JP5964504B2 - 溶接接合部を製造し、冷却ｘ線管を用いて溶接接合部の画像を形成する方法 - Google Patents

溶接接合部を製造し、冷却ｘ線管を用いて溶接接合部の画像を形成する方法 Download PDF

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JP5964504B2
JP5964504B2 JP2015516581A JP2015516581A JP5964504B2 JP 5964504 B2 JP5964504 B2 JP 5964504B2 JP 2015516581 A JP2015516581 A JP 2015516581A JP 2015516581 A JP2015516581 A JP 2015516581A JP 5964504 B2 JP5964504 B2 JP 5964504B2
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housing
detector
refrigerant
tube
ray
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JP2015526701A (ja
Inventor
クリスティアン・ボルグマン
ミカエル・クロッセン−フォン・ランケン・シュルツ
ハンス−ペーター・ローマン
カーステン・ニーポルド
アネット・ノッツェル
ユルゲン・シュテファン
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シーメンス アクティエンゲゼルシャフト
シーメンス アクティエンゲゼルシャフト
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/003—Cooling means for welding or cutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/18—Investigating the presence of flaws defects or foreign matter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J35/00—X-ray tubes
    • H01J35/02—Details
    • H01J35/16—Vessels; Containers; Shields associated therewith
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05G—X-RAY TECHNIQUE
    • H05G1/00—X-ray apparatus involving X-ray tubes; Circuits therefor
    • H05G1/02—Constructional details
    • H05G1/025—Means for cooling the X-ray tube or the generator
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/629—Specific applications or type of materials welds, bonds, sealing compounds

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  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Quality & Reliability (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2015516581A 2012-06-14 2013-06-11 溶接接合部を製造し、冷却ｘ線管を用いて溶接接合部の画像を形成する方法 Expired - Fee Related JP5964504B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12171901.7A EP2674240A1 (de) 2012-06-14 2012-06-14 Verfahren zum Herstellen einer Schweißverbindung mit Erstellen einer Aufnahme der Schweissverbindung mit gekühlten Röntgenröhren
EP12171901.7 2012-06-14
PCT/EP2013/061961 WO2013186189A1 (de) 2012-06-14 2013-06-11 Verfahren zum herstellen einer schweissverbindung mit erstellen einer aufnahme der schweissverbindung mit gekühlten röntgenröhren

Publications (2)

Publication Number Publication Date
JP2015526701A JP2015526701A (ja) 2015-09-10
JP5964504B2 true JP5964504B2 (ja) 2016-08-03

Family

ID=48652033

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JP2015516581A Expired - Fee Related JP5964504B2 (ja) 2012-06-14 2013-06-11 溶接接合部を製造し、冷却ｘ線管を用いて溶接接合部の画像を形成する方法

Country Status (7)

Country Link
US (1) US20150158125A1 (enExample)
EP (2) EP2674240A1 (enExample)
JP (1) JP5964504B2 (enExample)
KR (1) KR20150017351A (enExample)
CN (1) CN104487201A (enExample)
IN (1) IN2014DN09459A (enExample)
WO (1) WO2013186189A1 (enExample)

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* Cited by examiner, † Cited by third party
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CN105699404A (zh) * 2016-03-07 2016-06-22 马翼 一种用于工业生产的x射线探伤机
DE102017208576A1 (de) * 2016-05-25 2017-11-30 Sms Group Gmbh Vorrichtung und Verfahren zum Ermitteln einer Mikrostruktur eines Metallprodukts sowie metallurgische Anlage
US9859029B2 (en) * 2016-07-23 2018-01-02 Rising Star Pathway, a California Corporation X-ray laser microscopy sample analysis system and method
CN107068217B (zh) * 2017-06-01 2019-05-24 哈电集团（秦皇岛）重型装备有限公司 高温气冷堆换热管焊缝x射线探伤方法
KR102377160B1 (ko) * 2020-05-21 2022-03-22 주식회사 포스코 실시간 용접부 검출 기능을 갖는 용접 장치 및 실시간 용접부 검출 방법

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US3766386A (en) * 1971-11-03 1973-10-16 Alcan Res & Dev Profile measurement of moving metal strip
FR2467398A1 (fr) * 1979-10-10 1981-04-17 Alsthom Atlantique Cassette refrigeree pour films
JPS6344177U (enExample) * 1986-09-08 1988-03-24
US5189279A (en) * 1991-12-30 1993-02-23 General Electric Company Steam turbine rotor welding
DE4302286C1 (de) * 1993-01-25 1994-06-23 Mannesmann Ag Einrichtung zur filmlosen Radiographie
JPH08206833A (ja) * 1995-02-03 1996-08-13 Nippon Steel Corp 溶接現象観察装置
CN1224836A (zh) * 1997-09-24 1999-08-04 三星电子株式会社 用于x射线检测系统的观象选择器
US6137860A (en) * 1998-08-18 2000-10-24 Lockheed Martin Corporation Digital radiographic weld inspection system
EP1148333A1 (de) * 2000-02-05 2001-10-24 YXLON International X-Ray GmbH Verfahren zur automatischen Gussfehlererkennung in einem Prüfling
JP2002318207A (ja) * 2001-04-24 2002-10-31 Shimadzu Corp 放射線検査装置
JP4322470B2 (ja) * 2002-05-09 2009-09-02 浜松ホトニクス株式会社 Ｘ線発生装置
JP2004319299A (ja) * 2003-04-17 2004-11-11 Matsusada Precision Inc 携帯ｘ線検査装置
KR101289502B1 (ko) * 2005-10-07 2013-07-24 하마마츠 포토닉스 가부시키가이샤 Ｘ선관 및 비파괴 검사 장치
CN200979533Y (zh) * 2006-12-06 2007-11-21 中国石化股份胜利油田分公司技术检测中心 管道焊缝全位置x射线探伤机架
CN101655467B (zh) * 2008-08-22 2012-02-01 中国特种设备检测研究院 一种承压设备环焊缝射线数字成像检测系统
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JP3172802U (ja) * 2011-10-14 2012-01-12 株式会社イシダ Ｘ線検査装置

Also Published As

Publication number Publication date
EP2674240A1 (de) 2013-12-18
JP2015526701A (ja) 2015-09-10
IN2014DN09459A (enExample) 2015-07-17
KR20150017351A (ko) 2015-02-16
EP2828031A1 (de) 2015-01-28
CN104487201A (zh) 2015-04-01
US20150158125A1 (en) 2015-06-11
WO2013186189A1 (de) 2013-12-19

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