JP5982627B2 - 光通信モジュールの製造方法 - Google Patents
光通信モジュールの製造方法 Download PDFInfo
- Publication number
- JP5982627B2 JP5982627B2 JP2011246305A JP2011246305A JP5982627B2 JP 5982627 B2 JP5982627 B2 JP 5982627B2 JP 2011246305 A JP2011246305 A JP 2011246305A JP 2011246305 A JP2011246305 A JP 2011246305A JP 5982627 B2 JP5982627 B2 JP 5982627B2
- Authority
- JP
- Japan
- Prior art keywords
- optical element
- printed wiring
- wiring board
- substrate
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Description
(2) 光素子基板
(3) ベース基板
(4) 鏡筒
(5) プリント配線板
(6) 光素子
(7) 配線端子
(8) レンズ
(12) 半円形ビアホール
(14) パッド
(15) Agペースト(導電性接合部材)
Claims (3)
- プリント配線板の所要位置に光素子が接合されることで形成された光素子基板と、レンズが設けられた鏡筒とを備えている光通信モジュールの製造方法であって、プリント配線板を製作する工程と、プリント配線板の横寸法および縦寸法を実測する工程と、横寸法および縦寸法の実測値に基づいて、プリント配線板における光素子配置位置を算出する工程と、光素子配置の算出位置に光素子を接合して光素子基板を製作する工程と、光素子配置の算出位置に合わせて鏡筒を光素子基板に接合する工程とを備えていることを特徴とする光通信モジュールの製造方法。
- 鏡筒が接合された光素子基板をベース基板に接合する工程をさらに備えており、光素子基板は、長方形状とされたプリント配線板の各長辺に沿って半円形に切断された複数のビアホールが所定間隔で設けられたものとされており、光素子基板をベース基板に接合する工程において、ベース基板に設けられたパッドと半円形に切断された複数のビアホールとを重ねて、各ビアホールに塗布された導電性接合部材によって光素子基板とベース基板とを接合することを特徴とする請求項1の光通信モジュールの製造方法。
- プリント配線板を製作する工程は、1枚分のプリント配線板が縦・横に複数枚一連で形成された基板シートを製作する工程と、1枚分のプリント配線板を所定の大きさに切断する工程とからなり、切断工程は、基板シートから1枚分のプリント配線板を1枚ずつ切り離した後、さらに、プリント配線板の幅を狭くする切断を行うものであることを特徴とする請求項1または2の光通信モジュールの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011246305A JP5982627B2 (ja) | 2011-11-10 | 2011-11-10 | 光通信モジュールの製造方法 |
KR1020120126672A KR20130051902A (ko) | 2011-11-10 | 2012-11-09 | 광통신 모듈 및 그 제조 방법 |
US13/673,225 US8876414B2 (en) | 2011-11-10 | 2012-11-09 | Optical communication module and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011246305A JP5982627B2 (ja) | 2011-11-10 | 2011-11-10 | 光通信モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013104883A JP2013104883A (ja) | 2013-05-30 |
JP5982627B2 true JP5982627B2 (ja) | 2016-08-31 |
Family
ID=48280747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011246305A Active JP5982627B2 (ja) | 2011-11-10 | 2011-11-10 | 光通信モジュールの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8876414B2 (ja) |
JP (1) | JP5982627B2 (ja) |
KR (1) | KR20130051902A (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3308725B1 (en) | 2006-06-30 | 2023-06-14 | Atheromed, Inc. | Contra-rotating cutting assembly and atherectomy device |
US7981128B2 (en) | 2006-06-30 | 2011-07-19 | Atheromed, Inc. | Atherectomy devices and methods |
US8361094B2 (en) | 2006-06-30 | 2013-01-29 | Atheromed, Inc. | Atherectomy devices and methods |
US8070762B2 (en) | 2007-10-22 | 2011-12-06 | Atheromed Inc. | Atherectomy devices and methods |
EP3674767B1 (en) * | 2015-01-16 | 2021-08-25 | LG Innotek Co., Ltd. | Lens driving device, camera module and optical apparatus |
US10871701B2 (en) | 2016-07-21 | 2020-12-22 | Lg Innotek Co., Ltd. | Lens driving device, and camera module and optical device, which include same |
CN112020226B (zh) * | 2020-08-25 | 2021-09-10 | 胜宏科技(惠州)股份有限公司 | 一种pcb板半槽孔的制作方法 |
US11304723B1 (en) | 2020-12-17 | 2022-04-19 | Avantec Vascular Corporation | Atherectomy devices that are self-driving with controlled deflection |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4790894A (en) * | 1987-02-19 | 1988-12-13 | Hitachi Condenser Co., Ltd. | Process for producing printed wiring board |
JPS63233598A (ja) * | 1987-03-23 | 1988-09-29 | 日立エーアイシー株式会社 | 印刷配線板及びその製造方法 |
JP3576798B2 (ja) | 1998-04-03 | 2004-10-13 | 日本電気エンジニアリング株式会社 | 受光モジュール光軸調整方法 |
US6528870B2 (en) * | 2000-01-28 | 2003-03-04 | Kabushiki Kaisha Toshiba | Semiconductor device having a plurality of stacked wiring boards |
JP2002057279A (ja) * | 2000-01-28 | 2002-02-22 | Toshiba Corp | 半導体装置、積層型半導体装置及びその製造方法 |
JP3691361B2 (ja) | 2000-06-30 | 2005-09-07 | 日本オプネクスト株式会社 | 光素子モジュールの組み立て装置及び光軸調整方法 |
JP3896951B2 (ja) * | 2002-11-13 | 2007-03-22 | 松下電器産業株式会社 | 光通信用送受光モジュール |
WO2006006197A1 (ja) * | 2004-05-26 | 2006-01-19 | Hoya Corporation | 光モジュール及び光波長合分波装置 |
JP2007123428A (ja) * | 2005-10-26 | 2007-05-17 | Nec Electronics Corp | フレキシブル基板 |
JP2007317901A (ja) * | 2006-05-26 | 2007-12-06 | Sumitomo Electric Ind Ltd | 光トランシーバ |
CN101517447B (zh) * | 2006-09-28 | 2011-05-18 | 三菱丽阳株式会社 | 塑料光纤缆及使用该缆的信号传输方法 |
US7837399B2 (en) * | 2008-01-04 | 2010-11-23 | Finisar Corporation | Electromagnetic interference containment structures |
JP2011100769A (ja) * | 2009-11-04 | 2011-05-19 | Sumitomo Electric Ind Ltd | 光モジュール |
JP2011154123A (ja) * | 2010-01-26 | 2011-08-11 | Panasonic Electric Works Co Ltd | 光ファイバ用ソケット |
-
2011
- 2011-11-10 JP JP2011246305A patent/JP5982627B2/ja active Active
-
2012
- 2012-11-09 US US13/673,225 patent/US8876414B2/en active Active
- 2012-11-09 KR KR1020120126672A patent/KR20130051902A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2013104883A (ja) | 2013-05-30 |
US8876414B2 (en) | 2014-11-04 |
US20130121652A1 (en) | 2013-05-16 |
KR20130051902A (ko) | 2013-05-21 |
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