JP5996215B2 - 光電変換モジュールおよび光伝送ユニット - Google Patents

光電変換モジュールおよび光伝送ユニット Download PDF

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Publication number
JP5996215B2
JP5996215B2 JP2012042058A JP2012042058A JP5996215B2 JP 5996215 B2 JP5996215 B2 JP 5996215B2 JP 2012042058 A JP2012042058 A JP 2012042058A JP 2012042058 A JP2012042058 A JP 2012042058A JP 5996215 B2 JP5996215 B2 JP 5996215B2
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JP
Japan
Prior art keywords
hole
photoelectric conversion
substrate
protrusion
conversion module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012042058A
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English (en)
Japanese (ja)
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JP2013178378A (ja
JP2013178378A5 (https=
Inventor
寛幸 本原
寛幸 本原
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Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2012042058A priority Critical patent/JP5996215B2/ja
Priority to PCT/JP2013/052391 priority patent/WO2013129026A1/ja
Publication of JP2013178378A publication Critical patent/JP2013178378A/ja
Priority to US14/466,246 priority patent/US9625664B2/en
Publication of JP2013178378A5 publication Critical patent/JP2013178378A5/ja
Application granted granted Critical
Publication of JP5996215B2 publication Critical patent/JP5996215B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/0219—Electrical interface; User interface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • G01J1/0425—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using optical fibers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/293—Configurations of stacked chips characterised by non-galvanic coupling between the chips, e.g. capacitive coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
JP2012042058A 2012-02-28 2012-02-28 光電変換モジュールおよび光伝送ユニット Expired - Fee Related JP5996215B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012042058A JP5996215B2 (ja) 2012-02-28 2012-02-28 光電変換モジュールおよび光伝送ユニット
PCT/JP2013/052391 WO2013129026A1 (ja) 2012-02-28 2013-02-01 光電変換モジュールおよび光伝送ユニット
US14/466,246 US9625664B2 (en) 2012-02-28 2014-08-22 Photoelectric conversion module and optical transmission unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012042058A JP5996215B2 (ja) 2012-02-28 2012-02-28 光電変換モジュールおよび光伝送ユニット

Publications (3)

Publication Number Publication Date
JP2013178378A JP2013178378A (ja) 2013-09-09
JP2013178378A5 JP2013178378A5 (https=) 2015-04-02
JP5996215B2 true JP5996215B2 (ja) 2016-09-21

Family

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Family Applications (1)

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JP2012042058A Expired - Fee Related JP5996215B2 (ja) 2012-02-28 2012-02-28 光電変換モジュールおよび光伝送ユニット

Country Status (3)

Country Link
US (1) US9625664B2 (https=)
JP (1) JP5996215B2 (https=)
WO (1) WO2013129026A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6230388B2 (ja) * 2013-11-28 2017-11-15 オリンパス株式会社 内視鏡
US10025044B1 (en) * 2017-01-17 2018-07-17 International Business Machines Corporation Optical structure
JP6641330B2 (ja) * 2017-08-31 2020-02-05 株式会社フジクラ 撮像モジュール付きカテーテル
DE102017123798B4 (de) * 2017-10-12 2022-03-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterlaser und Herstellungsverfahren für optoelektronische Halbleiterbauteile
US20230054960A1 (en) * 2020-02-04 2023-02-23 Panasonic Intellectual Property Management Co., Ltd. Side-filling resin composition, semiconductor device, and method for removing side-filling member
US20230085957A1 (en) * 2021-09-22 2023-03-23 Apple Inc. Integrated optical transceiver

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8912376D0 (en) 1989-05-30 1989-07-12 Hughes Microelectronics Ltd Photoelectric components
FR2672697B1 (fr) 1991-02-08 1994-06-03 Alcatel Nv Dispositif optoelectronique monte sur substrat et connecte par fibre optique, et son procede de fabrication.
JP3166564B2 (ja) 1995-06-27 2001-05-14 松下電器産業株式会社 半導体レーザ実装体およびその製造方法
JPH11121653A (ja) * 1997-07-31 1999-04-30 Fuji Film Microdevices Co Ltd 半導体装置とその製造方法
JP2001059923A (ja) * 1999-06-16 2001-03-06 Seiko Epson Corp 光モジュール及びその製造方法、半導体装置並びに光伝達装置
JP2001250889A (ja) * 2000-03-06 2001-09-14 Matsushita Electric Ind Co Ltd 光素子の実装構造体およびその製造方法
JP4113722B2 (ja) * 2001-04-18 2008-07-09 松下電器産業株式会社 半導体モジュールとその製造方法
JP4062403B2 (ja) * 2001-11-06 2008-03-19 セイコーエプソン株式会社 光モジュールの製造方法
JP2003209332A (ja) * 2002-01-11 2003-07-25 Fujikura Ltd プリント配線基板、プリント配線基板の製造方法、及び実装基板
JP2004258528A (ja) * 2003-02-27 2004-09-16 Seiko Epson Corp 光通信モジュールの製造方法および電子機器
JP2004317627A (ja) * 2003-04-14 2004-11-11 Fujikura Ltd マウント、光モジュールおよび送受信モジュール
JP2005286284A (ja) * 2004-02-03 2005-10-13 Sony Chem Corp 機能素子実装モジュール並びに光機能素子実装モジュール及びその製造方法
JP2005268567A (ja) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd 基板およびその製造方法
JP4184371B2 (ja) 2005-10-03 2008-11-19 日本テキサス・インスツルメンツ株式会社 半導体チップ、半導体装置およびそれらの製造方法
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Also Published As

Publication number Publication date
US20140361153A1 (en) 2014-12-11
JP2013178378A (ja) 2013-09-09
US9625664B2 (en) 2017-04-18
WO2013129026A1 (ja) 2013-09-06

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