JP5980554B2 - 電気的接続部材、検査方法及び電気的接続部材の製造方法 - Google Patents
電気的接続部材、検査方法及び電気的接続部材の製造方法 Download PDFInfo
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- JP5980554B2 JP5980554B2 JP2012097664A JP2012097664A JP5980554B2 JP 5980554 B2 JP5980554 B2 JP 5980554B2 JP 2012097664 A JP2012097664 A JP 2012097664A JP 2012097664 A JP2012097664 A JP 2012097664A JP 5980554 B2 JP5980554 B2 JP 5980554B2
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- insulating
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2012097664A JP5980554B2 (ja) | 2012-04-23 | 2012-04-23 | 電気的接続部材、検査方法及び電気的接続部材の製造方法 |
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| JP2012097664A JP5980554B2 (ja) | 2012-04-23 | 2012-04-23 | 電気的接続部材、検査方法及び電気的接続部材の製造方法 |
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| Publication Number | Publication Date |
|---|---|
| JP2013224880A JP2013224880A (ja) | 2013-10-31 |
| JP2013224880A5 JP2013224880A5 (enExample) | 2015-04-16 |
| JP5980554B2 true JP5980554B2 (ja) | 2016-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2012097664A Active JP5980554B2 (ja) | 2012-04-23 | 2012-04-23 | 電気的接続部材、検査方法及び電気的接続部材の製造方法 |
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| JP (1) | JP5980554B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107251339B (zh) * | 2015-02-26 | 2020-07-24 | 积水保力马科技株式会社 | 弹性连接器 |
| WO2019065089A1 (ja) * | 2017-09-29 | 2019-04-04 | 古河電気工業株式会社 | 異方導電性シートおよび異方導電性シートの製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003203954A (ja) * | 1999-11-18 | 2003-07-18 | Ibiden Co Ltd | 検査装置およびプローブカード |
| US20040012405A1 (en) * | 2002-07-19 | 2004-01-22 | Chipmos Technologies (Bermuda) Ltd. | Probe card with full wafer contact configuration |
| JP2004347427A (ja) * | 2003-05-21 | 2004-12-09 | Innotech Corp | プローブカード装置及びその製造方法 |
| JP4583224B2 (ja) * | 2005-04-05 | 2010-11-17 | 京セラ株式会社 | 測定用配線基板、プローブカード及び評価装置 |
| JP2008535284A (ja) * | 2005-04-05 | 2008-08-28 | エス ヴィ プルーブ ピーティーイー リミテッド | セラミック・スペース・トランスフォーマのプローブ・パッド構造 |
| JP2008241595A (ja) * | 2007-03-28 | 2008-10-09 | Kyocera Corp | プローブカード・アセンブリ用基板およびそれを用いたプローブカード |
| WO2009113486A1 (ja) * | 2008-03-14 | 2009-09-17 | 富士フイルム株式会社 | プローブカード |
| JP2011069759A (ja) * | 2009-09-28 | 2011-04-07 | Kyocera Corp | プローブカード用基板，プローブカードおよびこれを用いた半導体ウエハ検査装置 |
| JP2011151185A (ja) * | 2010-01-21 | 2011-08-04 | Shinko Electric Ind Co Ltd | 配線基板及び半導体装置 |
| JP5536481B2 (ja) * | 2010-02-03 | 2014-07-02 | Ｈｏｙａ株式会社 | 情報記録媒体用ガラス基板の製造方法及び情報記録媒体の製造方法 |
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- 2012-04-23 JP JP2012097664A patent/JP5980554B2/ja active Active
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| Publication number | Publication date |
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| JP2013224880A (ja) | 2013-10-31 |
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