JP5996215B2 - 光電変換モジュールおよび光伝送ユニット - Google Patents

光電変換モジュールおよび光伝送ユニット Download PDF

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Publication number
JP5996215B2
JP5996215B2 JP2012042058A JP2012042058A JP5996215B2 JP 5996215 B2 JP5996215 B2 JP 5996215B2 JP 2012042058 A JP2012042058 A JP 2012042058A JP 2012042058 A JP2012042058 A JP 2012042058A JP 5996215 B2 JP5996215 B2 JP 5996215B2
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JP
Japan
Prior art keywords
hole
photoelectric conversion
substrate
protrusion
conversion module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2012042058A
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English (en)
Japanese (ja)
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JP2013178378A5 (enExample
JP2013178378A (ja
Inventor
寛幸 本原
寛幸 本原
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Olympus Corp
Original Assignee
Olympus Corp
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Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2012042058A priority Critical patent/JP5996215B2/ja
Priority to PCT/JP2013/052391 priority patent/WO2013129026A1/ja
Publication of JP2013178378A publication Critical patent/JP2013178378A/ja
Priority to US14/466,246 priority patent/US9625664B2/en
Publication of JP2013178378A5 publication Critical patent/JP2013178378A5/ja
Application granted granted Critical
Publication of JP5996215B2 publication Critical patent/JP5996215B2/ja
Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/0219—Electrical interface; User interface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
    • G01J1/0425—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using optical fibers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
JP2012042058A 2012-02-28 2012-02-28 光電変換モジュールおよび光伝送ユニット Expired - Fee Related JP5996215B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012042058A JP5996215B2 (ja) 2012-02-28 2012-02-28 光電変換モジュールおよび光伝送ユニット
PCT/JP2013/052391 WO2013129026A1 (ja) 2012-02-28 2013-02-01 光電変換モジュールおよび光伝送ユニット
US14/466,246 US9625664B2 (en) 2012-02-28 2014-08-22 Photoelectric conversion module and optical transmission unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012042058A JP5996215B2 (ja) 2012-02-28 2012-02-28 光電変換モジュールおよび光伝送ユニット

Publications (3)

Publication Number Publication Date
JP2013178378A JP2013178378A (ja) 2013-09-09
JP2013178378A5 JP2013178378A5 (enExample) 2015-04-02
JP5996215B2 true JP5996215B2 (ja) 2016-09-21

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JP2012042058A Expired - Fee Related JP5996215B2 (ja) 2012-02-28 2012-02-28 光電変換モジュールおよび光伝送ユニット

Country Status (3)

Country Link
US (1) US9625664B2 (enExample)
JP (1) JP5996215B2 (enExample)
WO (1) WO2013129026A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6230388B2 (ja) * 2013-11-28 2017-11-15 オリンパス株式会社 内視鏡
US10025044B1 (en) * 2017-01-17 2018-07-17 International Business Machines Corporation Optical structure
JP6641330B2 (ja) * 2017-08-31 2020-02-05 株式会社フジクラ 撮像モジュール付きカテーテル
DE102017123798B4 (de) * 2017-10-12 2022-03-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterlaser und Herstellungsverfahren für optoelektronische Halbleiterbauteile
JP7591720B2 (ja) * 2020-02-04 2024-11-29 パナソニックＩｐマネジメント株式会社 サイドフィル用樹脂組成物、半導体装置、及びサイドフィル材の除去方法
US20230085957A1 (en) * 2021-09-22 2023-03-23 Apple Inc. Integrated optical transceiver

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8912376D0 (en) * 1989-05-30 1989-07-12 Hughes Microelectronics Ltd Photoelectric components
FR2672697B1 (fr) * 1991-02-08 1994-06-03 Alcatel Nv Dispositif optoelectronique monte sur substrat et connecte par fibre optique, et son procede de fabrication.
JP3166564B2 (ja) 1995-06-27 2001-05-14 松下電器産業株式会社 半導体レーザ実装体およびその製造方法
JPH11121653A (ja) * 1997-07-31 1999-04-30 Fuji Film Microdevices Co Ltd 半導体装置とその製造方法
JP2001059923A (ja) * 1999-06-16 2001-03-06 Seiko Epson Corp 光モジュール及びその製造方法、半導体装置並びに光伝達装置
JP2001250889A (ja) * 2000-03-06 2001-09-14 Matsushita Electric Ind Co Ltd 光素子の実装構造体およびその製造方法
JP4113722B2 (ja) * 2001-04-18 2008-07-09 松下電器産業株式会社 半導体モジュールとその製造方法
JP4062403B2 (ja) * 2001-11-06 2008-03-19 セイコーエプソン株式会社 光モジュールの製造方法
JP2003209332A (ja) * 2002-01-11 2003-07-25 Fujikura Ltd プリント配線基板、プリント配線基板の製造方法、及び実装基板
JP2004258528A (ja) * 2003-02-27 2004-09-16 Seiko Epson Corp 光通信モジュールの製造方法および電子機器
JP2004317627A (ja) * 2003-04-14 2004-11-11 Fujikura Ltd マウント、光モジュールおよび送受信モジュール
JP2005286284A (ja) * 2004-02-03 2005-10-13 Sony Chem Corp 機能素子実装モジュール並びに光機能素子実装モジュール及びその製造方法
JP2005268567A (ja) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd 基板およびその製造方法
JP4184371B2 (ja) 2005-10-03 2008-11-19 日本テキサス・インスツルメンツ株式会社 半導体チップ、半導体装置およびそれらの製造方法
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Publication number Publication date
US20140361153A1 (en) 2014-12-11
WO2013129026A1 (ja) 2013-09-06
US9625664B2 (en) 2017-04-18
JP2013178378A (ja) 2013-09-09

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