JP5995309B2 - 半導体装置及びその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 65
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000010410 layer Substances 0.000 claims description 174
- 150000004767 nitrides Chemical class 0.000 claims description 47
- 239000011247 coating layer Substances 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 230000008018 melting Effects 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 12
- 238000004544 sputter deposition Methods 0.000 claims description 12
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052735 hafnium Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 239000007772 electrode material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 22
- 239000003870 refractory metal Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 11
- 229910052581 Si3N4 Inorganic materials 0.000 description 9
- 238000009832 plasma treatment Methods 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000001771 vacuum deposition Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229910002704 AlGaN Inorganic materials 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005546 reactive sputtering Methods 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66431—Unipolar field-effect transistors with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/47—Schottky barrier electrodes
- H01L29/475—Schottky barrier electrodes on AIII-BV compounds
Description
12 窒化物半導体層
14 チャネル層
16 電子供給層
18 第1絶縁膜
20 ゲート電極
22 Ni膜
24 Au膜
25 露出面
26 ソース電極
28 ドレイン電極
30 第2絶縁膜
32 ソース配線
34 ドレイン配線
36、36a フィールドプレート
37 ソースウォール
38 Niが拡散した領域
40 被覆層
42 開口
44 レジスト層
46 開口
Claims (6)
- 半導体層上に設けられた、Ni含有層を持つゲート電極と、
前記ゲート電極の上面と側面とを被覆し、融点が1600℃以上の金属又は前記金属の酸化物若しくは窒化物である被覆層と、
前記ゲート電極及び前記被覆層を覆うように設けられ、前記ゲート電極の段差の形状を反映した段差を有する絶縁膜と、
前記絶縁膜の段差を覆う位置に設けられた金属層と、を備えることを特徴とする半導体装置。 - 半導体層上に設けられた、Ni含有層を持つゲート電極と、
前記ゲート電極を覆うように設けられ、前記ゲート電極の段差の形状を反映した段差を有する絶縁膜と、
前記ゲート電極における前記Ni含有層と前記絶縁膜との間に設けられ、融点が1600℃以上の金属又は前記金属の酸化物若しくは窒化物である被覆層と、
前記絶縁膜の段差を覆う位置に設けられた金属層と、を備え、
前記絶縁膜は、前記被覆層の上面及び側面に接するように形成されてなることを特徴とする半導体装置。 - 前記融点が1600℃以上の金属は、Ti、Cr、Mo、Ta、W、およびHfのいずれかであることを特徴とする請求項1または2記載の半導体装置。
- 前記被覆層の厚さは、10nm以上且つ100nm以下であることを特徴とする請求項1から3のいずれか一項記載の半導体装置。
- 半導体層上に、内壁が逆テーパ形状の開口を有するレジスト層を形成する工程と、
前記レジスト層上および前記開口内の前記半導体層上に、Ni含有層を持つゲート電極の材料層を被着する工程と、
スパッタ法により、前記レジスト層上および前記ゲート電極における前記Ni含有層の露出面を覆って、融点が1600℃以上の金属又は前記金属の酸化物若しくは窒化物である被覆層を被着する工程と、
前記レジスト層を除去することで、前記レジスト層上の前記材料層および前記被覆層を除去する工程と、
前記被覆層上に、前記ゲート電極の段差の形状を反映した段差を有する絶縁膜を形成する工程と、
前記絶縁膜の段差を覆う位置に金属層を形成する工程と、を有することを特徴とする半導体装置の製造方法。 - 前記融点が1600℃以上の金属は、Ti、Cr、Mo、Ta、W、およびHfのいずれかであることを特徴とする請求項5記載の半導体装置の製造方法。
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JP2012074400A JP5995309B2 (ja) | 2012-03-28 | 2012-03-28 | 半導体装置及びその製造方法 |
US13/850,522 US20130256755A1 (en) | 2012-03-28 | 2013-03-26 | Semiconductor device and method for manufacturing the same |
