JP5964064B2 - 基板保持装置、研磨装置、および研磨方法 - Google Patents

基板保持装置、研磨装置、および研磨方法 Download PDF

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Publication number
JP5964064B2
JP5964064B2 JP2012018538A JP2012018538A JP5964064B2 JP 5964064 B2 JP5964064 B2 JP 5964064B2 JP 2012018538 A JP2012018538 A JP 2012018538A JP 2012018538 A JP2012018538 A JP 2012018538A JP 5964064 B2 JP5964064 B2 JP 5964064B2
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retainer ring
ring
polishing
wafer
inner retainer
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JP2013157541A5 (https=
JP2013157541A (ja
Inventor
誠 福島
誠 福島
安田　穂積
穂積 安田
並木　計介
計介 並木
鍋谷　治
治 鍋谷
真吾 富樫
真吾 富樫
暁 山木
暁 山木
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Ebara Corp
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Ebara Corp
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Priority to JP2012018538A priority Critical patent/JP5964064B2/ja
Priority to TW107108374A priority patent/TWI674171B/zh
Priority to TW102100196A priority patent/TWI639485B/zh
Priority to US13/752,659 priority patent/US9662764B2/en
Priority to KR1020130010473A priority patent/KR101879462B1/ko
Publication of JP2013157541A publication Critical patent/JP2013157541A/ja
Publication of JP2013157541A5 publication Critical patent/JP2013157541A5/ja
Priority to JP2016022084A priority patent/JP6092439B2/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012018538A 2012-01-31 2012-01-31 基板保持装置、研磨装置、および研磨方法 Active JP5964064B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012018538A JP5964064B2 (ja) 2012-01-31 2012-01-31 基板保持装置、研磨装置、および研磨方法
TW107108374A TWI674171B (zh) 2012-01-31 2013-01-04 基板保持裝置、研磨裝置、及研磨方法
TW102100196A TWI639485B (zh) 2012-01-31 2013-01-04 基板保持裝置、研磨裝置、及研磨方法
US13/752,659 US9662764B2 (en) 2012-01-31 2013-01-29 Substrate holder, polishing apparatus, and polishing method
KR1020130010473A KR101879462B1 (ko) 2012-01-31 2013-01-30 기판 유지 장치, 연마 장치 및 연마 방법
JP2016022084A JP6092439B2 (ja) 2012-01-31 2016-02-08 基板保持装置、研磨装置、および研磨方法

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JP2012018538A JP5964064B2 (ja) 2012-01-31 2012-01-31 基板保持装置、研磨装置、および研磨方法

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JP2016022084A Division JP6092439B2 (ja) 2012-01-31 2016-02-08 基板保持装置、研磨装置、および研磨方法

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JP2013157541A JP2013157541A (ja) 2013-08-15
JP2013157541A5 JP2013157541A5 (https=) 2015-03-05
JP5964064B2 true JP5964064B2 (ja) 2016-08-03

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JP2016022084A Active JP6092439B2 (ja) 2012-01-31 2016-02-08 基板保持装置、研磨装置、および研磨方法

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6232297B2 (ja) * 2014-01-21 2017-11-15 株式会社荏原製作所 基板保持装置および研磨装置
SG10201606197XA (en) 2015-08-18 2017-03-30 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
JP6463303B2 (ja) * 2016-05-13 2019-01-30 株式会社荏原製作所 弾性膜、基板保持装置、基板研磨装置、基板保持装置における基板吸着判定方法および圧力制御方法
SG10202002713PA (en) * 2015-08-18 2020-05-28 Ebara Corp Substrate adsorption method, substrate holding apparatus, substrate polishing apparatus, elastic film, substrate adsorption determination method for substrate holding apparatus, and pressure control method for substrate holding apparatus
US10464185B2 (en) * 2016-03-15 2019-11-05 Ebara Corporation Substrate polishing method, top ring, and substrate polishing apparatus
JP6705362B2 (ja) * 2016-10-25 2020-06-03 信越半導体株式会社 研磨ヘッドおよび研磨装置
KR101841364B1 (ko) 2016-11-04 2018-03-22 주식회사 씨티에스 씨엠피 해드 및 이를 포함하는 씨엠피 장치
JP2018133393A (ja) 2017-02-14 2018-08-23 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法
JP7746049B2 (ja) * 2021-07-19 2025-09-30 株式会社荏原製作所 研磨装置のトップリング及び研磨装置
CN119077607B (zh) * 2024-09-26 2025-12-26 华海清科(上海)半导体有限公司 用于晶圆加工的承载头及化学机械抛光设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125767A (ja) * 1984-07-13 1986-02-04 Nec Corp 平面研摩装置の被加工物保持機構
JPS6125768A (ja) * 1984-07-13 1986-02-04 Nec Corp 平面研摩装置の被加工物保持機構
JPH06143126A (ja) * 1992-11-09 1994-05-24 Mitsubishi Materials Corp 研磨装置
JP3795198B2 (ja) * 1997-09-10 2006-07-12 株式会社荏原製作所 基板保持装置及び該基板保持装置を備えたポリッシング装置
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
JP4056205B2 (ja) * 1999-10-15 2008-03-05 株式会社荏原製作所 ポリッシング装置および方法
JP2002270556A (ja) * 2001-03-09 2002-09-20 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2003282505A (ja) * 2002-03-26 2003-10-03 Fujikoshi Mach Corp ウエーハの研磨装置
JP2008302464A (ja) * 2007-06-07 2008-12-18 Renesas Technology Corp 研磨装置およびそれを用いた半導体装置の製造方法
JP2008307674A (ja) * 2007-06-18 2008-12-25 Tokyo Seimitsu Co Ltd 分割加圧型リテーナリング
JP5199691B2 (ja) * 2008-02-13 2013-05-15 株式会社荏原製作所 研磨装置
US7749052B2 (en) * 2008-09-08 2010-07-06 Applied Materials, Inc. Carrier head using flexure restraints for retaining ring alignment
JP2011124302A (ja) * 2009-12-09 2011-06-23 Lapmaster Sft Corp 低重心エアバック式研磨ヘッド

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JP2016074088A (ja) 2016-05-12
JP6092439B2 (ja) 2017-03-08
JP2013157541A (ja) 2013-08-15

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