JP5927430B2 - 部品実装ライン - Google Patents
部品実装ライン Download PDFInfo
- Publication number
- JP5927430B2 JP5927430B2 JP2012182067A JP2012182067A JP5927430B2 JP 5927430 B2 JP5927430 B2 JP 5927430B2 JP 2012182067 A JP2012182067 A JP 2012182067A JP 2012182067 A JP2012182067 A JP 2012182067A JP 5927430 B2 JP5927430 B2 JP 5927430B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- mounting
- substrate
- inspection
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 124
- 238000007689 inspection Methods 0.000 claims description 100
- 229910000679 solder Inorganic materials 0.000 claims description 45
- 238000007639 printing Methods 0.000 claims description 27
- 230000002950 deficient Effects 0.000 claims description 17
- 230000007246 mechanism Effects 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 24
- 230000008569 process Effects 0.000 description 17
- 230000007723 transport mechanism Effects 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000008439 repair process Effects 0.000 description 6
- 230000032258 transport Effects 0.000 description 6
- 230000000007 visual effect Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012182067A JP5927430B2 (ja) | 2012-08-21 | 2012-08-21 | 部品実装ライン |
CN201310367563.XA CN103635075B (zh) | 2012-08-21 | 2013-08-21 | 元件安装生产线及元件安装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012182067A JP5927430B2 (ja) | 2012-08-21 | 2012-08-21 | 部品実装ライン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014041856A JP2014041856A (ja) | 2014-03-06 |
JP5927430B2 true JP5927430B2 (ja) | 2016-06-01 |
Family
ID=50215541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012182067A Expired - Fee Related JP5927430B2 (ja) | 2012-08-21 | 2012-08-21 | 部品実装ライン |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5927430B2 (zh) |
CN (1) | CN103635075B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5927431B2 (ja) * | 2012-08-21 | 2016-06-01 | パナソニックIpマネジメント株式会社 | 部品実装装置および部品実装方法 |
WO2020016991A1 (ja) * | 2018-07-19 | 2020-01-23 | 株式会社Fuji | 検査設定装置および検査設定方法 |
JP7261952B2 (ja) * | 2019-02-06 | 2023-04-21 | パナソニックIpマネジメント株式会社 | 部品実装システムおよび部品実装方法 |
JP7316072B2 (ja) * | 2019-03-22 | 2023-07-27 | Juki株式会社 | 生産システム、及び生産方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000243554A (ja) * | 1999-02-19 | 2000-09-08 | Tohoku Pioneer Corp | 発光ディスプレイパネルおよびその製造方法 |
JP4179060B2 (ja) * | 2003-06-09 | 2008-11-12 | 松下電器産業株式会社 | 電子部品実装システムおよび電子部品実装方法 |
CN2904602Y (zh) * | 2006-04-03 | 2007-05-23 | 环隆电气股份有限公司 | 电子产品的组装生产线 |
JP4858469B2 (ja) * | 2008-03-14 | 2012-01-18 | パナソニック株式会社 | 部品実装方法 |
JP5229177B2 (ja) * | 2009-10-08 | 2013-07-03 | パナソニック株式会社 | 部品実装システム |
JP5467550B2 (ja) * | 2010-10-26 | 2014-04-09 | パナソニック株式会社 | 部品実装システムおよび部品実装方法 |
CN101977484B (zh) * | 2010-11-23 | 2012-08-08 | 南京熊猫电子制造有限公司 | Pcb板手插件加工与贴片加工合成式生产线 |
JP5927431B2 (ja) * | 2012-08-21 | 2016-06-01 | パナソニックIpマネジメント株式会社 | 部品実装装置および部品実装方法 |
-
2012
- 2012-08-21 JP JP2012182067A patent/JP5927430B2/ja not_active Expired - Fee Related
-
2013
- 2013-08-21 CN CN201310367563.XA patent/CN103635075B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014041856A (ja) | 2014-03-06 |
CN103635075A (zh) | 2014-03-12 |
CN103635075B (zh) | 2017-09-08 |
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