JP6004517B2 - 基板検査装置、基板検査方法及び該基板検査装置の調整方法 - Google Patents

基板検査装置、基板検査方法及び該基板検査装置の調整方法 Download PDF

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Publication number
JP6004517B2
JP6004517B2 JP2012082640A JP2012082640A JP6004517B2 JP 6004517 B2 JP6004517 B2 JP 6004517B2 JP 2012082640 A JP2012082640 A JP 2012082640A JP 2012082640 A JP2012082640 A JP 2012082640A JP 6004517 B2 JP6004517 B2 JP 6004517B2
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Japan
Prior art keywords
substrate
sensor camera
line sensor
image
microcavity
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Expired - Fee Related
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JP2012082640A
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English (en)
Japanese (ja)
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JP2012233880A (ja
JP2012233880A5 (zh
Inventor
松嶋　大輔
大輔 松嶋
武藤　真
真 武藤
林　義典
義典 林
博之 若葉
博之 若葉
小野　洋子
洋子 小野
森　秀樹
秀樹 森
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2012082640A priority Critical patent/JP6004517B2/ja
Priority to KR1020120035282A priority patent/KR101374509B1/ko
Priority to TW101112614A priority patent/TWI456189B/zh
Priority to CN201210115341.4A priority patent/CN102749334B/zh
Publication of JP2012233880A publication Critical patent/JP2012233880A/ja
Publication of JP2012233880A5 publication Critical patent/JP2012233880A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2012082640A 2011-04-19 2012-03-30 基板検査装置、基板検査方法及び該基板検査装置の調整方法 Expired - Fee Related JP6004517B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012082640A JP6004517B2 (ja) 2011-04-19 2012-03-30 基板検査装置、基板検査方法及び該基板検査装置の調整方法
KR1020120035282A KR101374509B1 (ko) 2011-04-19 2012-04-05 기판 검사 장치, 기판 검사 방법 및 이 기판 검사 장치의 조정 방법
TW101112614A TWI456189B (zh) 2011-04-19 2012-04-10 基板檢查裝置、基板檢查方法及該基板檢查裝置之調整方法
CN201210115341.4A CN102749334B (zh) 2011-04-19 2012-04-18 基板检查装置、基板检查方法及基板检查装置的调整方法

Applications Claiming Priority (5)

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JP2011093377 2011-04-19
JP2011093378 2011-04-19
JP2011093377 2011-04-19
JP2011093378 2011-04-19
JP2012082640A JP6004517B2 (ja) 2011-04-19 2012-03-30 基板検査装置、基板検査方法及び該基板検査装置の調整方法

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JP2016062104A Division JP6110538B2 (ja) 2011-04-19 2016-03-25 基板検査装置及び基板検査装置の調整方法

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JP2012233880A JP2012233880A (ja) 2012-11-29
JP2012233880A5 JP2012233880A5 (zh) 2015-05-07
JP6004517B2 true JP6004517B2 (ja) 2016-10-12

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JP (1) JP6004517B2 (zh)
KR (1) KR101374509B1 (zh)
CN (1) CN102749334B (zh)
TW (1) TWI456189B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013003090A1 (de) * 2013-02-25 2014-08-28 Texmag Gmbh Vertriebsgesellschaft Verfahren und Vorrichtung zum Prüfen von Faltzuschnitten
JP6330211B2 (ja) * 2013-10-06 2018-05-30 株式会社山梨技術工房 平板基板の表面状態検査方法及びそれを用いた平板基板の表面状態検査装置
KR101619149B1 (ko) * 2014-01-22 2016-05-10 주식회사 브이원텍 칩온글래스 본딩 검사장치
JP6126183B2 (ja) 2015-10-05 2017-05-10 ファナック株式会社 ターゲットマークを撮像するカメラを備えたロボットシステム
CN106248681A (zh) * 2016-07-18 2016-12-21 南通大学 基于机器视觉的立体对象多类缺陷检测装置及方法
CN110139827B (zh) 2016-10-26 2023-04-14 得克萨斯州大学系统董事会 用于反射和透射纳米光子器件的高吞吐量、高分辨率光学计量
WO2018089935A1 (en) * 2016-11-14 2018-05-17 Siemens Healthcare Diagnostics Inc. Methods and apparatus for characterizing a specimen using pattern illumination
US11217465B2 (en) * 2017-04-11 2022-01-04 Muehlbauer GmbH & Co. KG Component receiving device with optical sensor
JP6884082B2 (ja) * 2017-10-11 2021-06-09 株式会社Ｓｃｒｅｅｎホールディングス 膜厚測定装置、基板検査装置、膜厚測定方法および基板検査方法
CN114258482A (zh) * 2019-08-29 2022-03-29 东京毅力科创株式会社 检查装置的自我诊断方法和检查装置
CN111272709B (zh) * 2020-02-25 2021-02-12 中国矿业大学 一种矿物与气泡或油滴间液膜薄化装置
CN112362667B (zh) * 2020-11-04 2021-07-06 广东鑫光智能系统有限公司 一种改进型板材生产用六面检测装置及其检测方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63139237A (ja) * 1986-12-02 1988-06-11 Toshiba Corp 半導体基板の欠陥検査装置
JPH0346314A (ja) * 1989-07-14 1991-02-27 Sumitomo Metal Mining Co Ltd 半導体基板の接合時又は研磨時前の処理方法
US6411377B1 (en) * 1991-04-02 2002-06-25 Hitachi, Ltd. Optical apparatus for defect and particle size inspection
JP2000121326A (ja) * 1998-10-20 2000-04-28 Hitachi Electronics Eng Co Ltd ギャップ検出方式
JP2001005964A (ja) * 1999-06-18 2001-01-12 Fuji Photo Film Co Ltd デジタル画像読取装置用形状検査装置および形状検査方法
JP2002250695A (ja) * 2001-02-26 2002-09-06 Sekisui Chem Co Ltd 多層フィルム欠陥検出装置
JP4709432B2 (ja) * 2001-06-27 2011-06-22 日本特殊陶業株式会社 基板の検査方法及び検査装置並びに電子機器用製品の製造方法
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2007107945A (ja) * 2005-10-12 2007-04-26 Olympus Corp 基板検査装置
KR100793182B1 (ko) * 2006-02-07 2008-01-10 주식회사 한택 라인센서 카메라를 이용한 반도체 기판의 결함검출장치 및방법
JP2008032433A (ja) * 2006-07-26 2008-02-14 Olympus Corp 基板検査装置
US8107064B2 (en) * 2006-08-10 2012-01-31 Shibaura Mechatronics Corporation Disc wafer inspecting device and inspecting method
JP5128920B2 (ja) * 2007-12-03 2013-01-23 芝浦メカトロニクス株式会社 基板表面検査装置及び基板表面検査方法
JP4358889B1 (ja) * 2008-06-27 2009-11-04 日本エレクトロセンサリデバイス株式会社 ウエーハ欠陥検査装置
CN101887030A (zh) * 2009-05-15 2010-11-17 圣戈本玻璃法国公司 用于检测透明基板表面和/或其内部的缺陷的方法及系统

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Publication number Publication date
KR20120123641A (ko) 2012-11-09
JP2012233880A (ja) 2012-11-29
KR101374509B1 (ko) 2014-03-13
CN102749334B (zh) 2014-08-27
TW201300765A (zh) 2013-01-01
TWI456189B (zh) 2014-10-11
CN102749334A (zh) 2012-10-24

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