JP5932870B2 - 耐食性を向上させた薄膜メッキ方法 - Google Patents
耐食性を向上させた薄膜メッキ方法 Download PDFInfo
- Publication number
- JP5932870B2 JP5932870B2 JP2014069239A JP2014069239A JP5932870B2 JP 5932870 B2 JP5932870 B2 JP 5932870B2 JP 2014069239 A JP2014069239 A JP 2014069239A JP 2014069239 A JP2014069239 A JP 2014069239A JP 5932870 B2 JP5932870 B2 JP 5932870B2
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- Prior art keywords
- plating
- current
- corrosion resistance
- electroplating
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007747 plating Methods 0.000 title claims description 41
- 238000000034 method Methods 0.000 title claims description 14
- 238000005260 corrosion Methods 0.000 title claims description 6
- 230000007797 corrosion Effects 0.000 title claims description 6
- 239000010409 thin film Substances 0.000 title claims description 3
- 238000009713 electroplating Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000003792 electrolyte Substances 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims description 2
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
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- Electroplating Methods And Accessories (AREA)
Description
尚、上記反転電流波形は反転比率15:3のものであるが、この反転比率は種々に変更可能とする。
又、アルミニウム材の陽極酸化では、硫酸浴、しゅう酸浴、硫酸・しゅう酸混浴等で既に広く使用されている。
Claims (1)
- 金属素地を陰極として電解液に浸漬し、マイナス時間がプラス時間より長い高速反転電流により均一で緻密なメッキを形成する電気メッキと、直流電流によりレベリングがよいメッキを形成する電気メッキを交互に行う様にしたことを特徴とする耐食性を向上させた薄膜メッキ方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014069239A JP5932870B2 (ja) | 2014-03-28 | 2014-03-28 | 耐食性を向上させた薄膜メッキ方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014069239A JP5932870B2 (ja) | 2014-03-28 | 2014-03-28 | 耐食性を向上させた薄膜メッキ方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015190024A JP2015190024A (ja) | 2015-11-02 |
JP5932870B2 true JP5932870B2 (ja) | 2016-06-08 |
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Application Number | Title | Priority Date | Filing Date |
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JP2014069239A Expired - Fee Related JP5932870B2 (ja) | 2014-03-28 | 2014-03-28 | 耐食性を向上させた薄膜メッキ方法 |
Country Status (1)
Country | Link |
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JP (1) | JP5932870B2 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2764199B2 (ja) * | 1993-03-23 | 1998-06-11 | 千代田機器販売株式会社 | アルミニウムとアルミニウム合金へのメッキ方法及び電解液 |
JP2003268590A (ja) * | 2002-03-07 | 2003-09-25 | Applied Materials Inc | めっき方法、及び半導体装置の製造方法 |
CN1394988A (zh) * | 2002-08-20 | 2003-02-05 | 中国科学院电子学研究所 | 单槽法镀多层镍工艺 |
JP6161863B2 (ja) * | 2010-12-28 | 2017-07-12 | 株式会社荏原製作所 | 電気めっき方法 |
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2014
- 2014-03-28 JP JP2014069239A patent/JP5932870B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2015190024A (ja) | 2015-11-02 |
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