JP5951659B2 - 保護のために表面を処理する方法 - Google Patents
保護のために表面を処理する方法 Download PDFInfo
- Publication number
- JP5951659B2 JP5951659B2 JP2014024742A JP2014024742A JP5951659B2 JP 5951659 B2 JP5951659 B2 JP 5951659B2 JP 2014024742 A JP2014024742 A JP 2014024742A JP 2014024742 A JP2014024742 A JP 2014024742A JP 5951659 B2 JP5951659 B2 JP 5951659B2
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- tin
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- 229910052751 metal Inorganic materials 0.000 claims description 246
- 239000002184 metal Substances 0.000 claims description 245
- 239000010410 layer Substances 0.000 claims description 166
- 238000000034 method Methods 0.000 claims description 132
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- 229910052718 tin Inorganic materials 0.000 claims description 60
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- 238000006243 chemical reaction Methods 0.000 claims description 48
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- 238000003672 processing method Methods 0.000 claims description 44
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- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 238000005899 aromatization reaction Methods 0.000 description 1
- 150000001495 arsenic compounds Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical class CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 238000005255 carburizing Methods 0.000 description 1
- 238000004523 catalytic cracking Methods 0.000 description 1
- 238000004517 catalytic hydrocracking Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 231100001010 corrosive Toxicity 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 150000001934 cyclohexanes Chemical class 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- JQZRVMZHTADUSY-UHFFFAOYSA-L di(octanoyloxy)tin Chemical compound [Sn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O JQZRVMZHTADUSY-UHFFFAOYSA-L 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012013 faujasite Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003502 gasoline Substances 0.000 description 1
- 150000002291 germanium compounds Chemical class 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 150000002472 indium compounds Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910001502 inorganic halide Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 238000007431 microscopic evaluation Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- 229910052680 mordenite Inorganic materials 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical class [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006057 reforming reaction Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 229940065287 selenium compound Drugs 0.000 description 1
- 150000003343 selenium compounds Chemical class 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000000629 steam reforming Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 150000003498 tellurium compounds Chemical class 0.000 description 1
