JP5926021B2 - 半導体素子搬送ヘッド - Google Patents
半導体素子搬送ヘッド Download PDFInfo
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- JP5926021B2 JP5926021B2 JP2011209156A JP2011209156A JP5926021B2 JP 5926021 B2 JP5926021 B2 JP 5926021B2 JP 2011209156 A JP2011209156 A JP 2011209156A JP 2011209156 A JP2011209156 A JP 2011209156A JP 5926021 B2 JP5926021 B2 JP 5926021B2
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- 239000004065 semiconductor Substances 0.000 title claims description 47
- 239000012530 fluid Substances 0.000 claims description 14
- 230000035939 shock Effects 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Description
13…先端面、 14,19a…空気流通溝、
15,22…上側係止部、 16…下側係止部、
18…ボール、 20…半導体素子、
23…第2エアー通路、 H…移動空間。
Claims (1)
- 流体通路を介して吸引し、ヘッド先端に半導体素子を吸着する半導体素子搬送ヘッドにおいて、
上記流体通路内に上側係止部及び下側係止部を設けると共に、この上側係止部−下側係止部間を移動する移動体を配置し、吸引により上記上側係止部へ上昇させた上記移動体を、吸引の停止により上記下側係止部へ落下させることにより衝撃を発生させる衝撃発生機構と、
上記上側係止部の流体通路の壁に形成された流通溝、上記移動体を球に近い多面体とする構成、又は上記移動体の表面に凹凸を形成する構成からなり、上記移動体が上記上側係止部に係止されるときに流体の流れが途切れないようにする上側係止部流通路と、
上記ヘッド先端面に形成され、該先端面に半導体素子を吸着した状態で流体の流れを確保する先端面流通溝と、を設け、
吸引時に、上記上側係止部流通路及び先端面流通溝を介して流体の流れを確保しながら、上記移動体を上記上側係止部に留まらせると共に、半導体素子を上記ヘッド先端面に吸着し、
吸引停止時に、上記衝撃発生機構により上記移動体の落下の衝撃を上記ヘッド先端へ与えながら半導体素子を離脱させることを特徴とする半導体素子搬送ヘッド。
Priority Applications (1)
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JP2011209156A JP5926021B2 (ja) | 2011-09-26 | 2011-09-26 | 半導体素子搬送ヘッド |
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JP2011209156A JP5926021B2 (ja) | 2011-09-26 | 2011-09-26 | 半導体素子搬送ヘッド |
Publications (2)
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JP2013066988A JP2013066988A (ja) | 2013-04-18 |
JP5926021B2 true JP5926021B2 (ja) | 2016-05-25 |
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JP2011209156A Active JP5926021B2 (ja) | 2011-09-26 | 2011-09-26 | 半導体素子搬送ヘッド |
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JP (1) | JP5926021B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5804465B1 (ja) * | 2014-11-05 | 2015-11-04 | アキム株式会社 | 部品保持機構、搬送装置、搬送方法 |
JP5803034B1 (ja) * | 2014-11-05 | 2015-11-04 | アキム株式会社 | 搬送装置、搬送方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54152464U (ja) * | 1978-04-15 | 1979-10-23 | ||
JPH0731869Y2 (ja) * | 1989-11-13 | 1995-07-26 | 株式会社アマダメトレックス | 真空パット |
JPH06349868A (ja) * | 1993-06-11 | 1994-12-22 | Fuji Electric Co Ltd | 半導体素子吸着装置 |
JPH0885086A (ja) * | 1994-09-16 | 1996-04-02 | Nobuo Yoshida | 真空把持装置 |
JP2002313883A (ja) * | 2001-04-18 | 2002-10-25 | Anritsu Corp | 電子デバイス搬送装置 |
JP2007266331A (ja) * | 2006-03-29 | 2007-10-11 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
JP2009154217A (ja) * | 2007-12-25 | 2009-07-16 | Kyocera Corp | 真空吸着ノズル |
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- 2011-09-26 JP JP2011209156A patent/JP5926021B2/ja active Active
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