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JP2013207086A JP2013207086A (ja) | 2013-10-07 |
JP2013207086A5 JP2013207086A5 (ja) | 2015-05-07 |
JP5995309B2 true JP5995309B2 (ja) | 2016-09-21 |
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Families Citing this family (14)
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JP6133191B2 (ja) | 2013-10-18 | 2017-05-24 | 古河電気工業株式会社 | 窒化物半導体装置、ダイオード、および電界効果トランジスタ |
JP6179445B2 (ja) * | 2014-04-11 | 2017-08-16 | 豊田合成株式会社 | 縦型ショットキーバリアダイオード、縦型ショットキーバリアダイオードの製造方法 |
US10056478B2 (en) | 2015-11-06 | 2018-08-21 | Taiwan Semiconductor Manufacturing Company Ltd. | High-electron-mobility transistor and manufacturing method thereof |
KR102261732B1 (ko) * | 2015-12-18 | 2021-06-09 | 한국전자통신연구원 | 전계 효과 트랜지스터 |
TWI718300B (zh) * | 2016-05-11 | 2021-02-11 | 南韓商Rfhic公司 | 半導體電晶體及其加工方法 |
US10217827B2 (en) * | 2016-05-11 | 2019-02-26 | Rfhic Corporation | High electron mobility transistor (HEMT) |
JP6724685B2 (ja) * | 2016-09-23 | 2020-07-15 | 住友電気工業株式会社 | 半導体装置 |
KR102044244B1 (ko) * | 2016-12-13 | 2019-12-02 | (주)웨이비스 | 질화물계 전자소자 및 그 제조방법 |
US20190148498A1 (en) * | 2017-11-13 | 2019-05-16 | Win Semiconductors Corp. | Passivation Structure For GaN Field Effect Transistor |
CN110277445A (zh) * | 2018-03-16 | 2019-09-24 | 中国科学院上海微系统与信息技术研究所 | 基于AlGaN/p-GaN沟道的增强型纵向功率器件及制作方法 |
JP7047615B2 (ja) | 2018-06-13 | 2022-04-05 | 住友電工デバイス・イノベーション株式会社 | 半導体デバイスの製造方法 |
CN112103337B (zh) * | 2019-06-18 | 2022-02-08 | 苏州能讯高能半导体有限公司 | 一种半导体器件及其制备方法 |
CN113725283A (zh) * | 2021-11-04 | 2021-11-30 | 深圳市时代速信科技有限公司 | 半导体器件及其制备方法 |
CN113793867B (zh) * | 2021-11-16 | 2022-03-01 | 深圳市时代速信科技有限公司 | 一种电极结构及其制作方法 |
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US6350999B1 (en) * | 1999-02-05 | 2002-02-26 | Matsushita Electric Industrial Co., Ltd. | Electron-emitting device |
JP4221697B2 (ja) * | 2002-06-17 | 2009-02-12 | 日本電気株式会社 | 半導体装置 |
CN101238560B (zh) * | 2005-06-10 | 2011-08-31 | 日本电气株式会社 | 场效应晶体管 |
EP1938385B1 (en) * | 2005-09-07 | 2014-12-03 | Cree, Inc. | Transistors with fluorine treatment |
EP2065925B1 (en) * | 2006-09-20 | 2016-04-20 | Fujitsu Limited | Field-effect transistor |
US7985984B2 (en) * | 2007-02-28 | 2011-07-26 | Nec Corporation | III-nitride semiconductor field effect transistor |
US8212290B2 (en) * | 2007-03-23 | 2012-07-03 | Cree, Inc. | High temperature performance capable gallium nitride transistor |
JP5708910B2 (ja) * | 2010-03-30 | 2015-04-30 | ソニー株式会社 | 薄膜トランジスタおよびその製造方法、並びに表示装置 |
JP2011238805A (ja) * | 2010-05-11 | 2011-11-24 | Nec Corp | 電界効果トランジスタ、電界効果トランジスタの製造方法および電子装置 |
JP2012175089A (ja) * | 2011-02-24 | 2012-09-10 | Fujitsu Ltd | 半導体装置及び半導体装置の製造方法 |
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2012
- 2012-03-28 JP JP2012074400A patent/JP5995309B2/ja active Active
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |