JP5970909B2 - クランプ機構及び基板貼り合わせ装置 - Google Patents

クランプ機構及び基板貼り合わせ装置 Download PDF

Info

Publication number
JP5970909B2
JP5970909B2 JP2012074651A JP2012074651A JP5970909B2 JP 5970909 B2 JP5970909 B2 JP 5970909B2 JP 2012074651 A JP2012074651 A JP 2012074651A JP 2012074651 A JP2012074651 A JP 2012074651A JP 5970909 B2 JP5970909 B2 JP 5970909B2
Authority
JP
Japan
Prior art keywords
substrate holder
substrate
coupling
coupled
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012074651A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013207094A5 (enExample
JP2013207094A (ja
Inventor
白数　廣
廣 白数
前田　栄裕
栄裕 前田
教宏 三池
教宏 三池
伸之 笹倉
伸之 笹倉
翔太 宮崎
翔太 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2012074651A priority Critical patent/JP5970909B2/ja
Publication of JP2013207094A publication Critical patent/JP2013207094A/ja
Publication of JP2013207094A5 publication Critical patent/JP2013207094A5/ja
Application granted granted Critical
Publication of JP5970909B2 publication Critical patent/JP5970909B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2012074651A 2012-03-28 2012-03-28 クランプ機構及び基板貼り合わせ装置 Active JP5970909B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012074651A JP5970909B2 (ja) 2012-03-28 2012-03-28 クランプ機構及び基板貼り合わせ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012074651A JP5970909B2 (ja) 2012-03-28 2012-03-28 クランプ機構及び基板貼り合わせ装置

Publications (3)

Publication Number Publication Date
JP2013207094A JP2013207094A (ja) 2013-10-07
JP2013207094A5 JP2013207094A5 (enExample) 2015-05-21
JP5970909B2 true JP5970909B2 (ja) 2016-08-17

Family

ID=49525886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012074651A Active JP5970909B2 (ja) 2012-03-28 2012-03-28 クランプ機構及び基板貼り合わせ装置

Country Status (1)

Country Link
JP (1) JP5970909B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11260679B2 (en) * 2018-12-21 2022-03-01 Kateeva, Inc. Gripping for print substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4852891B2 (ja) * 2005-05-31 2012-01-11 株式会社ニコン ウェハホルダ、ウェハ積層方法及び積層型半導体装置製造方法
JP5098165B2 (ja) * 2005-12-08 2012-12-12 株式会社ニコン ウェハの接合方法、接合装置及び積層型半導体装置の製造方法
JP5577585B2 (ja) * 2008-11-12 2014-08-27 株式会社ニコン 基板保持部材、接合装置および接合方法

Also Published As

Publication number Publication date
JP2013207094A (ja) 2013-10-07

Similar Documents

Publication Publication Date Title
JP6112016B2 (ja) 基板ホルダ及び基板貼り合わせ装置
CN101874288B (zh) 基板保持部件、基板接合装置、叠层基板制造装置、基板接合方法、叠层基板制造方法和叠层半导体装置制造方法
JP5979135B2 (ja) 基板貼り合わせ装置、基板保持装置、基板貼り合わせ方法、基盤保持方法、積層半導体装置および重ね合わせ基板
JP6051523B2 (ja) 基板ホルダ対、基板接合装置およびデバイスの製造方法
JP5305220B2 (ja) 基板張り合わせ装置
JP5970909B2 (ja) クランプ機構及び基板貼り合わせ装置
JP5428638B2 (ja) ステージ装置、基板貼り合わせ装置、基板貼り合わせ方法、半導体製造方法および基板ホルダ
JP5476705B2 (ja) 積層半導体製造装置、積層半導体製造方法および基板ホルダラック
JP5593748B2 (ja) 位置合わせ装置、基板貼り合わせ装置および基板貼り合わせ方法
JP5493713B2 (ja) 基板ホルダ、基板貼り合わせ装置、基板ホルダ対および搬送装置
JP2012253269A (ja) 基板ホルダ及び基板貼り合わせ装置
TWI836247B (zh) 基板貼合裝置及半導體裝置之製造方法
JP2012253273A (ja) 基板貼り合わせ装置
JP2014222778A (ja) ステージ装置、基板貼り合わせ装置
JP2013026555A (ja) 管理装置
JP5853425B2 (ja) 基板貼り合わせ装置
JP2013232663A (ja) 基板ホルダ装置及び基板張り合わせ装置
JP2011129777A (ja) 基板重ね合わせ装置及びデバイスの製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150330

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150407

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151013

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20151015

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151211

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160614

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160627

R150 Certificate of patent or registration of utility model

Ref document number: 5970909

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360