JP5995045B2 - 基板加工方法及び基板加工装置 - Google Patents

基板加工方法及び基板加工装置 Download PDF

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Publication number
JP5995045B2
JP5995045B2 JP2012023333A JP2012023333A JP5995045B2 JP 5995045 B2 JP5995045 B2 JP 5995045B2 JP 2012023333 A JP2012023333 A JP 2012023333A JP 2012023333 A JP2012023333 A JP 2012023333A JP 5995045 B2 JP5995045 B2 JP 5995045B2
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Japan
Prior art keywords
substrate
laser
condensing
substrate processing
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012023333A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013161976A (ja
JP2013161976A5 (enExample
Inventor
国司　洋介
洋介 国司
鈴木　秀樹
秀樹 鈴木
利香 松尾
利香 松尾
順一 池野
順一 池野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Saitama University NUC
Original Assignee
Shin Etsu Polymer Co Ltd
Saitama University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Saitama University NUC filed Critical Shin Etsu Polymer Co Ltd
Priority to JP2012023333A priority Critical patent/JP5995045B2/ja
Priority to PCT/JP2013/052322 priority patent/WO2013118645A1/ja
Publication of JP2013161976A publication Critical patent/JP2013161976A/ja
Publication of JP2013161976A5 publication Critical patent/JP2013161976A5/ja
Application granted granted Critical
Publication of JP5995045B2 publication Critical patent/JP5995045B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/04—After-treatment of single crystals or homogeneous polycrystalline material with defined structure using electric or magnetic fields or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012023333A 2012-02-06 2012-02-06 基板加工方法及び基板加工装置 Active JP5995045B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012023333A JP5995045B2 (ja) 2012-02-06 2012-02-06 基板加工方法及び基板加工装置
PCT/JP2013/052322 WO2013118645A1 (ja) 2012-02-06 2013-02-01 基板加工方法及び基板加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012023333A JP5995045B2 (ja) 2012-02-06 2012-02-06 基板加工方法及び基板加工装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016157819A Division JP6202694B2 (ja) 2016-08-10 2016-08-10 基板加工方法及び基板加工装置

Publications (3)

Publication Number Publication Date
JP2013161976A JP2013161976A (ja) 2013-08-19
JP2013161976A5 JP2013161976A5 (enExample) 2014-11-13
JP5995045B2 true JP5995045B2 (ja) 2016-09-21

Family

ID=48947409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012023333A Active JP5995045B2 (ja) 2012-02-06 2012-02-06 基板加工方法及び基板加工装置

Country Status (2)

Country Link
JP (1) JP5995045B2 (enExample)
WO (1) WO2013118645A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015123466A (ja) * 2013-12-26 2015-07-06 信越ポリマー株式会社 基板加工装置及び基板加工方法
JP2015123465A (ja) * 2013-12-26 2015-07-06 信越ポリマー株式会社 基板加工装置及び基板加工方法
DE102015000449A1 (de) 2015-01-15 2016-07-21 Siltectra Gmbh Festkörperteilung mittels Stoffumwandlung
JP6381110B2 (ja) * 2014-04-16 2018-08-29 信越ポリマー株式会社 基板加工方法及び基板
EP3399542B1 (de) 2014-11-27 2023-04-12 Siltectra GmbH Festkörperteilung mittels stoffumwandlung
US10930560B2 (en) 2014-11-27 2021-02-23 Siltectra Gmbh Laser-based separation method
JP7017728B2 (ja) * 2017-06-29 2022-02-09 国立大学法人埼玉大学 結晶基板および結晶基板加工方法
JP2020141009A (ja) * 2019-02-27 2020-09-03 パナソニックＩｐマネジメント株式会社 基板材料およびレーザ加工方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4954653B2 (ja) * 2006-09-19 2012-06-20 浜松ホトニクス株式会社 レーザ加工方法
JP2009200383A (ja) * 2008-02-25 2009-09-03 Seiko Epson Corp 基板分割方法、及び表示装置の製造方法
JP5645000B2 (ja) * 2010-01-26 2014-12-24 国立大学法人埼玉大学 基板加工方法
JP5770436B2 (ja) * 2010-07-08 2015-08-26 株式会社ディスコ レーザー加工装置およびレーザー加工方法

Also Published As

Publication number Publication date
WO2013118645A1 (ja) 2013-08-15
JP2013161976A (ja) 2013-08-19

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