |
CN109289556B (zh) * | 2018-08-27 | 2021-06-08 | 浙江工业大学 | 一种利用tmdp交联的阴离子交换膜的制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS54100931A (en) * | 1978-01-27 | 1979-08-09 | Hitachi Ltd | Electroless nickel plating |
JPH04157167A (ja) * | 1990-10-17 | 1992-05-29 | Hitachi Chem Co Ltd | 無電解めっき用前処理液 |
JP2003049279A (ja) * | 2001-08-02 | 2003-02-21 | Shipley Co Llc | アクセレレータ浴液用添加剤およびアクセレレータ浴液 |
CN1329554C (zh) * | 2004-01-13 | 2007-08-01 | 长沙力元新材料股份有限公司 | 非金属基材表面化学镀覆金属的方法及其采用的前处理体系 |
EP1717344A4 (en) * | 2004-01-23 | 2008-08-20 | Ebara Corp | PROCESS FOR PROCESSING A SUBSTRATE, CATALYST PROCESS LIQUID, AND SUBSTRATE PROCESSING DEVICE |
US20050170650A1 (en) * | 2004-01-26 | 2005-08-04 | Hongbin Fang | Electroless palladium nitrate activation prior to cobalt-alloy deposition |
US20060225605A1 (en) * | 2005-04-11 | 2006-10-12 | Kloeckener James R | Aqueous coating compositions and process for treating metal plated substrates |
CN1966765B (zh) * | 2005-11-17 | 2012-07-18 | 中国科学院金属研究所 | 一种非金属材料化学镀的活化方法及其化学镀 |
KR20080083790A (ko) * | 2007-03-13 | 2008-09-19 | 삼성전자주식회사 | 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법 |
JPWO2010010851A1 (ja) * | 2008-07-24 | 2012-01-05 | コニカミノルタホールディングス株式会社 | 基材、導電性パターン形成方法、及び有機薄膜トランジスタ |
-
2011
- 2011-05-17 EP EP11166399.3A patent/EP2524976B1/en active Active
-
2012
- 2012-04-17 JP JP2014510709A patent/JP6005144B2/ja active Active
- 2012-04-17 KR KR1020137030435A patent/KR101945555B1/ko active IP Right Grant
- 2012-04-17 US US14/116,810 patent/US9822034B2/en active Active
- 2012-04-17 CN CN201280023397.5A patent/CN103534384B/zh active Active
- 2012-04-17 WO PCT/EP2012/056960 patent/WO2012156162A2/en active Application Filing
- 2012-05-17 TW TW101117634A patent/TWI580816B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR101945555B1 (ko) | 2019-02-07 |
JP2014513755A (ja) | 2014-06-05 |
WO2012156162A3 (en) | 2013-08-15 |
CN103534384B (zh) | 2016-06-22 |
TWI580816B (zh) | 2017-05-01 |
US9822034B2 (en) | 2017-11-21 |
US20140113158A1 (en) | 2014-04-24 |
EP2524976B1 (en) | 2016-06-29 |
EP2524976A1 (en) | 2012-11-21 |
WO2012156162A2 (en) | 2012-11-22 |
KR20140023368A (ko) | 2014-02-26 |
TW201300573A (zh) | 2013-01-01 |
CN103534384A (zh) | 2014-01-22 |
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