- TUNFSRHWOTWDNC-UHFFFAOYSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCCC(O)=O TUNFSRHWOTWDNC-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- QEEPNARXASYKDD-UHFFFAOYSA-J tris(7,7-dimethyloctanoyloxy)stannyl 7,7-dimethyloctanoate Chemical compound [Sn+4].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O QEEPNARXASYKDD-UHFFFAOYSA-J 0.000 description 1
- VSRBKQFNFZQRBM-UHFFFAOYSA-N tuaminoheptane Chemical compound CCCCCC(C)N VSRBKQFNFZQRBM-UHFFFAOYSA-N 0.000 description 1
- 229960003986 tuaminoheptane Drugs 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10G—CRACKING HYDROCARBON OILS; PRODUCTION OF LIQUID HYDROCARBON MIXTURES, e.g. BY DESTRUCTIVE HYDROGENATION, OLIGOMERISATION, POLYMERISATION; RECOVERY OF HYDROCARBON OILS FROM OIL-SHALE, OIL-SAND, OR GASES; REFINING MIXTURES MAINLY CONSISTING OF HYDROCARBONS; REFORMING OF NAPHTHA; MINERAL WAXES
- C10G35/00—Reforming naphtha
- C10G35/04—Catalytic reforming
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10G—CRACKING HYDROCARBON OILS; PRODUCTION OF LIQUID HYDROCARBON MIXTURES, e.g. BY DESTRUCTIVE HYDROGENATION, OLIGOMERISATION, POLYMERISATION; RECOVERY OF HYDROCARBON OILS FROM OIL-SHALE, OIL-SAND, OR GASES; REFINING MIXTURES MAINLY CONSISTING OF HYDROCARBONS; REFORMING OF NAPHTHA; MINERAL WAXES
- C10G75/00—Inhibiting corrosion or fouling in apparatus for treatment or conversion of hydrocarbon oils, in general
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/18—After-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Catalysts (AREA)
- Chemically Coating (AREA)
- Manufacture And Refinement Of Metals (AREA)
Description
本出願は、2005年6月2日に提出した米国仮特許出願第60/686792号による優先権を主張し、その全記載内容を本明細書の記載として援用する。
例1〜13で、一般的に約5cm四方未満の、347種類のステンレス鋼クーポンをある組成物で被覆してこれらのクーポン上にAMLを作った。この被膜組成は、約32重量%の錫金属(粒子サイズ1〜5μm)、約32重量%の錫酸化物(<0.044mm2)、約16重量%の錫オクタン酸塩、および残り無水イソプロピルアルコールを含んだ。幾つかの場合、このクーポンの未被覆部分へのMPLの移動を測定するために、このクーポンの半分を被覆した。表Iを参照して、この被膜を約75:25のモル比の水素:アルゴンの混合物の中で約40または約100時間の間、表示した温度および圧力で硬化した。このプロセス中、この錫含有AMLは、このクーポンの表面上に錫化合物を含むMPLを作った。できたMPLの検証は、このサンプルをエポキシ樹脂に取付け、続いて写真および走査電子顕微鏡による検査のためにグラインディングおよびポリシングして決めた。このクーポンの目視および顕微鏡検査が表Iの第9および10行に見られる特性の錫化合物層含有MPLの生成を確認した。
Claims (41)
- 錫を含む層を構造体の未組立て部品の基板に付与して前記基板上に被着金属層を作る工程および
前記被着金属層を前記構造体の組立て前に大気圧以下の圧力で還元環境で649℃を超える温度で硬化させることにより前記基板上に金属保護層を作る工程を含み、
前記基板が、ニッケルを含む、合金鋼、ステンレス鋼、又はオーステナイトステンレス鋼であり、
前記金属保護層が、前記基板から得られる鉄、ニッケル又はクロムを含み、
前記金属保護層と前記基板との間に、更にニッケル減損接合層を含む、基板の処理方法。 - 前記被着金属層を97kPa〜0.13Paの圧力で硬化する請求項1に記載された基板の処理方法。
- 前記被着金属層を649℃超〜760°Cの温度で硬化する請求項1または請求項2に記載された基板の処理方法。
- 前記被着金属層の厚さが25μm〜2.5mmである請求項1から請求項3までのいずれか1項に記載された基板の処理方法。
- 前記金属保護層の厚さが1μm〜150μmである請求項1から請求項4までのいずれか1項に記載された基板の処理方法。
- 更に、前記金属保護層をハロゲン含有化合物と接触させる工程を含み、その後に、前記ハロゲン含有化合物と前記金属保護層内または前記金属保護層上に存在する金属または金属化合物との反応により生じた金属または金属化合物を捕捉するプロセスが続く請求項1から請求項5までのいずれか1項に記載された基板の処理方法。
- 前記接合層が錫化合物を含む請求項1から請求項6までのいずれか1項に記載された基板の処理方法。
- 前記接合層の厚さが1〜100μmである請求項1から請求項7までのいずれか1項に記載された基板の処理方法。
- 前記接合層が1重量%〜20重量%の錫を含む請求項1から請求項6までのいずれか1項に記載された基板の処理方法。
- 前記構造体の未組立て部品が反応器系の未組立て部品である請求項1から請求項9までのいずれか1項に記載された基板の処理方法。
- 前記錫を含む層の前記被着、前記被着金属の前記硬化、またはその両方を前記構造体の最終組立現場以外の場所で行う請求項1から請求項10までのいずれか1項に記載された基板の処理方法。
