JP5981555B2 - 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置および液晶表示装置 - Google Patents

感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置および液晶表示装置 Download PDF

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Publication number
JP5981555B2
JP5981555B2 JP2014532874A JP2014532874A JP5981555B2 JP 5981555 B2 JP5981555 B2 JP 5981555B2 JP 2014532874 A JP2014532874 A JP 2014532874A JP 2014532874 A JP2014532874 A JP 2014532874A JP 5981555 B2 JP5981555 B2 JP 5981555B2
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Japan
Prior art keywords
photosensitive resin
resin composition
compound
cured film
group
Prior art date
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Expired - Fee Related
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JP2014532874A
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English (en)
Japanese (ja)
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JPWO2014034302A1 (ja
Inventor
大助 柏木
大助 柏木
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Fujifilm Corp
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Fujifilm Corp
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Publication of JPWO2014034302A1 publication Critical patent/JPWO2014034302A1/ja
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Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
JP2014532874A 2012-09-03 2013-07-12 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置および液晶表示装置 Expired - Fee Related JP5981555B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012192994 2012-09-03
JP2012192994 2012-09-03
PCT/JP2013/069162 WO2014034302A1 (ja) 2012-09-03 2013-07-12 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置および液晶表示装置

Publications (2)

Publication Number Publication Date
JPWO2014034302A1 JPWO2014034302A1 (ja) 2016-08-08
JP5981555B2 true JP5981555B2 (ja) 2016-08-31

Family

ID=50183122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014532874A Expired - Fee Related JP5981555B2 (ja) 2012-09-03 2013-07-12 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置および液晶表示装置

Country Status (4)

Country Link
JP (1) JP5981555B2 (zh)
KR (1) KR20150038239A (zh)
TW (1) TWI622856B (zh)
WO (1) WO2014034302A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6397697B2 (ja) * 2014-08-27 2018-09-26 東京応化工業株式会社 層間絶縁膜形成用感光性樹脂組成物、層間絶縁膜及び層間絶縁膜の形成方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006276159A (ja) * 2005-03-28 2006-10-12 Toray Ind Inc スペーサー形成用感放射線性組成物およびそれを用いた液晶表示装置用基板の製造方法、液晶表示装置用基板
CN101467100B (zh) * 2006-06-15 2012-06-06 日产化学工业株式会社 含有具有环结构的高分子化合物的正型感光性树脂组合物
CN102325819B (zh) * 2009-02-21 2014-11-12 索尼化学&信息部件株式会社 保护膜形成用原料液、保护膜、带有保护膜的布线基板
JP2011064869A (ja) * 2009-09-16 2011-03-31 Fujifilm Corp 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、及び、液晶表示装置
JP5736718B2 (ja) * 2010-10-18 2015-06-17 Jsr株式会社 感放射線性樹脂組成物、硬化膜及びその形成方法

Also Published As

Publication number Publication date
TW201411281A (zh) 2014-03-16
KR20150038239A (ko) 2015-04-08
WO2014034302A1 (ja) 2014-03-06
TWI622856B (zh) 2018-05-01
JPWO2014034302A1 (ja) 2016-08-08

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