JP5972881B2 - 逆導通パワー半導体デバイス - Google Patents

逆導通パワー半導体デバイス Download PDF

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Publication number
JP5972881B2
JP5972881B2 JP2013530733A JP2013530733A JP5972881B2 JP 5972881 B2 JP5972881 B2 JP 5972881B2 JP 2013530733 A JP2013530733 A JP 2013530733A JP 2013530733 A JP2013530733 A JP 2013530733A JP 5972881 B2 JP5972881 B2 JP 5972881B2
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Japan
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layer
igct
cathode
cells
cell
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JP2013530733A
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Japanese (ja)
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JP2013543260A (ja
JP2013543260A5 (enExample
Inventor
ラヒモ、ムナフ
アーノルド、マルティン
スティアスニー、トーマス
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アーベーベー・テヒノロギー・アーゲー
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Publication of JP2013543260A5 publication Critical patent/JP2013543260A5/ja
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00Thyristors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00Thyristors
    • H10D18/80Bidirectional devices, e.g. triacs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00Thyristors
    • H10D18/221Thyristors having amplifying gate structures, e.g. cascade configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00Thyristors
    • H10D18/60Gate-turn-off devices 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/101Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
    • H10D84/131Thyristors having built-in components
    • H10D84/135Thyristors having built-in components the built-in components being diodes
    • H10D84/136Thyristors having built-in components the built-in components being diodes in anti-parallel configurations, e.g. reverse current thyristor [RCT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/141Anode or cathode regions of thyristors; Collector or emitter regions of gated bipolar-mode devices, e.g. of IGBTs
    • H10D62/142Anode regions of thyristors or collector regions of gated bipolar-mode devices

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  • Thyristors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Junction Field-Effect Transistors (AREA)
JP2013530733A 2010-09-29 2011-09-29 逆導通パワー半導体デバイス Active JP5972881B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10181546.2 2010-09-29
EP10181546 2010-09-29
PCT/EP2011/066979 WO2012041958A2 (en) 2010-09-29 2011-09-29 Reverse-conducting power semiconductor device

Publications (3)

Publication Number Publication Date
JP2013543260A JP2013543260A (ja) 2013-11-28
JP2013543260A5 JP2013543260A5 (enExample) 2016-06-16
JP5972881B2 true JP5972881B2 (ja) 2016-08-17

Family

ID=43743553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013530733A Active JP5972881B2 (ja) 2010-09-29 2011-09-29 逆導通パワー半導体デバイス

Country Status (6)

Country Link
US (1) US8847277B2 (enExample)
EP (1) EP2622639B1 (enExample)
JP (1) JP5972881B2 (enExample)
KR (1) KR101749671B1 (enExample)
CN (1) CN103119715B (enExample)
WO (1) WO2012041958A2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015078657A1 (en) * 2013-11-29 2015-06-04 Abb Technology Ag Reverse-conducting power semiconductor device
EP2930753A1 (en) 2014-04-09 2015-10-14 ABB Technology AG Turn-off power semiconductor device
EP3130004B1 (en) * 2014-04-10 2019-05-08 ABB Schweiz AG Turn-off power semiconductor device and method for manufacturing the same
EP2960941B1 (en) 2014-06-26 2017-01-04 ABB Schweiz AG Reverse-conducting power semiconductor device
JP6602380B2 (ja) * 2014-12-17 2019-11-06 アーベーベー・シュバイツ・アーゲー 双方向パワー半導体デバイス
CN104637997A (zh) * 2015-01-28 2015-05-20 电子科技大学 一种双模逆导门极换流晶闸管及其制备方法
EP3073530B1 (en) * 2015-03-23 2017-05-03 ABB Schweiz AG Reverse conducting power semiconductor device
CN105590959B (zh) * 2015-12-17 2018-05-29 清华大学 具有双p基区门阴极结构的门极换流晶闸管及其制备方法
CN115039233A (zh) 2020-02-03 2022-09-09 日立能源瑞士股份公司 反向导通功率半导体器件及其制造方法
US12342559B2 (en) 2020-03-31 2025-06-24 Hitachi Energy Ltd Turn-off power semiconductor device with gate runners
WO2021197774A1 (en) 2020-03-31 2021-10-07 Abb Power Grids Switzerland Ag Power semiconductor device comprising a thyristor and a bipolar junction transistor
DE212021000403U1 (de) 2020-08-31 2023-02-24 Hitachi Energy Switzerland Ag Elektronische Vorrichtung, Gehäuse und Halbleiterchip dafür
EP4053915B1 (en) * 2021-03-02 2024-06-19 Hitachi Energy Ltd Gate-commuted thyristor cell with a base region having a varying thickness
WO2023099298A1 (en) 2021-12-03 2023-06-08 Hitachi Energy Switzerland Ag Semiconductor device and method for operating a semiconductor device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5342234B2 (enExample) 1973-02-12 1978-11-09
CH668505A5 (de) 1985-03-20 1988-12-30 Bbc Brown Boveri & Cie Halbleiterbauelement.
DE4403429C2 (de) 1994-02-04 1997-09-18 Asea Brown Boveri Abschaltbares Halbleiterbauelement
US5594261A (en) * 1994-04-05 1997-01-14 Harris Corporation Device for isolating parallel sub-elements with reverse conducting diode regions
JP3571353B2 (ja) * 1998-09-10 2004-09-29 三菱電機株式会社 半導体装置
US20040142573A1 (en) * 2003-01-16 2004-07-22 Jun Osanai Method for manufacturing MOSFET semiconductor device
JP4471575B2 (ja) * 2003-02-25 2010-06-02 三菱電機株式会社 圧接型半導体装置
US7489490B2 (en) * 2006-06-07 2009-02-10 International Rectifier Corporation Current limiting MOSFET structure for solid state relays

Also Published As

Publication number Publication date
JP2013543260A (ja) 2013-11-28
KR101749671B1 (ko) 2017-06-21
US20130207157A1 (en) 2013-08-15
WO2012041958A3 (en) 2012-08-02
US8847277B2 (en) 2014-09-30
EP2622639B1 (en) 2015-01-21
CN103119715B (zh) 2016-08-03
WO2012041958A2 (en) 2012-04-05
KR20130100144A (ko) 2013-09-09
EP2622639A2 (en) 2013-08-07
CN103119715A (zh) 2013-05-22

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