- 前記未組立て部品を、前記錫を含む層を設ける前;前記被着金属層を硬化する前若しくは後;または更に前記金属保護層をハロゲン含有化合物と接触させ、その後に、前記ハロゲン含有化合物と前記金属保護層内または前記金属保護層上に存在する金属または金属化合物との反応により生じた金属または金属化合物を捕捉するプロセスが続く後に運ぶ請求項6に記載された基板の処理方法。
- 前記未組立て部品を、前記錫を含む層を設ける前に組立てた構造体から除去する請求項1から請求項12までのいずれか1項に記載された基板の処理方法。
- 前記未組立て部品が組立てた構造体用の修理または交換部品である請求項1から請求項13までのいずれか1項に記載された基板の処理方法。
- 前記錫を含む層を前記未組立て反応器系部品の前記基板に設ける前記工程が、前記錫を含む層を前記反応器系の既に組立てた類似部品に設ける方法であって他の点では同じ方法に比べて、反応器系休止時間を少ししか要しない請求項10に記載された基板の処理方法。
- 錫を含む層を構造体の未組立て部品の基板に付与して前記基板上に被着金属層を作る工程、および
前記被着金属層を第1温度および第1圧力で第1期間の間硬化する工程、並びに前記被着金属層を第2温度および第2圧力で第2期間の間硬化させることにより前記基板上に金属保護層を作る工程を含み、
前記基板が、ニッケルを含む、合金鋼、ステンレス鋼、又はオーステナイトステンレス鋼であり、
前記金属保護層が、前記基板から得られる鉄、ニッケル又はクロムを含み、
前記金属保護層と前記基板との間に、更にニッケル減損接合層を含む、基板の処理方法。 - 前記第1温度が316°C〜760°Cでありおよび前記第1圧力が1480kPa〜0.13Paである請求項16に記載された基板の処理方法。
- 前記第2温度が316°C〜760°Cでありおよび前記第2圧力が0.13Pa〜1480kPaである請求項16または請求項17に記載された基板の処理方法。
- 前記第1圧力、第2圧力または両方が大気圧以下である請求項16から請求項18までのいずれか1項に記載された基板の処理方法。
- 更に、前記金属保護層をハロゲン含有化合物と接触させる工程を含み、その後に、前記ハロゲン含有化合物と前記金属保護層内または前記金属保護層上に存在する金属または金属化合物との反応により生じた金属または金属化合物を捕捉するプロセスが続く請求項16から請求項19までのいずれか1項に記載された基板の処理方法。
- 前記基板が構造体の未組立て部品でありおよび前記未組立て部品を前記構造体に組込む前に前記被着金属層を硬化する請求項16から請求項20までのいずれか1項に記載された基板の処理方法。
- 前記接合層が錫化合物を含む請求項16から請求項21までのいずれか1項に記載された基板の処理方法。
- 前記接合層の厚さが1〜100μmである請求項16から請求項22までのいずれか1項に記載された基板の処理方法。
- 前記接合層が1重量%〜20重量%の錫を含む請求項16から請求項21までのいずれか1項に記載された基板の処理方法。
- 前記構造体の未組立て部品が反応器系の未組立て部品である請求項16から請求項24までのいずれか1項に記載された基板の処理方法。
- 前記錫を含む層の前記被着、前記被着金属の前記硬化、またはその両方を前記構造体の最終組立現場以外の場所で行う請求項16から請求項25までのいずれか1項に記載された基板の処理方法。
- 前記未組立て部品を、前記錫を含む層を設ける前;前記被着金属層を硬化する前若しくは後;または更に前記金属保護層をハロゲン含有化合物と接触させ、その後に、前記ハロゲン含有化合物と前記金属保護層内または前記金属保護層上に存在する金属または金属化合物との反応により生じた金属または金属化合物を捕捉するプロセスが続く後に運ぶ請求項20に記載された基板の処理方法。
- 前記未組立て部品を、前記錫を含む層を設ける前に組立てた構造体から除去する請求項16から請求項27までのいずれか1項に記載された基板の処理方法。
- 前記未組立て部品が組立てた構造体用の修理または交換部品である請求項16から請求項28までのいずれか1項に記載された基板の処理方法。
- 前記少なくとも一つの金属層を前記未組立て反応器系部品の前記基板に設ける前記工程が、前記少なくとも一つの金属層を前記反応器系の既に組立てた類似部品に設ける方法であって他の点では同じ方法に比べて、反応器系休止時間を少ししか要しない請求項25に記載された基板の処理方法。
- 少なくとも一つの金属を含む層を前記基板に付与して前記基板上に被着金属層を作る工程に続いて前記被着金属層を大気圧以下の圧力で649°Cを超える温度で硬化させることにより前記基板上に金属保護層を作る工程を含み、前記被着金属層が錫酸化物、水素分解性の錫化合物、および錫金属粉を含み、
前記基板が、ニッケルを含む、合金鋼、ステンレス鋼、又はオーステナイトステンレス鋼であり、
前記金属保護層が、前記基板から得られる鉄、ニッケル又はクロムを含み、
前記金属保護層と前記基板との間に、更にニッケル減損接合層を含む、基板の処理方法。 - 前記被着金属層を649°C〜760°Cの温度で硬化する請求項31に記載された基板の処理方法。
- 前記金属保護層が錫化合物を含む請求項31または請求項32に記載された基板の処理方法。
- 前記被着金属層の厚さが0.25μm〜100μmである請求項31から請求項33までのいずれか1項に記載された基板の処理方法。
- 更に、前記金属保護層をハロゲン含有化合物と接触させる工程を含み、その後に、前記ハロゲン含有化合物と前記金属保護層内または前記金属保護層上に存在する金属または金属化合物との反応により生じた金属または金属化合物を捕捉するプロセスが続く請求項31から請求項34までのいずれか1項に記載された基板の処理方法。
- 前記基板が構造体の未組立て部品でありおよび前記未組立て部品を前記構造体に組込む前に前記被着金属層を硬化する請求項31から請求項35までのいずれか1項に記載された基板の処理方法。
- 前記基板がニッケルを含み、前記金属保護層が、前記金属保護層と前記基板との間に、更にニッケル減損接合層を含む請求項31から請求項36までのいずれか1項に記載された基板の処理方法。
- 前記接合層が錫化合物を含む請求項37に記載された基板の処理方法。
- 前記接合層の厚さが1〜100μmである請求項37または請求項38に記載された基板の処理方法。
- 前記接合層が1重量%〜20重量%の錫を含む請求項37に記載された基板の処理方法。
- 供給原料を反応器に挿入する工程;前記供給原料を前記反応器の中で触媒があるところで反応させる工程を含み;前記反応器が請求項1から請求項40までのいずれか1項に記載された方法によって形成された金属保護層を含む石油化学製品の製造方法。
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